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公开(公告)号：US11959183B2
公开(公告)日：2024-04-16
申请号：US17061165
申请日：2020-10-01
发明人： Juergen Biener , Sneha Akhade , Monika Biener , Zhen Qi , Joel Varley , Stephen Weitzner , Vedasri Vedharathinam
IPC分类号： C25B11/081 , B05D1/02 , C22C9/01 , C22C9/02 , C22C9/04 , C23C14/14 , C23C14/30 , C23C14/35 , C25B1/00 , C25D3/58
CPC分类号： C25B11/081 , B05D1/02 , C22C9/01 , C22C9/02 , C22C9/04 , C23C14/14 , C23C14/30 , C23C14/35 , C25B1/00 , C25D3/58
摘要： A product includes a dilute alloy catalyst for carbon dioxide reduction. The catalyst has a majority component and at least one minority component. The majority component is present in a concentration of greater than 90 atomic percent of the catalyst. The majority component is copper, and each minority component is selected from the group consisting of: a transition metal, a main group metal, a lanthanide, and a semimetal. A method includes forming a product on a cathode. The product includes a dilute alloy catalyst for carbon dioxide reduction. The catalyst has a majority component and at least one minority component. The majority component is present in a concentration of greater than 90 atomic percent of the catalyst. The majority component is copper, and each minority component is selected from the group consisting of: a transition metal, a main group metal, a lanthanide, and a semimetal.
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公开(公告)号：US11749560B2
公开(公告)日：2023-09-05
申请号：US16141522
申请日：2018-09-25
申请人： INTEL CORPORATION
发明人： Thomas Marieb , Zhiyong Ma , Miriam R. Reshotko , Christopher Jezewski , Flavio Griggio , Rahim Kasim , Nikholas G. Toledo
IPC分类号： H01L21/768 , H01L23/532 , C25D3/58 , C23C18/48
CPC分类号： H01L21/76802 , C23C18/48 , C25D3/58 , H01L21/76849 , H01L21/76852 , H01L23/53223 , H01L23/53238
摘要： Techniques are disclosed for providing cladded metal interconnects. Given an interconnect trench, a barrier layer is conformally deposited onto the bottom and sidewalls of the trench. A first layer of a bilayer adhesion liner is selectively deposited on the barrier layer, and a second layer of the bilayer adhesion liner is selectively deposited on the first layer. An interconnect metal is deposited into the trench above the bilayer adhesion liner. Any excess interconnect metal is recessed to get the top surface of the interconnect metal to a proper plane. Recessing the excess interconnect metal may include recessing previously deposited excess adhesion liner and barrier layer materials. The exposed top surface of the interconnect metal in the trench is then capped with the bilayer adhesion liner materials to provide a cladded metal interconnect core. In some embodiments, the adhesion liner is a single layer adhesion liner.
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公开(公告)号：US11352707B2
公开(公告)日：2022-06-07
申请号：US15999169
申请日：2018-08-17
发明人： Seung Min Kim , An Na Lee , Ho Gun Kim , Shan Hua Jin
IPC分类号： C25D1/04 , C25D3/38 , H05K1/09 , H01M4/66 , C25D7/06 , C25D3/58 , C25D5/00 , H05K1/03 , H05K3/02 , H01M10/0525
摘要： Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1: PAR=Rp/Ra [Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.
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公开(公告)号：US11293111B2
公开(公告)日：2022-04-05
申请号：US15571118
申请日：2016-06-13
发明人： Steven Y. Yu , Gene B. Nesmith , Larry S. Hebert
摘要： An electroplated article is provided comprising a polymeric substrate bearing an electroplated metal layer comprising copper and tin in an atomic ratio of less than 96:4, in some embodiments less than 87:13 and in some embodiments less than 82:18; wherein the atomic ratio of copper to tin is greater than 55:45, and wherein the electroplated metal layer comprises at least 3.5 weight % tin. The electroplated metal layer comprises an alloy having a melting point of less than 1050° C. and in some cases less than 800° C. The electroplated metal layer has a Young's Modulus of less than 15.0 GPa, in some embodiments less than 13.0 GPa, and in some less than 10.0 GPa. In addition, an electroplating solution is provided comprising Cu(II) ions, Sn (II) ions, Zn(II) ions, 1-methionine, and no cyanide anion.
