公开(公告)号：WO2011049764A3

公开(公告)日：2011-11-17

申请号：PCT/US2010052061

申请日：2010-10-08

Applicant: NAT SEMICONDUCTOR CORP ,  LEE SHAW WEI ,  NG EIN SUN ,  LIU CHUE SIAK ,  LEE YEE KIM ,  LEE LEE HAN MENG EUGENE

Inventor： LEE SHAW WEI ,  NG EIN SUN ,  LIU CHUE SIAK ,  LEE YEE KIM ,  LEE LEE HAN MENG EUGENE

IPC: H01L23/48 ,  H01L23/495 ,  H01L23/52

CPC classification number: H01L23/49503 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/49175 ,  H01L2224/85051 ,  H01L2224/85207 ,  H01L2224/85986 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85186 ,  H01L2224/85181 ,  H01L2924/00 ,  H01L2224/48227 ,  H01L2224/85 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/4554

Abstract: Various semiconductor package arrangements and methods that improve the reliability of wire bonding a die to ground or other outside contacts are described. In one aspect, selected ground pads on the die are wire bonded to a bonding region located on the tie bar portion of the lead frame. The tie bar is connected to an exposed die attach pad that is downset from the bonding region of the tie bar. In some embodiments, the bonding region and the leads are at substantially the same elevation above the die and die attach pad. The die, bonding wires, and at least a portion of the lead frame can be encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.

Abstract translation: 描述了各种半导体封装布置和方法，这些布置和方法提高了管芯接地接合或其他外部接触的可靠性。 在一个方面，管芯上的选定接地焊盘被引线接合到位于引线框架的连接杆部分上的接合区域。 系杆连接到从连杆的粘合区域下沉的暴露的模具附连垫。 在一些实施例中，接合区域和引线在管芯和管芯附着垫之上处于基本相同的高度。 裸片，键合引线和引线框架的至少一部分可以用塑料密封剂材料封装，同时使裸片附着焊盘的接触表面暴露，以便于将裸片附着焊盘电耦合到外部器件。

公开(公告)号：WO2011071603A2

公开(公告)日：2011-06-16

申请号：PCT/US2010/053974

申请日：2010-10-25

Applicant: NATIONAL SEMICONDUCTOR CORPORATION ,  LEE, Lee Han Meng @ Eugene ,  WOO, Kuan Yee

Inventor： LEE, Lee Han Meng @ Eugene ,  WOO, Kuan Yee

IPC: H01L23/495 ,  H01L23/498 ,  H01L23/52

CPC classification number: H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49551 ,  H01L23/552 ,  H01L24/27 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/83192 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025

Abstract: An integrated circuit package is described that includes a substrate, a leadframe and one or more integrated circuits that are positioned between the substrate and the leadframe. Multiple electrical components may be attached to one or both sides of the substrate. The active face of the integrated circuit is electrically and physically connected to the substrate. The back side of the integrated circuit is mounted on a die attach pad of the leadframe. The leadframe includes multiple leads that are physically attached to and electrically coupled with the substrate. A molding material encapsulates portions of the substrate, the leadframe and the integrated circuit. Methods for forming such packages are also described.

Abstract translation: 描述了一种集成电路封装，其包括衬底，引线框以及位于衬底和引线框之间的一个或多个集成电路。 多个电子元件可以连接到基板的一侧或两侧。 集成电路的有源面与基板电和物理连接。 集成电路的背面安装在引线框架的芯片连接垫上。 引线框架包括物理连接到衬底并与衬底电耦合的多个引线。 模制材料包封衬底，引线框架和集成电路的部分。 还描述了形成这种包装的方法。

公开(公告)号：WO2011071566A1

公开(公告)日：2011-06-16

申请号：PCT/US2010/045802

申请日：2010-08-17

Applicant: NATIONAL SEMICONDUCTOR CORPORATION ,  LEE, Lee Han Meng @ Eugene ,  WOO, Kuan Yee

Inventor： LEE, Lee Han Meng @ Eugene ,  WOO, Kuan Yee

IPC: H01L23/495 ,  H01L23/32 ,  H01L23/52

CPC classification number: H01L23/49537 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/49575 ,  H01L23/49589 ,  H01L24/97 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00

Abstract: A semiconductor chip package having multiple leadframes is disclosed. Packages can include a first leadframe having a first plurality of electrical leads and a die attach pad having a plurality of tie bars, a second leadframe generally parallel to the first leadframe and having a second plurality of electrical leads, and a mold or encapsulant. Tie bars can be located on three main sides of the die attach pad, but not the fourth main side. Gaps in the first and second plurality of electrical leads can be enlarged or aligned with each other to enable the elimination of mold flash outside the encapsulated region, which can be accomplished with mold cavity bar protrusions. Additional components can include a primary die, a secondary die, an inductor and/or a capacitor. The first and second leadframes can be substantially stacked atop one another, and one or both leadframes can be leadless leadframes.

