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公开(公告)号：US12126322B2
公开(公告)日：2024-10-22
申请号：US18315211
申请日：2023-05-10
发明人： Jian Wang
CPC分类号： H03H9/1042 , H03H3/02 , H03H9/0523
摘要： A method for packaging chips includes: flip-chip bonding a plurality of filter chips to be packaged on a substrate to be packaged; applying a first mold material layer on the filter chips to be packaged; applying a second mold material layer on a side of the first mold material layer away from the filter chip to be packaged, the first mold material layer and the second mold material layer forming a first mold layer; thinning the first mold material layer and the second mold material layer to expose substrates of the filter chips to be packaged, and thinning the substrates of the filter chips to be packaged to a preset thickness; applying a second mold layer on the exposed substrates of the filter chips to be packaged to obtain a mold structure; and cutting the mold structure into a plurality of particle chips.
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公开(公告)号：US12126318B2
公开(公告)日：2024-10-22
申请号：US17533184
申请日：2021-11-23
发明人： Sean McHugh
CPC分类号： H03H9/02228 , H03H3/02 , H03H9/02015 , H03H9/02157 , H03H9/205 , H03H9/568
摘要： Filter devices and methods of fabrication are disclosed. An acoustic filter device includes a substrate and a piezoelectric plate, a first portion of the piezoelectric plate spanning a first cavity in the substrate and a second portion of the piezoelectric plate spanning a second cavity in the substrate. A decoupling dielectric layer on a front surface of the first and second portions of the piezoelectric plate has a first thickness td1 on the first portion and a second thickness td2, greater than the first thickness, on the second portion. Interleaved fingers of a first interdigital transducer (IDT) are on the decoupling dielectric layer over the first portion of the piezoelectric plate, and interleaved fingers of a second IDT are on the decoupling dielectric layer over the second portion of the piezoelectric plate.
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公开(公告)号：US12113510B2
公开(公告)日：2024-10-08
申请号：US17339841
申请日：2021-06-04
发明人： Andrew Kay , Patrick Turner , Albert Cardona
CPC分类号： H03H9/54 , H03H3/02 , H03H9/02015 , H03H9/02157 , H03H9/02228 , H03H9/13 , H03H9/174 , H03H9/205 , H03H9/564 , H03H9/568 , H03H2003/023 , Y10T29/42
摘要： An acoustic resonator is fabricated with multiple piezoelectric plate thicknesses on a single chip. After conductor patterns are formed on a piezoelectric plate, the plate is bonded to a sacrificial substrate, with the conductor patterns facing the sacrificial substrate. The piezoelectric plate is then thinned to a desired thickness for shunt resonators. A mask is applied to the surface of the plate and selected areas of the piezoelectric plate are further thinned to a desired thickness for series resonators to form a thinned piezoelectric plate. A substrate with swimming pool cavities is bonded to the thinned piezoelectric plate, and the sacrificial substrate is removed.
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公开(公告)号：US12113502B2
公开(公告)日：2024-10-08
申请号：US17229065
申请日：2021-04-13
发明人： Masaya Kanno , Shigeru Shiraishi , Atsushi Matsuo
CPC分类号： H03H3/013 , H03H3/02 , H03H2003/022 , H03H2003/023 , H03H2003/027 , H03H9/02102 , H03H9/0547 , H03H9/1021 , H03H9/19
摘要： A method of manufacturing a quartz crystal element includes preparing a quartz crystal wafer having a predetermined cutting angle with respect to a crystal axis of a quartz crystal, forming a first resist film having a first tilted part on a first surface of the quartz crystal wafer and dry-etching the first resist film with the quartz crystal, forming a first tilted surface by dry-etching the quartz crystal wafer from the first surface side, forming a second resist film having a second tilted part on a second surface of the quartz crystal wafer and dry-etching the second resist film with the quartz crystal, and forming a second tilted surface tilted by dry-etching the quartz crystal wafer from the second surface side. The quartz crystal element provided with the first tilted surface and the second tilted surface, and having a cutting angle different from the predetermined cutting angle is formed.
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公开(公告)号：US12107561B2
公开(公告)日：2024-10-01
申请号：US17397650
申请日：2021-08-09
发明人： Shigeo Ojima
CPC分类号： H03H9/1035 , H03H3/02 , H03H9/19 , H03H2003/022
摘要： A method for manufacturing a vibrator that includes forming excitation electrodes, lead-out electrodes, and first sealing frames on the main surfaces of a crystal piece; forming second sealing frames on the main surfaces of a base part and a lid part; and sealing a crystal vibration element by bonding the first sealing frames to the second sealing frames. The first sealing frames each include a first Ti or Cr base layer 110, and a first Au surface layer. The first Ti or Cr base layers are thinner than the first Au surface layers. The second sealing frames each include a second Ni base layer, and a second AuSn surface layer. The second Ni base layers are thicker than the second AuSn surface layers. The sealing is carried out by alloying the first Au surface layers and the second AuSn surface layers to each other.
