METHODS OF FORMATION OF A SILICON NANOSTRUCTURE, A SILICON QUANTUM WIRE ARRAY AND DEVICES BASED THEREON
    5.
    发明申请
    METHODS OF FORMATION OF A SILICON NANOSTRUCTURE, A SILICON QUANTUM WIRE ARRAY AND DEVICES BASED THEREON 审中-公开
    形成硅纳米结构的方法,硅量子线阵列及其器件

    公开(公告)号:WO01039259A1

    公开(公告)日:2001-05-31

    申请号:PCT/IB2000/001397

    申请日:2000-10-02

    摘要: A process for controllably forming silicon nanostructures such as a silicon quantum wire array. A silicon surface is sputtered by a uniform flow of nitrogen molecular ions in an ultrahigh vacuum so as to form a periodic wave-like relief in which the throughs of said relief are level with the silicon-insulator border of the SOI material. The ion energy, the ion incidence angle to the surface of said material, the temperature of the silicon layer, the formation depth of the wave-like relief, the height of said wave-like relief and the ion penetration range into silicon are all determined on the basis of a selected wavelength of the wave-like relief in the range of 9 nm to 120 nm. A silicon nitride mask having pendant edges is used to define the area of the silicon surface on which the array is formed. Impurities are removed from the silicon surface within the mask window prior to sputtering. For the purpose of forming a silicon quantum wire array, the thickness of the SOI silicon layer is selected to be greater than the sum of said formation depth, said height and said ion penetration range, the fabrication of the silicon wires being controlled by a threshold value of a secondary ion emission signal from the SOI insulator. The nanostructure may be employed in optoelectronic and nanoelectronic devices such as a FET.

    摘要翻译: 一种用于可控地形成硅纳米结构的方法,例如硅量子线阵列。 硅表面在超高真空中通过均匀的氮分子离子流溅射,以形成周期性的波浪状浮雕,其中所述浮雕的通孔与SOI材料的硅绝缘体边界平齐。 离子能量,所述材料的表面的离子入射角,硅层的温度,波状浮雕的形成深度,所述波浪形浮雕的高度和离子渗入范围都被确定 基于9nm至120nm范围内的波形浮雕的选定波长。 使用具有侧边缘的氮化硅掩模来限定其上形成阵列的硅表面的面积。 在溅射之前,将杂质从掩模窗口内的硅表面除去。 为了形成硅量子线阵列,SOI硅层的厚度被选择为大于所述地层深度,所述高度和所述离子穿透范围之和,所述硅线的制造由阈值 来自SOI绝缘体的二次离子发射信号的值。 纳米结构可以用于诸如FET的光电子和纳米电子器件中。

    NON-UNIFORM GATE OXIDE THICKNESS FOR DRAM DEVICE
    6.
    发明申请
    NON-UNIFORM GATE OXIDE THICKNESS FOR DRAM DEVICE 审中-公开
    DRAM器件的非均匀栅极氧化层厚度

    公开(公告)号:WO2017112276A1

    公开(公告)日:2017-06-29

    申请号:PCT/US2016/063458

    申请日:2016-11-23

    摘要: Provided herein are approaches for forming a gate oxide layer for a DRAM device, the method including providing a finned substrate having a recess formed therein, and performing an ion implant into a sidewall surface of the recess to form a gate oxide layer having a non-uniform thickness, wherein a thickness of the gate oxide layer at a top section of the sidewall surface is greater than a thickness of the gate oxide layer at a bottom section of the sidewall surface. In some approaches, the ion implant is provided as a series of ion implants at multiple different implant angles, varied along with an ion implantation energy and/or an ion dose to increase the thickness of the gate oxide of the top section of the sidewall surface. In some approaches, the finned substrate is also exposed to a plasma, either during or after, the ion implantation.

    摘要翻译: 本文提供了用于形成用于DRAM器件的栅极氧化物层的方法,该方法包括提供其中形成有凹槽的带翅片的衬底,并且执行到凹槽的侧壁表面中的离子注入以形成 具有不均匀厚度的栅极氧化物层,其中,所述侧壁表面的顶部处的所述栅极氧化物层的厚度大于所述侧壁表面的底部处的所述栅极氧化物层的厚度。 在一些方法中,离子注入以多个不同的注入角度作为一系列离子注入来提供,随着离子注入能量和/或离子剂量而变化,以增加侧壁表面的顶部部分的栅极氧化物的厚度 。 在一些方法中,在离子注入期间或之后,鳍状衬底也暴露于等离子体。

    ANGLED ION BEAM PROCESSING OF HETEROGENEOUS STRUCTURE
    7.
    发明申请
    ANGLED ION BEAM PROCESSING OF HETEROGENEOUS STRUCTURE 审中-公开
    异源结构的离子束处理

    公开(公告)号:WO2016089727A1

    公开(公告)日:2016-06-09

    申请号:PCT/US2015/062905

    申请日:2015-11-30

    IPC分类号: H01L27/115 H01L21/265

    摘要: A method for fabricating a multilayer structure includes providing a mask on a device stack disposed on the substrate, the device stack comprising a first plurality of layers composed of a first layer type and a second layer type; directing first ions along a first direction forming a first non-zero angle of incidence with respect to a normal to a plane of the substrate, wherein a first sidewall is formed having a sidewall angle forming a first non-zero angle of inclination with respect to the normal, the first sidewall comprising a second plurality of layers from at least a portion of the first plurality of layers and composed of the first layer type and second layer type; and etching the second plurality of layers using a first selective etch wherein the first layer type is selectively etched with respect to the second layer type.