Abstract translation: 公开了一种具有多个引线框架的半导体芯片封装。 封装可以包括具有第一多个电引线的第一引线框架和具有多个连接条的管芯附接焊盘，大体平行于第一引线框架并具有第二多个电引线的第二引线框架以及模具或密封剂。 连接杆可以位于管芯安装垫的三个主要侧面，而不是第四个主要侧面。 可以使第一和第二多个电引线中的间隙彼此扩大或对准，以便能够消除封装区域之外的模具闪蒸，这可以通过模具腔棒突起来实现。 另外的部件可以包括主管芯，次级管芯，电感器和/或电容器。 第一引线框架和第二引线框架可以基本上彼此层叠，并且一个或两个引线框架可以是无引线引线框架。

公开(公告)号：WO2010125492A1

公开(公告)日：2010-11-04

申请号：PCT/IB2010/051687

申请日：2010-04-19

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH ,  HAN, Meng

Inventor： HAN, Meng

IPC: G01P3/36 ,  G01P21/02 ,  B60T8/172 ,  G01S17/58 ,  B60W40/10 ,  B60T8/1755

CPC classification number: G01P3/366 ,  B60T8/172 ,  B60T2250/04 ,  B60W40/11 ,  B60W40/112 ,  B60W40/114 ,  G01P21/02 ,  G01S7/48 ,  G01S17/06 ,  G01S17/58

Abstract: The invention is related to a laser diode based multiple beam laser spot imaging system for characterization of vehicle dynamics. A laser diode based, preferably VCSEL based laser imaging system is utilized to characterize the vehicle dynamics. One or more laser beams are directed to the road surface. A compact imaging system including an imaging matrix sensor such as a CCD or CMOS camera measures locations or separations of individual laser spots. Loading status of vehicles and vehicles' pitch and roll angle can be characterized by analyzing the change of laser spot locations or separations.

Abstract translation: 本发明涉及用于表征车辆动力学的基于激光二极管的多束激光点成像系统。 基于激光二极管的，优选基于VCSEL的激光成像系统用于表征车辆动力学。 一个或多个激光束被引导到路面。 包括诸如CCD或CMOS照相机的成像矩阵传感器的紧凑成像系统测量各个激光点的位置或间隔。 可以通过分析激光点位置或分离的变化来表征车辆和车辆的俯仰角度的载荷状态。

公开(公告)号：WO2010058322A1

公开(公告)日：2010-05-27

申请号：PCT/IB2009/055001

申请日：2009-11-11

Applicant: PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH ,  KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  HAN, Meng

Inventor： HAN, Meng

IPC: G01P3/36 ,  G01P5/26 ,  G01S17/58

CPC classification number: G01P3/366 ,  G01P5/26 ,  G01S7/4916 ,  G01S17/58

Abstract: The present invention relates to a method and device of measuring the velocity of a target (10) by laser self-mixing. An output beam (2) of a single laser source (1) is split into two sensing beams (4, 5). The two sensing beams (4, 5) are directed on different beam paths to a surface of the moving target (10), wherein said different beam paths are selected to be symmetrical to one another. From a measured intensity variation of the output beam (2) Doppler frequencies of laser radiation of the two sensing beams (4, 5) backscattered from the target (10) are determined. Based on these Doppler frequencies a vertical velocity of the moving target (10) is determined from a difference in the Doppler frequencies and a longitudinal velocity of the moving target (10) is determined from the sum of the Doppler frequencies. The invention allows a simple and low cost design of the device and a simple processing of the measurement signal.

Abstract translation: 本发明涉及通过激光自混合来测量靶（10）的速度的方法和装置。 单个激光源（1）的输出光束（2）被分成两个感测光束（4,5）。 两个感测光束（4,5）被引导到移动目标（10）的表面的不同光束路径上，其中所述不同光束路径被选择为彼此对称。 从输出光束的测量的强度变化（2）确定从目标（10）反向散射的两个感测光束（4,5）的激光辐射的多普勒频率。 基于这些多普勒频率，根据多普勒频率的差确定移动目标（10）的垂直速度，并根据多普勒频率的和确定移动目标（10）的纵向速度。 本发明允许设备的简单且低成本的设计以及测量信号的简单处理。

