公开(公告)号：WO2019094098A1

公开(公告)日：2019-05-16

申请号：PCT/US2018/050075

申请日：2018-09-07

Applicant: MICRON TECHNOLOGY, INC.

Inventor： NG, Hong, Wan ,  SINGH, Akshay, N.

IPC: H01L25/065 ,  H01L23/525 ,  H01L23/00

Abstract: A semiconductor device assembly includes a substrate having a plurality of external connections, a first shingled stack of semiconductor dies disposed directly over a first location on the substrate and electrically coupled to a first subset of the plurality of external connections, and a second shingled stack of semiconductor dies disposed directly over a second location on the substrate and electrically coupled to a second subset of the plurality of external connections. The semiconductor device assembly further includes an encapsulant at least partially encapsulating the substrate, the first shingled stack and the second shingled stack.

公开(公告)号：WO2016081730A1

公开(公告)日：2016-05-26

申请号：PCT/US2015/061592

申请日：2015-11-19

Applicant: MICRON TECHNOLOGY, INC.

Inventor： YE, Seng, Kim ,  NG, Hong, Wan

IPC: H01L25/065 ,  H01L23/48

CPC classification number: H01L25/0657 ,  G06F13/1668 ,  G06F13/1694 ,  H01L22/14 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/04 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/03 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/13083 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/2939 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81855 ,  H01L2224/81856 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83874 ,  H01L2224/92227 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/14 ,  H01L2924/143 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/83101 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/83

Abstract: Memory devices with controllers under stacks of memory packages and associated systems and methods are disclosed herein. In one embodiment, a memory device is configured to couple to a host and can include a substrate, a stack of memory packages, and a controller positioned between the stack and the substrate. The controller can manage data stored by the memory packages based on commands from the host.

Abstract translation: 本文公开了具有位于堆栈内存控制器的相关系统和方法的存储器件。 在一个实施例中，存储器设备被配置为耦合到主机并且可以包括衬底，堆叠的存储器封装以及位于堆和衬底之间的控制器。 控制器可以根据来自主机的命令来管理内存包存储的数据。