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    Semiconductor package with inner and outer leads
    4.
    发明授权
    Semiconductor package with inner and outer leads 有权
    具有内外引线的半导体封装

    公开(公告)号：US08853840B2

    公开(公告)日：2014-10-07

    申请号：US13773594

    申请日：2013-02-21

    申请人： Yin Kheng Au ,  Pey Fang Hiew ,  Jia Lin Yap

    发明人： Yin Kheng Au ,  Pey Fang Hiew ,  Jia Lin Yap

    IPC分类号： H01L23/49 ,  H01L23/495 ,  H01L21/56

    CPC分类号： H01L23/49555 ,  H01L21/4842 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49551 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48472 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： A semiconductor die has outer leads with an outer lead external connection section and an outer lead bonding section. Inner leads are spaced from the outer leads. Each of the inner leads has an inner lead external connection section spaced and downset from an inner lead bonding section. A non-electrically conductive die mount is molded onto upper surface areas of each inner lead external connection section. A semiconductor die is mounted on the non-electrically conductive die mount and bond wire provide interconnects for selectively electrically connecting bonding pads of the die to the inner lead bonding sections and at least one outer lead bonding section. A mold compound covers the semiconductor die, the bond wires, and the outer and inner lead bonding sections.

    摘要翻译： 半导体管芯具有外部引线，外部引线外部连接部分和外部引线接合部分。 内引线与外引线间隔开。 每个内引线具有从内部引线接合部分间隔开的内引线外部连接部分。 在每个内引线外部连接部分的上表面区域上模制非导电模座。 半导体管芯安装在非导电管芯安装件上，接合线提供用于将管芯的焊盘选择性地电连接到内引线接合部分和至少一个外引线接合部分的互连。 模具化合物覆盖半导体管芯，接合线以及外部和内部引线接合部分。

    SYSTEM AND METHOD FOR CLEANING BOND WIRE
    8.
    发明申请
    SYSTEM AND METHOD FOR CLEANING BOND WIRE 审中-公开
    用于清洁粘线的系统和方法

    公开(公告)号：US20140110461A1

    公开(公告)日：2014-04-24

    申请号：US13716193

    申请日：2012-12-16

    申请人： Mohd Rusli Ibrahim ,  Yin Kheng Au ,  Poh Leng Eu

    发明人： Mohd Rusli Ibrahim ,  Yin Kheng Au ,  Poh Leng Eu

    IPC分类号： H01L23/00 ,  B23K37/00

    CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/24 ,  B23K37/00 ,  B23K2101/42 ,  H01L24/78 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45664 ,  H01L2224/7801 ,  H01L2224/8501 ,  H01L2924/00014 ,  H01L2224/45157 ,  H01L2924/00015

    摘要： A system for cleaning bond wire for use by a wire bonding machine includes a bond wire supply station, a bond wire cleaning bath station, a bond wire neutralizing station, a bond wire drying station, and a wire bonding machine. In operation, the bonding machine is supplied with bond wire stored at the supply station, which is firstly de-oxidized with a cleaning solution in the cleaning bath station. Next, the cleaning solution on the bond wire is neutralized with a neutralizing liquid in the neutralizing station. The bond wire is then dried in the drying station. The speed of the bond wire passing through the cleaning bath station, neutralizing station and drying station is controlled by the wire bonding machine.

    摘要翻译： 一种用于清洁用于引线接合机使用的接合线的系统包括接合线供应站，接合线清洁浴站，接合线中和站，接合线干燥站和引线接合机。 在操作中，粘合机被供给存储在供应站的接合线，首先在清洗浴台用清洁溶液去氧化。 接着，在中和站中用中和液中和接合线上的清洗液中和。 然后将粘合线在干燥站中干燥。 通过清洗浴站，中和站和干燥站的接合线的速度由引线接合机控制。

    LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH
    9.
    发明申请
    LEAD FRAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREWITH 审中-公开
    引导框架和制造的半导体封装

    公开(公告)号：US20110204498A1

    公开(公告)日：2011-08-25

    申请号：US12712159

    申请日：2010-02-24

    申请人： Yin Kheng Au ,  Mohd Rusli Ibrahim ,  Meng Kong Lye ,  Zi Song Poh ,  Seng Kiong Teng ,  Kesyakumar V.C. Muniandy