    摘要翻译: 一种制造多层结构的方法包括在设置在基板上的器件堆叠上设置掩模,该器件堆叠包括由第一层类型和第二层类型组成的第一多个层; 沿着第一方向引导第一离子相对于衬底的平面的法线形成第一非零入射角,其中形成第一侧壁,所述第一侧壁具有形成相对于第一非零倾角的第一非零倾角 正常的第一侧壁包括来自第一多个层的至少一部分的第二多个层,并且由第一层型和第二层型构成; 以及使用第一选择性蚀刻来蚀刻所述第二多个层,其中所述第一层类型相对于所述第二层类型被选择性地蚀刻。

    METHOD OF MATERIAL PROCESSING BY LASER FILAMENTATION
    8.
    发明申请
    METHOD OF MATERIAL PROCESSING BY LASER FILAMENTATION 审中-公开
    激光光纤加工材料的方法

    公开(公告)号:WO2012006736A2

    公开(公告)日:2012-01-19

    申请号:PCT/CA2011/050427

    申请日:2011-07-12

    IPC分类号: B23K26/08

    摘要: A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that is comprised of pulses having an energy and pulse duration selected to produce a filament within the substrate. The substrate is translated relative to the laser beam to irradiate the substrate and produce an additional filament at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving said substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves, rendering bevels to the laser-cleaved edges. Preferably, the laser pulses are delivered in a burst train for lowering the energy threshold for filament formation, increasing the filament length, thermally annealing of the filament modification zone to minimize collateral damage, improving process reproducibility, and increasing the processing speed compared with the use of low repetition rate lasers.

    摘要翻译: 提供了一种用于准备切割步骤的透明衬底的内部处理的方法。 用聚焦激光束照射衬底,该聚焦激光束由具有选定的能量和脉冲持续时间的脉冲组成,以在衬底内产生长丝。 衬底相对于激光束平移以照射衬底并在一个或多个另外的位置处产生另外的长丝。 所得到的细丝形成限定用于切割所述基底的内部划线路径的阵列。 激光束参数可以改变以调节灯丝长度和位置,并且可选地引入V形通道或凹槽,从而使激光切割边缘成为斜面。 优选地,激光脉冲以脉冲串形式传送,用于降低长丝形成的能量阈值,增加长丝长度,长丝修饰区的热退火以使附带损伤最小化,改进工艺可重复性并且与使用相比提高处理速度 低重复率激光器。

    SUBSTRATE HOLDING APPARATUS, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD
    10.
    发明申请
    SUBSTRATE HOLDING APPARATUS, LITHOGRAPHY APPARATUS, AND ARTICLE MANUFACTURING METHOD 审中-公开
    基板保持装置,光刻装置和制品制造方法

    公开(公告)号:WO2016092700A9

    公开(公告)日:2017-05-04

    申请号:PCT/JP2014082986

    申请日:2014-12-12

    申请人: CANON KK

    发明人: FUNABASHI NAOKI

    IPC分类号: H01L21/027 H01L21/683

    摘要: The objective of the invention is to provide: a substrate holding apparatus that is advantageous in terms of separating a substrate from a seal member in a short time when the substrate is to be unloaded; and a lithography apparatus. The present invention relates to a substrate holding apparatus 10 that holds a substrate 3. The substrate holding apparatus 10 has: a holding member 16 that includes a center portion 40 having suction holes 32 that are formed for the purpose of evacuating a space 42 between the substrate 3 and the holding member, and an outer peripheral portion 41 which surrounds the center portion 40, and which is formed in a position lower than that of the center portion 40; and a seal member 31 with which the holding member 16 is provided, and which defines the space 42. Holes 33 independent from an evacuating system, which is connected to the suction holes 32, are formed in the outer peripheral portion 41 and/or the sealing member 31.

    摘要翻译: 本发明的目的在于提供一种基板保持装置,该基板保持装置在基板卸载时能够在短时间内将基板从密封部件分离的方面有利, 和光刻设备。 基板保持装置10具有保持部件16,该保持部件16具有中央部40,该中央部40具有吸引孔32,该吸引孔32为了排出 基板3和保持部件;外周部41,其包围中央部40,形成在比中央部40低的位置; 以及设置有保持部件16的密封部件31,该密封部件31限定空间42.在外周部41和/或外周部41上形成与抽吸孔32连接的独立于抽空系统的孔33。 密封构件31。