公开(公告)号：WO2016057318A1

公开(公告)日：2016-04-14

申请号：PCT/US2015/053647

申请日：2015-10-02

Applicant: MC10, INC. ,  DALAL, Mitul ,  OK GUPTA, Sanjay

Inventor： DALAL, Mitul ,  OK GUPTA, Sanjay

IPC: H01L23/538 ,  H01L23/528 ,  H01L23/13

CPC classification number: H01L25/0655 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/86 ,  H01L24/92 ,  H01L24/95 ,  H01L25/50 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48157 ,  H01L2224/48499 ,  H01L2224/49176 ,  H01L2224/50 ,  H01L2224/73219 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/85005 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85801 ,  H01L2224/86005 ,  H01L2224/86801 ,  H01L2224/92244 ,  H01L2224/92247 ,  H01L2224/92248 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K1/0298 ,  H05K1/147 ,  H05K1/189 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/19 ,  H01L2224/85 ,  H01L2224/86 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.

Abstract translation: 灵活的互连，灵活的集成电路系统和设备，以及制造和使用柔性集成电路的方法。 公开了一种灵活的集成电路系统，其包括通过离散的柔性互连电连接的第一和第二分立器件。 第一分立器件包括在其外表面上具有第一电连接焊盘的第一柔性多层集成电路（IC）封装。 第二分立器件包括在其外表面上具有第二电连接焊盘的第二柔性多层集成电路（IC）封装。 离散的柔性互连件附接到第一分立器件的第一电连接焊盘并将其电连接到第二分立器件的第二电连接焊盘。

公开(公告)号：WO2016048888A1

公开(公告)日：2016-03-31

申请号：PCT/US2015/051210

申请日：2015-09-21

Applicant: MC10, INC. ,  GARLOCK, David G. ,  LI, Xia ,  GUPTA, Sanja ,  DALAL, Mitul

Inventor： GARLOCK, David G. ,  LI, Xia ,  GUPTA, Sanja ,  DALAL, Mitul

IPC: H01L23/49

CPC classification number: H01L24/48 ,  G06K19/07779 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45118 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/4516 ,  H01L2224/45164 ,  H01L2224/45166 ,  H01L2224/45169 ,  H01L2224/45171 ,  H01L2224/4809 ,  H01L2224/48092 ,  H01L2224/48137 ,  H01L2224/48463 ,  H01L2224/48511 ,  H01L2224/78252 ,  H01L2224/78301 ,  H01L2224/78349 ,  H01L2224/78611 ,  H01L2224/85207 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A capillary tool for use in feeding, bending, and attaching a bonding wire between a pair of bond pads includes a body and a heating element. The body has an internal tube that extends from a first surface of the capillary tool to a second surface of the capillary tool. In some implementations, the internal tube has a portion with a generally helical shape that includes at least a portion of one complete revolution about a central axis of the body. The heating element is coupled to the body to provide a heat affected zone along a portion of the internal tube that heats the bonding wire as the bonding wire is fed through the internal tube.

Abstract translation: 用于在一对接合焊盘之间馈送，弯曲和连接接合线的毛细管工具包括主体和加热元件。 主体具有从毛细管工具的第一表面延伸到毛细管工具的第二表面的内管。 在一些实施方案中，内管具有大致螺旋形状的部分，其包括围绕主体的中心轴线的一整圈的至少一部分。 加热元件联接到主体，以沿着内管的一部分提供热影响区域，该热影响区域在接合线被馈送通过内管时加热接合线。

公开(公告)号：WO2016054512A1

公开(公告)日：2016-04-07

申请号：PCT/US2015/053727

申请日：2015-10-02

Applicant: MC10, INC. ,  DALAL, Mitul ,  GUPTA, Sanjay

Inventor： DALAL, Mitul ,  GUPTA, Sanjay

IPC: H01L23/29

CPC classification number: H01L23/5389 ,  H01L21/2885 ,  H01L21/486 ,  H01L21/56 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49866 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5387 ,  H01L24/83 ,  H01L2224/48137 ,  H01L2224/8385 ,  H01L2924/0635 ,  H01L2924/07025

Abstract: Flexible integrated circuit (IC) modules, flexible IC devices, and methods of making and using flexible IC modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate. An encapsulating layer, which is attached to the flexible substrate, includes a thermoplastic resin and/or a polyimide adhesive encasing therein the semiconductor die. The encapsulating layer may be an acrylic -based thermally conductive and electrically isolating polyimide adhesive. Optionally, the encapsulating layer may be a B- stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend. The die may be embedded between two flexible substrates, each of which includes a layer of flexible polymer, such as a polyimide sheet, with two layers of conductive material, such as copper cladding, disposed on opposing sides of the layer of flexible polymer.

Abstract translation: 本文介绍了灵活集成电路（IC）模块，灵活IC器件以及制造和使用柔性IC模块的方法。 公开了一种柔性集成电路模块，其包括柔性基板和附接到柔性基板的半导体管芯。 附着在柔性基板上的封装层包括封装半导体管芯的热塑性树脂和/或聚酰亚胺粘合剂。 封装层可以是基于丙烯酸的导热和电隔离的聚酰亚胺粘合剂。 任选地，封装层可以是B-级FR-4玻璃增强环氧热塑性聚合物或共聚物或共混物。 模具可以嵌入在两个柔性基板之间，每个柔性基板包括柔性聚合物层，例如聚酰亚胺片层，其中布置在柔性聚合物层的相对侧上的两层导电材料，例如铜包层。