公开(公告)号：WO2009138912A3

公开(公告)日：2009-11-19

申请号：PCT/IB2009/051871

申请日：2009-05-07

Applicant: PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH ,  KONINKLIJKE PHILIPS ELECTRONICS N. V. ,  HAN, Meng ,  KRAUS, Albrecht ,  MÖNCH, Holger

Inventor： HAN, Meng ,  KRAUS, Albrecht ,  MÖNCH, Holger

IPC: B60R21/015

Abstract: A security system is described,comprising a sensor module (15) which accommodates a laser sensor(10)working with self-mixing interference. The laser sensor(10)generates measurement data which are related to the velocity of an object such as the body of a human being and,optionally,the distance between the laser sensor (10) and the object. Dependent on the measurement data assembled by the laser sensor (10)and supplied to a control circuit(30)such as an airbag computer, the airbag computer activate security means such as an airbag(35)in order to prevent injuries of the human body. Furthermore, a method of driving such a security system is described.

公开(公告)号：WO2011081696A3

公开(公告)日：2011-09-22

申请号：PCT/US2010052189

申请日：2010-10-11

Applicant: NAT SEMICONDUCTOR CORP ,  LEE SHAW WEI ,  LEE YEE KIM ,  NG EIN SUN ,  LEE LEE HAN MENG EUGENE ,  CHIN TING SOON PETER

Inventor： LEE SHAW WEI ,  LEE YEE KIM ,  NG EIN SUN ,  LEE LEE HAN MENG EUGENE ,  CHIN TING SOON PETER

IPC: H01L23/48 ,  H01L23/49 ,  H01L23/495

CPC classification number: H01L23/49582 ,  H01L21/568 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48639 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A variety of semiconductor package arrangements and packaging methods are described that improve the reliability of bonding wires that down bond a die to a die attach pad. In one aspect, selected portions of the top surface of a lead frame (which may be in panel form) are plated (e.g., silver plated) to facilitate wire bonding. The plating covers some, but not all of a die attach surface of the die attach pad. In some preferred embodiments, the plating on the die attach pad is arranged as a peripheral ring that surrounds an unplated central region of the die support surface. In other embodiments, the plating on the die attach pad takes the form of bars or other geometric patterns that do not fully cover the die support surface. Unplated portions of the die support surface are roughened to improve the adherence of the die to the die attach pad, thereby reducing the probability of die attach pad delamination and the associated risks to down bonded bonding wires. The described lead frames may be used in a variety of packages. Most commonly, a die is attached to the die support surface of the die attach pad and electrically connected to the lead frame leads by wire bonding as appropriate. At least one of the die's bond pads (typically the ground bond pad(s)) is down bonded to the die attach pad. The die, the bonding wires and at least portions of the lead frame are then typically encapsulated with a plastic encapsulant material while leaving a contact surface of the die attach pad exposed to facilitate electrically coupling the die attach pad to an external device.

Abstract translation: 描述了各种半导体封装布置和封装方法，其改进将裸片向下焊接到裸片附接焊盘的焊线的可靠性。 在一个方面，引线框架（其可以呈面板形式）的顶表面的选定部分被电镀（例如，镀银）以促进引线键合。 电镀覆盖了芯片附着垫的一些但不是全部芯片附着表面。 在一些优选实施例中，管芯附接垫上的电镀布置为围绕管芯支撑表面的未镀制的中心区域的外围环。 在其他实施例中，模具连接垫上的镀层采用不完全覆盖模具支撑表面的条或其他几何图案的形式。 裸片支撑表面的未镀制的部分被粗糙化以改善裸片与裸片附着垫的粘附，由此减少裸片附着垫分层的可能性以及与羽绒键合的键合线相关联的相关风险。 所描述的引线框架可以用在各种封装中。 最常见的情况是，芯片附着于芯片附着焊盘的芯片支撑表面，并通过适当的引线键合与引线框架引线电连接。 裸片的接合焊盘（通常为接地焊盘（一个或多个））中的至少一个向下接合至裸片附接焊盘。 然后，模具，键合引线和引线框架的至少部分通常用塑料密封剂材料封装，同时使裸片附接垫的接触表面暴露以便于将裸片附着垫电耦合到外部装置。

公开(公告)号：WO2010125501A1

公开(公告)日：2010-11-04

申请号：PCT/IB2010/051763

申请日：2010-04-22

Applicant: KONINKLIJKE PHILIPS ELECTRONICS N. V. ,  PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH ,  HAN, Meng

Inventor： HAN, Meng

IPC: G01S17/58 ,  G01P3/36 ,  B60W40/06 ,  B60W40/10

CPC classification number: G01S17/58 ,  B60W40/072 ,  B60W40/076 ,  B60W40/10 ,  B60W40/101 ,  B60W40/11 ,  B60W40/112 ,  B60W40/114 ,  G01P3/366

Abstract: The invention is related to laser diode based self-mixing laser sensors for simplified vehicle stability control. Vehicle's side slip angle, front and rear tire slip angles, yaw rate and lateral acceleration rate are derived explicitly from self-mixing laser sensors. Three criteria based on yaw rate, turn radius and tire slip angle analysis are employed to detect the occurrence of understeer or oversteer, which enables simplified vehicle electronic stability program.

