公开(公告)号：WO2016156853A1

公开(公告)日：2016-10-06

申请号：PCT/GB2016/050910

申请日：2016-03-31

Applicant: ALPHA METALS, INC. ,  ROHAN, Setna

Inventor： VENKATAGIRIYAPPA, Ramakrishna Hosur ,  DE AVILA RIBAS, Morgana ,  DAS, Barun ,  SIDDAPPA, Harish Hanchina ,  MUKHERJEE, Sutapa ,  SARKAR, Siuli ,  SINGH, Bawa ,  RAUT, Rahul ,  PANDHER, Ranjit

IPC: B23K1/00 ,  B23K35/00 ,  C08K3/00 ,  C08K3/04 ,  C08K5/00 ,  C08K7/02 ,  C08L83/04 ,  H01L21/00 ,  H01L23/00

CPC classification number: B23K35/3613 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3602 ,  B23K2201/42 ,  C08K3/013 ,  C08K3/04 ,  C08K3/042 ,  C08K5/00 ,  C08K5/549 ,  C08K7/02 ,  H01L23/295 ,  H01L23/296 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1131 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/1141 ,  H01L2224/11418 ,  H01L2224/11422 ,  H01L2224/1301 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13386 ,  H01L2224/13387 ,  H01L2224/13393 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13486 ,  H01L2224/13487 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27418 ,  H01L2224/27422 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29486 ,  H01L2224/29487 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/8184 ,  H01L2224/81856 ,  H01L2224/81862 ,  H01L2224/81874 ,  H01L2224/8321 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/351 ,  H01L2924/3841 ,  C08L63/00 ,  C08L83/04 ,  C08K5/092 ,  C08K5/18 ,  C08K5/49 ,  C08L2205/025 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01006 ,  H01L2924/00012 ,  H01L2924/05341 ,  H01L2924/07001 ,  H01L2924/0715 ,  H01L2924/0675 ,  H01L2924/0665 ,  H01L2924/06 ,  H01L2924/01079 ,  H01L2924/053 ,  H01L2924/01102 ,  H01L2924/01103 ,  H01L2924/01109 ,  H01L2924/01009 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/066 ,  H01L2924/0635 ,  H01L2924/061 ,  H01L2924/05432 ,  H01L2924/04642 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2924/0542 ,  H01L2924/0103

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalised graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminium oxide, zinc oxide, aluminium nitride, boron nitride, silver, nano fibres, carbon fibres, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt.% of the filler based on the total weight of the composition.

Abstract translation: 一种用于电子组装方法的组合物，所述组合物包含分散在有机介质中的填料，其中：所述有机介质包含聚合物; 填料包括一个或多个石墨烯，官能化石墨烯，氧化石墨烯，多面体低聚倍半硅氧烷，石墨，二维材料，氧化铝，氧化锌，氮化铝，氮化硼，银，纳米纤维，碳纤维，金刚石，碳纳米管 ，二氧化硅和金属涂覆的颗粒，并且所述组合物包含基于组合物总重量的0.001至40重量％的填料。

公开(公告)号：WO2016156853A8

公开(公告)日：2018-01-25

申请号：PCT/GB2016050910

申请日：2016-03-31

Applicant: ALPHA ASSEMBLY SOLUTIONS INC ,  ROHAN SETNA

Inventor： VENKATAGIRIYAPPA RAMAKRISHNA HOSUR ,  DE AVILA RIBAS MORGANA ,  DAS BARUN ,  SIDDAPPA HARISH HANCHINA ,  MUKHERJEE SUTAPA ,  SARKAR SIULI ,  SINGH BAWA ,  RAUT RAHUL ,  PANDHER RANJIT

