Method of manufacturing high voltage schottky diamond diodes with low boron doping
    3.
    发明授权
    Method of manufacturing high voltage schottky diamond diodes with low boron doping 失效
    制造具有低硼掺杂的高电压肖特基金刚石二极管的方法

    公开(公告)号:US06833027B2

    公开(公告)日:2004-12-21

    申请号:US10254809

    申请日:2002-09-26

    IPC分类号: C30B2904

    摘要: A method of making a Schottky diode comprising the steps of: providing a single crystal diamond comprising a surface; placing the single crystal diamond in a CVD system; heating the diamond to a temperature of at least about 950° C.; providing a gas mixture capable of growing diamond film and comprising a sulfur compound through the CVD system; growing an epitaxial diamond film on the surface of the single crystal diamond; baking the diamond at a temperature of at least about 650° C. in air for a period of time that minimizes oxidation of the diamond; and fabricating a Schottky diode comprising the diamond film. A Schottky diode comprising an epitaxial diamond film and capable of blocking at least about 6 kV in a distance of no more than about 300 &mgr;m.

    摘要翻译: 一种制造肖特基二极管的方法,包括以下步骤:提供包含表面的单晶金刚石; 将单晶金刚石置于CVD系统中; 将金刚石加热至至少约950℃的温度; 提供能够生长金刚石膜并通过CVD系统包含硫化合物的气体混合物; 在单晶金刚石的表面生长外延金刚石膜; 在至少约650℃的温度下在空气中烘烤金刚石使其最小化金刚石氧化的时间; 以及制造包含金刚石膜的肖特基二极管。 肖特基二极管包括外延金刚石膜,并且能够在不超过约300μm的距离内阻挡至少约6kV。

    Method of manufacturing high voltage schottky diamond diodes with low boron doping
    4.
    发明申请
    Method of manufacturing high voltage schottky diamond diodes with low boron doping 失效
    制造具有低硼掺杂的高电压肖特基金刚石二极管的方法

    公开(公告)号:US20030075100A1

    公开(公告)日:2003-04-24

    申请号:US10254809

    申请日:2002-09-26

    摘要: A method of making a Schottky diode comprising the steps of: providing a single crystal diamond comprising a surface; placing the single crystal diamond in a CVD system; heating the diamond to a temperature of at least about 950null C.; providing a gas mixture capable of growing diamond film and comprising a sulfur compound through the CVD system; growing an epitaxial diamond film on the surface of the single crystal diamond; baking the diamond at a temperature of at least about 650null C. in air for a period of time that minimizes oxidation of the diamond; and fabricating a Schottky diode comprising the diamond film. A Schottky diode comprising an epitaxial diamond film and capable of blocking at least about 6 kV in a distance of no more than about 300 nullm.

    摘要翻译: 一种制造肖特基二极管的方法,包括以下步骤:提供包含表面的单晶金刚石; 将单晶金刚石置于CVD系统中; 将金刚石加热至至少约950℃的温度; 提供能够生长金刚石膜并通过CVD系统包含硫化合物的气体混合物; 在单晶金刚石的表面生长外延金刚石膜; 在至少约650℃的温度下在空气中烘烤金刚石使其最小化金刚石氧化的时间; 以及制造包含金刚石膜的肖特基二极管。 肖特基二极管包括外延金刚石膜,并且能够在不超过约300μm的距离内阻挡至少约6kV。

    MOLYBDENUM TRIOXIDE-COATED HYDROGEN-TERMINATED DIAMOND SURFACE AND USES THEREOF
    6.
    发明申请
    MOLYBDENUM TRIOXIDE-COATED HYDROGEN-TERMINATED DIAMOND SURFACE AND USES THEREOF 有权
    三氧化钼涂层氢化终止金刚石表面及其用途

    公开(公告)号:US20140319542A1

    公开(公告)日:2014-10-30

    申请号:US14261364

    申请日:2014-04-24

    IPC分类号: H01L29/16 H01L21/02 H01B1/04

    摘要: The present invention provides a conducting material comprising a carbon-based material selected from a diamond or an insulating diamond-like carbon, having a hydrogen-terminated surface and a layer of MoO3 coating said surface; as well as a method for the fabrication of such a material. The conducting material of the invention is useful in the fabrication of electronic components, electrodes, sensors, diodes, field effect transistors, and field emission electron sources.