Abstract translation: 本发明涉及用于简化车辆稳定性控制的基于激光二极管的自混合激光传感器。 汽车的侧滑角，前后轮胎滑移角，横摆角速度和横向加速度明确地从自混合激光传感器中得出。 采用基于偏航率，转弯半径和轮胎滑移角分析的三个标准来检测转向不足或过度转向发生，从而简化车辆电子稳定程序。

公开(公告)号：WO2009090593A1

公开(公告)日：2009-07-23

申请号：PCT/IB2009/050109

申请日：2009-01-12

Applicant: PHILIPS INTELLECTUAL PROPERTY & STANDARDS GMBH ,  KONINKLIJKE PHILIPS ELECTRONICS N.V. ,  MOENCH, Holger ,  CARPAIJ, Mark ,  VAN DER LEE, Alexander, M. ,  SCHWAN, Stefan ,  HAN, Meng ,  SCHEMMANN, Marcel, F. C.

Inventor： MOENCH, Holger ,  CARPAIJ, Mark ,  VAN DER LEE, Alexander, M. ,  SCHWAN, Stefan ,  HAN, Meng ,  SCHEMMANN, Marcel, F. C.

IPC: G01S17/58

CPC classification number: G01S17/58 ,  G01P3/366 ,  G01S7/4811 ,  G01S7/4916

Abstract: A sensor module (1) for measuring the distance to a target and/or the velocity of the target (50), the sensor module (1) comprising at least one laser source (100), at least one detector (200) being adapted to detect modulated laser light and at least one control element the control element (400) being adapted to vary the focus point ofthe laser light and/or the intensity of the laser light and/or the direction of the laser light. The controlofthe laser light emitted by the laser source (100) either by active optical devices as variable focus lenses or controllable attenuators or passive optical elements in combination with arrays of laser sources (100) and detectors (200) enable flexible and robust sensor modules.

Abstract translation: 传感器模块（1），用于测量与目标的距离和/或目标（50）的速度，传感器模块（1）包括至少一个激光源（100），至少一个检测器（200） 为了检测调制的激光和至少一个控制元件，控制元件（400）适于改变激光的焦点和/或激光的强度和/或激光的方向。 由激光源（100）发射的激光源可通过作为可变焦距透镜的有源光学器件或可控衰减器或无源光学元件与激光源（100）和检测器（200）的阵列相结合来发射的激光使得能够灵活且鲁棒的传感器模块。

公开(公告)号：WO2009138912A2

公开(公告)日：2009-11-19

申请号：PCT/IB2009051871

申请日：2009-05-07

Applicant: PHILIPS INTELLECTUAL PROPERTY ,  KONINKL PHILIPS ELECTRONICS NV ,  HAN MENG ,  KRAUS ALBRECHT ,  MOENCH HOLGER

Inventor： HAN MENG ,  KRAUS ALBRECHT ,  MOENCH HOLGER

IPC: B60R21/015

CPC classification number: B60R21/00 ,  B60R21/0134 ,  B60R21/015 ,  B60R21/01516 ,  B60R21/01526 ,  B60R21/01534 ,  G01P3/36

Abstract: A security system is described,comprising a sensor module (15) which accommodates a laser sensor(10)working with self-mixing interference. The laser sensor(10)generates measurement data which are related to the velocity of an object such as the body of a human being and,optionally,the distance between the laser sensor (10) and the object. Dependent on the measurement data assembled by the laser sensor (10)and supplied to a control circuit(30)such as an airbag computer, the airbag computer activate security means such as an airbag(35)in order to prevent injuries of the human body. Furthermore, a method of driving such a security system is described.

Abstract translation: 描述了一种安全系统，其包括传感器模块（15），该传感器模块（15）容纳使用自混合干扰的激光传感器（10）。 激光传感器（10）产生与物体（例如人体）和激光传感器（10）与物体之间的距离相关的测量数据。 根据由激光传感器（10）组装并提供给诸如气囊计算机的控制电路（30）的测量数据，气囊计算机启动诸如安全气囊（35）的安全装置，以防止人体受伤 。 此外，描述了驱动这种安全系统的方法。