IPC: B23K1/00 ,  B23K35/00 ,  C08K3/00 ,  C08K3/04 ,  C08K5/00 ,  C08K7/02 ,  C08L83/04 ,  H01L21/00 ,  H01L23/00

CPC classification number: C08K3/04 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3602 ,  B23K2201/42 ,  C08K3/013 ,  C08K3/042 ,  C08K5/00 ,  C08K7/02 ,  H01L23/295 ,  H01L23/296 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1131 ,  H01L2224/11312 ,  H01L2224/1132 ,  H01L2224/1141 ,  H01L2224/11418 ,  H01L2224/11422 ,  H01L2224/1301 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13386 ,  H01L2224/13387 ,  H01L2224/13393 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13447 ,  H01L2224/13486 ,  H01L2224/13487 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/2731 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/2741 ,  H01L2224/27418 ,  H01L2224/27422 ,  H01L2224/27436 ,  H01L2224/27602 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29386 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29486 ,  H01L2224/29487 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/8184 ,  H01L2224/81856 ,  H01L2224/81862 ,  H01L2224/81874 ,  H01L2224/8321 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2924/12041 ,  H01L2924/3841 ,  C08L63/00 ,  C08L83/04 ,  C08K5/092 ,  C08K5/18 ,  C08K5/49 ,  C08L2205/025 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01006 ,  H01L2924/00012 ,  H01L2924/05341 ,  H01L2924/07001 ,  H01L2924/0715 ,  H01L2924/0675 ,  H01L2924/0665 ,  H01L2924/06 ,  H01L2924/01079 ,  H01L2924/053 ,  H01L2924/01102 ,  H01L2924/01103 ,  H01L2924/01109 ,  H01L2924/01009 ,  H01L2924/0503 ,  H01L2924/01005 ,  H01L2924/066 ,  H01L2924/0635 ,  H01L2924/061 ,  H01L2924/05432 ,  H01L2924/04642 ,  H01L2924/05032 ,  H01L2924/05442 ,  H01L2924/0542 ,  H01L2924/0103

Abstract: A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalised graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminium oxide, zinc oxide, aluminium nitride, boron nitride, silver, nano fibres, carbon fibres, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt.% of the filler based on the total weight of the composition.

Abstract translation: 一种用于电子装配过程的组合物，该组合物包含分散在有机介质中的填料，其中：有机介质包含聚合物; 填料包括石墨烯，官能化石墨烯，氧化石墨烯，多面体低聚倍半硅氧烷，石墨，2D材料，氧化铝，氧化锌，氮化铝，氮化硼，银，纳米纤维，碳纤维，金刚石，碳纳米管中的一种或多种 ，二氧化硅和金属包覆颗粒，并且所述组合物包含基于组合物总重量的0.001至40重量％的填料。

公开(公告)号：WO2016081730A1

公开(公告)日：2016-05-26

申请号：PCT/US2015/061592

申请日：2015-11-19

Applicant: MICRON TECHNOLOGY, INC.

Inventor： YE, Seng, Kim ,  NG, Hong, Wan

IPC: H01L25/065 ,  H01L23/48

CPC classification number: H01L25/0657 ,  G06F13/1668 ,  G06F13/1694 ,  H01L22/14 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/04 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/03 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/13083 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/2939 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81855 ,  H01L2224/81856 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/83874 ,  H01L2224/92227 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1033 ,  H01L2924/14 ,  H01L2924/143 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/1443 ,  H01L2924/15184 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/83101 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2224/83

Abstract: Memory devices with controllers under stacks of memory packages and associated systems and methods are disclosed herein. In one embodiment, a memory device is configured to couple to a host and can include a substrate, a stack of memory packages, and a controller positioned between the stack and the substrate. The controller can manage data stored by the memory packages based on commands from the host.

Abstract translation: 本文公开了具有位于堆栈内存控制器的相关系统和方法的存储器件。 在一个实施例中，存储器设备被配置为耦合到主机并且可以包括衬底，堆叠的存储器封装以及位于堆和衬底之间的控制器。 控制器可以根据来自主机的命令来管理内存包存储的数据。

公开(公告)号：WO2016064350A1

公开(公告)日：2016-04-28

申请号：PCT/SG2015/050407

申请日：2015-10-23

Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH

Inventor： XIE, Ling ,  WICKRAMANAYAKA, Sunil

IPC: H01L23/48 ,  H01L25/00 ,  H01L21/768 ,  H01L21/60

CPC classification number: H01L24/13 ,  H01L23/48 ,  H01L24/05 ,  H01L24/11 ,  H01L24/14 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05109 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/11464 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/1369 ,  H01L2224/16145 ,  H01L2224/8112 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81825 ,  H01L2224/81856 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/14 ,  H01L2924/3841 ,  H01L2224/81

Abstract: A method for bonding a first substrate and a second substrate, the first substrate having at least one first connection extending from one side of the first substrate, the method comprising fabricating a first adhesive material around and along a height of the at least one first connection; and bonding the at least one first connection, the first adhesive material, and the second substrate.

Abstract translation: 一种用于接合第一基板和第二基板的方法，所述第一基板具有从所述第一基板的一侧延伸的至少一个第一连接，所述方法包括在所述至少一个第一连接的高度周围和沿着所述至少一个第一连接的高度 ; 以及接合所述至少一个第一连接部，所述第一粘合材料和所述第二基板。