Abstract:
A circuit assembly (34) resistant to high-temperature and high g centrifugal force is disclosed. A printed circuit board (42) is first fabricated from alumina and has conductive traces of said circuit formed thereon by the use of a thick film gold paste. Active and passive components of the circuit assembly are attached to the printed circuit board by means of gold powder diffused under high temperature. Gold wire is used for bonding between the circuit traces and the active components in order to complete the circuit assembly (34). Also, a method for manufacturing a circuit assembly resistant to elevated temperature is disclosed
Abstract:
A Convergent-Divergent-Convergent nozzle apparatus for direct-whte applications is described. The tip apparatus includes at least three nozzles concentrically positioned in series. In a non-limiting embodiment, a first nozzle has a converging taper, a second nozzle extends from the first nozzle with a diverging taper, and a third nozzle extends from the second nozzle and has a converging taper. The nozzles are positioned in series and are coaxial, and can be formed from either separate components or a monolithic structure. Such an arrangement has permitted direct writing of aerosolized particle streams in line widths from 3.7 - 8 µm in width prior to sintering. Further refinements to the apparatus and processing parameters may result in line widths of 1 µm or less. Aerosolized particles may comprise conductor or semiconductor precursors that may be processed into microelectronic conductors or semiconductors, respectively. The particles may also comprise nanostructures or nanoparticles.
Abstract:
A Convergent-Divergent-Convergent nozzle apparatus for direct-whte applications is described. The tip apparatus includes at least three nozzles concentrically positioned in series. In a non-limiting embodiment, a first nozzle has a converging taper, a second nozzle extends from the first nozzle with a diverging taper, and a third nozzle extends from the second nozzle and has a converging taper. The nozzles are positioned in series and are coaxial, and can be formed from either separate components or a monolithic structure. Such an arrangement has permitted direct writing of aerosolized particle streams in line widths from 3.7 - 8 μm in width prior to sintering. Further refinements to the apparatus and processing parameters may result in line widths of 1 μm or less. Aerosolized particles may comprise conductor or semiconductor precursors that may be processed into microelectronic conductors or semiconductors, respectively. The particles may also comprise nanostructures or nanoparticles.
Abstract:
The present invention relates to an electrode in which a selectively formed monostratal conductive fine particle film is covalently bound to the surface of the end of the wiring or the end of the lead wire via a first organic coating selectively formed on the surface of the end of the wiring or the end of the lead wire and a second organic coating formed on the surface of the conductive fine particles, and also the electrode in which these organic coatings are different from each other.
Abstract:
Method for connecting the conductive surfaces of circuit boards, especially a circuit board equipped with at least two conductive surfaces separated by an insulator layer and with holes, or for creating conductors on a board in a manner that conducts electricity. In the method, a metal or metal alloy, in a powder form, is fed into and the powder is sintered using a laser in order to create a unified conductive structure.
Abstract:
Um ein schonendes Aufspritzen insbesondere einer Leiterbahn (2) auf einem Substrat (4) zu ermöglichen, ist ein Spritzverfahren vorgesehen, bei dem in einer Spritzlanze (6) ein kaltes Plasma (22) mit einer Plasmatemperatur kleiner 3000 K erzeugt wird und wobei in die Spritzlanze (6) mit Hilfe eines Trägergases (T) ein Pulver (P) eingebracht wird, das zu einer stirnendseitigen Austrittsöffnung (16) geführt wird, dort austritt und auf das Substrat (4) auftrifft.
Abstract:
The invention relates to a method for producing a partially shaped electrically conductive structure on a carrier substrate (16). A latent magnetic image of the graphic form of the electrically conductive structure, composed of magnetic image points and unmagnetic image points is produced on a magnetizable printing form (11) from a digital data set which defines the graphic form of the electrically conductive structure. Magnetic particles having an electrically conductive surface, which are attracted by the magnetic image points, are arranged and fixed on the carrier substrate (16) through the latent magnetic image, towards the graphic form of the electrically conductive structure by means of the printing form (11). The invention also relates to a multi-layered body which is produced according to said method.
Abstract:
The invention discloses a method for forming a graft polymer pattern including disposing in a pattern a liquid containing a radically polymerizable unsaturated compound on a substrate surface capable of generating radicals by heating or exposure, and heating or exposing the substrate to form a graft polymer directly bonded to the substrate surface in a region where the liquid has been disposed. The invention also discloses a method for forming an electrically conductive pattern including attaching an electrically conductive substance to the graft polymer thus formed.