    发明人： Yin Kheng Au ,  Mohd Rusli Ibrahim ,  Meng Kong Lye ,  Zi Song Poh ,  Seng Kiong Teng ,  Kesyakumar V.C. Muniandy

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A lead frame for a semiconductor package has a flag to which a semiconductor die is mounted. Tie bars are coupled to the flag. There is a first set of leads and each first set lead in the first set of leads has a first set lead parallel length and a first set lead tapered length. The first set lead parallel length of each first set lead has a constant width and edges that are parallel to edges of all other first set lead parallel lengths. A free end region of the first set lead tapered length of each first set lead provides a first set lead bond target region. There is a second set of leads disposed between a first one of the tie bars and the first set of leads. Each second set lead, in the second set of leads, has a second set lead parallel length and a second set lead tapered length. The second set lead parallel length of each second set lead has a constant width and edges that are parallel to edges of all other second set lead parallel lengths in the second set of leads and also parallel to the edges of first set lead parallel lengths. At least one second set lead has an extension length extending inwardly from the second set lead tapered length, the extension length has a constant width and provides a second set lead bond target region. Wire bond leads electrically couple both the first set lead bond target region and second set lead bond target region to respective die external electrical connection pads on a surface of the die and a package body encloses the die.

    摘要翻译： 半导体封装的引线框架具有安装有半导体管芯的标志。 领带条与标志相连。 存在第一组引线，并且第一组引线中的每个第一组引线具有第一组引线平行长度和第一组引线锥形长度。 每个第一组引线的第一组引线平行长度具有恒定的宽度，并且与所有其它第一组引线平行长度的边缘平行的边缘。 每个第一集合引线的第一组引线锥形长度的自由端区域提供第一组引线键合目标区域。 存在设置在第一组连杆和第一组引线之间的第二组引线。 在第二组引线中的每个第二设定引线具有第二设定引线平行长度和第二设定引线锥形长度。 每个第二组引线的第二组引线平行长度具有恒定的宽度，并且边缘平行于第二组引线中的所有其它第二设定引线平行长度的边缘，并且平行于第一组引线平行长度的边缘。 至少一个第二固定引线具有从第二组引线锥形长度向内延伸的延伸长度，延伸长度具有恒定的宽度并且提供第二组引线键合目标区域。 引线接合引线将第一组引线接合目标区域和第二组引线接合目标区域电耦合到管芯表面上的相应管芯外部电连接焊盘，并且封装主体封装管芯。

    BONDED WIRE SEMICONDUCTOR DEVICE
    10.
    发明申请
    BONDED WIRE SEMICONDUCTOR DEVICE 有权
    双绞线半导体器件

    公开(公告)号：US20130032932A1

    公开(公告)日：2013-02-07

    申请号：US13195042

    申请日：2011-08-01

    申请人： Li Ting Celina ONG ,  Yin Kheng Au ,  Zi-Song Poh

    发明人： Li Ting Celina ONG ,  Yin Kheng Au ,  Zi-Song Poh

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49541 ,  H01L23/4952 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49173 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： A bonded wire semiconductor device includes a sub-assembly including a semiconductor die having an active face with a set of internal electrical contact elements and an externally exposed set of electrical contact elements. A set of bond wires make respective electrical connections between the internal electrical contact elements and the externally exposed set of electrical contact elements. A molding compound encapsulates the semiconductor die with the active face embedded in the molding compound. The bond wires have the same length. The bond wires are bonded to the internal electrical contact elements and to the externally exposed electrical contact elements at first and second curved arrays and of bond positions respectively. The first and second curved arrays and of bond positions have corresponding concentric shapes.

    摘要翻译： 接合线半导体器件包括具有半导体管芯的子组件，该半导体管芯具有具有一组内部电接触元件的主动面和外部暴露的一组电接触元件。 一组接合线在内部电接触元件和外部暴露的电接触元件组之间形成相应的电连接。 模塑料封装半导体模具，嵌入模塑料中的活性面。 接合线具有相同的长度。 接合线分别在第一和第二弯曲阵列和接合位置处结合到内部电接触元件和外部暴露的电接触元件。 第一和第二弯曲阵列和接合位置具有相应的同心形状。