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公开(公告)号：US20210147989A1
公开(公告)日：2021-05-20
申请号：US17061165
申请日：2020-10-01
发明人： Juergen Biener , Sneha Akhade , Monika Biener , Zhen Qi , Joel Varley , Stephen Weitzner , Vedasri Vedharathinam
IPC分类号： C25B11/04 , C23C14/35 , C23C14/30 , C25D3/58 , B05D1/02 , C23C14/14 , C25B1/00 , C22C9/01 , C22C9/04 , C22C9/02
摘要： A product includes a dilute alloy catalyst for carbon dioxide reduction. The catalyst has a majority component and at least one minority component. The majority component is present in a concentration of greater than 90 atomic percent of the catalyst. The majority component is copper, and each minority component is selected from the group consisting of: a transition metal, a main group metal, a lanthanide, and a semimetal. A method includes forming a product on a cathode. The product includes a dilute alloy catalyst for carbon dioxide reduction. The catalyst has a majority component and at least one minority component. The majority component is present in a concentration of greater than 90 atomic percent of the catalyst. The majority component is copper, and each minority component is selected from the group consisting of: a transition metal, a main group metal, a lanthanide, and a semimetal.
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公开(公告)号：US10925171B2
公开(公告)日：2021-02-16
申请号：US15936600
申请日：2018-03-27
发明人： Yuki Ori , Hideta Arai , Atsushi Miki , Ryo Fukuchi
IPC分类号： B32B15/04 , H05K3/38 , H05K3/46 , H05K1/02 , B32B15/20 , B32B27/38 , C25D7/06 , C23C18/16 , C25D5/48 , C25D7/00 , C25D1/04 , B32B15/08 , B32B15/09 , B32B15/088 , H05K3/20 , C25D3/38 , C25D5/02 , C25D3/58
摘要： The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer on the surface of the copper foil is suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is suppressed. The surface of the roughening treatment layer satisfies one or more of the following: a roughness Ra is 0.08 to 0.20 μm, a roughness Rz is 1.00 to 2.00 μm, a roughness Sq is 0.16 to 0.30 μm, a roughness Ssk is −0.6 to −0.35, a roughness Sa is 0.12 to 0.23 μm, a roughness Sz is 2.20 to 3.50 μm, a roughness Sku is 3.75 to 4.50, and a roughness Spk is 0.13 to 0.27 μm, a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.
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公开(公告)号：US20200340132A1
公开(公告)日：2020-10-29
申请号：US16961940
申请日：2018-12-14
发明人： Angela LLAVONA-SERRANO , Timo BANGERTER , Olivier MANN , Pamela CEBULLA , Stefanie ACKERMANN , Heiko BRUNNER , Kinga HAUBNER , Bernd FROESE
摘要： The present invention concerns a metal or metal alloy deposition composition, particularly a copper or copper alloy deposition composition, for electrolytic deposition of a metal or metal alloy layer, particularly for electrolytic deposition of a copper or copper alloy layer, comprising at least one type of metal ions to be deposited, preferably copper ions, and at least one imidazole based plating compound. The present invention further concerns a method for preparation of the plating compound, the plating compound itself and its use in a metal or metal alloy deposition composition. The inventive metal or metal alloy deposition composition can be preferably used for filling recessed structures, in particular those having higher diameter to depth aspect ratios.
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公开(公告)号：US10811689B2
公开(公告)日：2020-10-20
申请号：US15696360
申请日：2017-09-06
申请人： LS Mtron Ltd.
发明人： Seung Min Kim
IPC分类号： H01M4/66 , H01M4/68 , H01M4/13 , H01M4/58 , H01M4/00 , C25D1/20 , C25D1/04 , C25D3/38 , C25D7/00 , H01M4/04 , H01M4/133 , H01M4/1395 , H01M10/0525 , H01M10/052 , C25D3/58
摘要： An easily handleable electrolytic copper foil securing a highly durable secondary battery, an electrode including same, a secondary battery including same, and a method of manufacturing same. The electrolytic copper foil including first and second surfaces includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, a first protective layer formed on the matte surface of the copper layer, and a second protective layer formed on the shiny surface of the copper layer. A coefficient of thermal expansion of the electrolyte copper foil measured using thermomechanical analyzer while heating the electrolytic copper foil from 30 to 190° C. at 5° C./min ranges from 16 to 22 μm/(m·° C.), tensile strength of the electrolytic copper foil measured after heat treatment at 190° C., ranges from 21 to 36 kgf/mm2, and weight deviation of the electrolytic copper foil is 5% or less.
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9.发明授权公开(公告)号：US10738388B2
公开(公告)日：2020-08-11
申请号：US15752606
申请日：2015-10-08
发明人： Weijing Lu , Lingli Duan , Zukhra Niazimbetova , Chen Chen , Maria Rzeznik
摘要： Copper electroplating baths include reaction products of amines and polyacrylamides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
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10.发明授权公开(公告)号：US10662541B2
公开(公告)日：2020-05-26
申请号：US15752617
申请日：2015-10-08
发明人： Weijing Lu , Lingli Duan , Zukhra Niazimbetova , Chen Chen , Maria Rzeznik
摘要： Copper electroplating baths include reaction products of amines, polyacrylamides and bisepoxides. The reaction products function as levelers and enable copper electroplating baths which have high throwing power and provide copper deposits with reduced nodules.
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