Abstract:
A method for manufacturing vacuum deposited barrier films that prevent water vapor and/or oxygen gas permeation, while minimizing the amount of particles and contaminants on the surface to which the barrier film is to be applied is provided. The method includes protecting a to-be-coated surface with an adhesive tacky film through vacuum pump down and from roller contact, etc. Surfaces treated with the method include flexible web substrates and rigid substrates such as glass or metal. A glass substrate with a pre-coated film stack, for example, a glass sheet with coatings for making an organic light-emitting diode (OLED) display can be protected with a tacky film per the inventive method. Small substrates such as glass lenses can also benefit from the inventive method. As can other substrates such as rolls of metal strip and substrates with curved or pre-cut shapes.
Abstract:
Methods of forming dielectric layers using high-density plasma chemical vapor deposition are described. Dielectric layers are formed over metal films. The metal film is present on a substrate prior to entering the high-density plasma processing chamber. The metal film is processed to remove oxidation and optionally to improve adhesion of the dielectric layer on the metal film.
Abstract:
A method is disclosed in which a vapor-deposited coating or layer is directly or indirectly applied to at least a portion of the internal wall of the barrel of a capped pre-assembly comprising a barrel, a dispensing portion, and a shield. The shield is secured to the barrel and at least substantially isolates the distal opening of the dispensing portion from pressure conditions outside the shield. A vapor-deposited coating or layer is applied directly or indirectly to at least a portion of the internal wall of the barrel while the pre-assembly is capped. The coating or layer is applied under conditions effective to maintain communication between the barrel lumen and the dispensing portion lumen via the proximal opening at the end of the applying step. The capped pre-assembly can be pressure tested easily and rapidly, for example with a test duration between 1 and 60 seconds, to determine whether it has container closure integrity.
Abstract:
A radical reactor including an elongated structure received within a chamber of a body of the radical reactor. Radicals are generated within a radical chamber formed in the elongated structure by applying a voltage signal across the elongated structure and an electrode extending within the radical chamber. The radicals generated in the radical chamber are routed via a discharge port of the elongated structure and a conduit formed in the body of the radical reactor onto the substrate. The discharge port and the conduit are not aligned so that irradiation generated in the radical chamber is not directed to the substrate
Abstract:
An apparatus (100..103) for the plasma coating of a substrate (2), in particular a press platen, is provided, comprising a vacuum chamber (3) and, arranged therein, an electrode (400..409), which is segmented, wherein each of the electrode segments (500..512) has a dedicated connection (6) for an electrical energy source (700..702). Also provided is a method for operating said apparatus (100..103), in which a substrate (2) to be coated is positioned with respect to said electrode (400..409) and at least one energy source (700..706) that is assigned to an electrode segment (500..512) is activated. Moreover, a gas is introduced, with the effect of bringing about plasma-enhanced chemical vapour deposition on the substrate (2).
Abstract:
Methods of depositing a tin-containing layer on a substrate are disclosed herein. In some embodiments, a method of depositing a tin-containing layer on a substrate may include flowing a tin source comprising a tin halide into a reaction volume; flowing a hydrogen plasma into the reaction volume; forming one or more tin hydrides within the reaction volume from the tin source and the hydrogen plasma; and depositing the tin-containing layer on a first surface of the substrate using the one or more tin hydrides.
Abstract:
A method for removing deposits from the surface of a solid body inside a plasma chamber and especially from the inner surface of a tube of a LPCVD system is described. During treatment of the deposits with an etching gas, especially F 2 , the pressure is varied, especially from a higher pressure level to a lower pressure level. This allows the removal of deposits from areas close to the etching gas inlet to areas more remote from the etching gas inlet. It is especially possible to remove deposits from the inner surface of tubes over the whole length, even of tubes having a length of more than 1 m, e.g. 2 m tubes. Remote microwave sources are preferred sources to irradiate the etching gas (cleaning gas).