    摘要翻译: 本发明提供一种导电材料,其包含选自金刚石或绝缘类金刚石碳的碳基材料,具有氢封端表面和所述表面上的MoO 3层; 以及制造这种材料的方法。 本发明的导电材料可用于制造电子部件,电极,传感器,二极管,场效应晶体管和场发射电子源。

    SCHOTTKY ELECTRODE FOR DIAMOND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    SCHOTTKY ELECTRODE FOR DIAMOND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    肖特基电极用于金刚石半导体器件及其制造方法

    公开(公告)号:US20100117098A1

    公开(公告)日:2010-05-13

    申请号:US12597578

    申请日:2008-04-14

    IPC分类号: H01L29/47 H01L29/12 H01L21/04

    摘要: To provide a Schottky electrode in a diamond semiconductor, which has a good adhesion properties to diamonds, has a contacting surface which does not become peeled due to an irregularity in an external mechanical pressure, does not cause a reduction in yield in a diode forming process and does not cause deterioration in current-voltage characteristics, and a method of manufacturing the Schottky electrode.A Schottky electrode which includes: scattered island-form pattern Pt-group alloy thin films which are formed on a diamond surface formed on a substrate, in which the Pt-group alloy includes 50 to 99.9 mass % of Pt and 0.1 to 50 mass % of Ru and/or Ir, or which includes electrodes in a scattered island pattern, including: scattered island-form pattern metal thin films which are formed on a diamond surface formed on a substrate and include one selected from Pt and Pd; and metal thin films which include one selected from Ru, Ir and Rh and are provided on all of the metal thin films which include one selected from Pt and Pd, and a method of manufacturing the Schottky electrode.

    摘要翻译: 为了在金刚石半导体中提供肖特基电极,该金刚石半导体具有良好的金刚石粘合性,具有由于外部机械压力不均匀而不会剥离的接触表面,在二极管形成过程中不会导致产率降低 并且不会导致电流 - 电压特性的劣化,以及制造肖特基电极的方法。 一种肖特基电极,其包括:形成在形成于基板上的金刚石表面上的散射岛状图案Pt族合金薄膜,其中Pt族合金包含Pt为50〜99.9质量%,0.1〜50质量% 包括:散射岛状图案金属薄膜,其形成在形成于基板上的金刚石表面上,并且包括选自Pt和Pd中的一种; 以及包括选自Ru,Ir和Rh中的一种并且设置在包括选自Pt和Pd中的一种的所有金属薄膜上的金属薄膜和制造肖特基电极的方法。

    Process for manufacturing a schottky contact on a semiconductor substrate
    8.
    发明申请
    Process for manufacturing a schottky contact on a semiconductor substrate 审中-公开
    在半导体衬底上制造肖特基接触的工艺

    公开(公告)号:US20060183267A1

    公开(公告)日:2006-08-17

    申请号:US11236304

    申请日:2005-09-27

    IPC分类号: H01L21/00

    CPC分类号: H01L21/0435 H01L21/0415

    摘要: A process realizes a Schottky contact on an epitaxial layer of a semiconductor substrate. The process includes depositing a conductive metallic layer on a surface of the epitaxial layer, with achievement of a interface region of conductive metallic layer/semiconductor. The process further comprises a ionic irradiation step directed towards the surface of the epitaxial layer for forming a modified intermediate layer of at least one surface portion of the epitaxial layer for making the electric behavior of the interface region substantially dependant on the contact between the conductive metallic layer and the obtained modified intermediate layer.

    摘要翻译: 一种工艺在半导体衬底的外延层上实现肖特基接触。 该方法包括在外延层的表面上沉积导电金属层,实现导电金属层/半导体的界面区域。 该方法还包括指向外延层的表面的离子照射步骤,用于形成外延层的至少一个表面部分的改性中间层,以使界面区域的电性能基本上取决于导电金属 层和得到的改性中间层。