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6.发明公开公开(公告)号：US20240322783A1
公开(公告)日：2024-09-26
申请号：US18578726
申请日：2022-07-13
CPC分类号： H03H9/02086 , H03H3/02 , H03H9/13 , H03H9/173
摘要： A bulk acoustic wave resonator device of the present invention comprises: a cavity; a first electrode layer, at least one end of the first electrode layer being located above or inside the cavity; a piezoelectric layer, the cavity and the first electrode layer being located on a first side of the piezoelectric layer; a second electrode layer located on a second side, a region where the first electrode layer, the second electrode layer and the piezoelectric layer overlap being a resonance region; a first passive structure located on the first side and having a first overlapping portion with at least one edge of the first electrode layer; and a second passive structure located on the second side and having a second overlapping portion with at least one edge of the second electrode layer. The first passive structure comprises: a first raised portion located inside the resonance region; and a first extension portion located outside the resonance region, wherein the first raised portion protrudes with respect to the first extension portion. The second passive structure comprises: a second raised portion located inside the resonance region; and a second extension portion located outside the resonance region, wherein the second raised portion protrudes with respect to the second extension portion. The present invention suppresses parasitic edge mode, and improves ZP and corresponding Q value.
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公开(公告)号：US12101075B2
公开(公告)日：2024-09-24
申请号：US17238211
申请日：2021-04-23
CPC分类号： H03H9/02023 , H03H3/02 , H03H9/0509 , H03H9/1021 , H03H9/19 , H10N30/082 , H03H2003/022
摘要： A piezoelectric device includes a conductive adhesive, a container, and an AT-cut crystal element. The AT-cut crystal element has at least one side surface intersecting with a Z′-axis of the crystallographic axis of the crystal constituted of three surfaces. When a dimension of a straight-line portion along the Z′-axis of a second side opposed to the first side is expressed as W1 and a dimension along the Z′-axis of the AT-cut crystal element is expressed as W0, W1/W0 is 0.91 or greater, and the straight-line portion has both sides constituting corner portions in approximately right angles with sides along an X-axis of the crystal of the AT-cut crystal element. The side of the first side is at a −X-side in an X-axis of the crystallographic axis of the crystal and a side of the second side is at a +X-side in the X-axis.
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公开(公告)号：US20240305259A1
公开(公告)日：2024-09-12
申请号：US18667474
申请日：2024-05-17
发明人： Patrick TURNER , Ryo Wakabayashi
CPC分类号： H03H3/02 , H03H9/02015 , H03H9/02228 , H03H9/205
摘要： A bulk acoustic resonator is provided that includes a substrate having a plurality of layers and having a cavity disposed in at least one of the plurality of layers of the substrate; a piezoelectric layer attached to the substrate and including a portion that is over the cavity in the substrate; and an interdigital transducer (IDT) on a surface of the piezoelectric layer and including interleaved fingers on the portion of the piezoelectric layer that is over the cavity. Moreover, at least one opening extends through the portion of the piezoelectric layer that is over the cavity. The at least one opening is an elongated slot.
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公开(公告)号：US20240283428A1
公开(公告)日：2024-08-22
申请号：US18444030
申请日：2024-02-16
发明人： Andrew Guyette , Pintu Adhikari , Santhosh Gottuparthy , Wei Yang
CPC分类号： H03H9/542 , H03H3/02 , H03H9/02228 , H03H9/173 , H03H9/564 , H03H9/566 , H03H2003/021
摘要： A filter is provided that includes resonators connected in series between first and second ports. Each of the resonators includes a piezoelectric layer; and an interdigital transducer (IDT) having a plurality of interleaved fingers at a surface of the piezoelectric layer. The piezoelectric layer and the IDT are configured such that a radio frequency signal applied to the IDT excites a primary shear acoustic mode in the piezoelectric layer. The filter includes a capacitor connected between ground and a node between the first bulk acoustic resonator and the second bulk acoustic resonator.
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公开(公告)号：US12068739B2
公开(公告)日：2024-08-20
申请号：US17404121
申请日：2021-08-17
申请人： X-Celeprint Limited
发明人： Christopher Bower , Matthew Meitl , Ronald S. Cok
IPC分类号： H03H9/64 , H03H3/00 , H03H3/007 , H03H3/02 , H03H3/08 , H03H9/00 , H03H9/02 , H03H9/05 , H03H9/54 , H03H9/56
CPC分类号： H03H9/64 , H03H3/007 , H03H3/02 , H03H3/08 , H03H9/02015 , H03H9/02543 , H03H9/0509 , H03H9/0585 , H03H9/54 , H03H9/564 , H03H2009/0019
摘要： A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.
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