摘要:
Die Erfindung betrifft ein Verfahren zum Abscheiden einer Schicht mit hohem Reinheitsgrad auf einem Substrat innerhalb einer Vakuumkammer mit den Verfahrensschritten: • a) tiegelloses Deponieren eines Blockes (1) bestehend aus einem Verdampfungsmaterial innerhalb der Vakuumkammer; • b) Herstellen einer elektrisch leitfähigen Verbindung zwischen dem Block und dem Spannungspotenzial der elektrischen Masse der Vakuumkammer; • c) ringförmiges, lokal begrenztes Aufschmelzen des Verdampfungsmaterials innerhalb eines inneren Bereiches (3) der Oberfläche des Blockes (1) mittels eines Elektronenstrahls, indem der innere Bereich (3) beginnend an dessen äußerer Begrenzung mittels des Elektronenstrahls auf in sich geschlossenen oder spiralförmigen Bahnen mit kleiner werdendem Bahnradius überstrichen wird; • d) Verdampfen von Verdampfungsmaterial aus einem zentralen Bereich (5) des inneren Bereichs (3) mittels des Elektronenstrahls; • e) Verdampfen von Verdampfungsmaterial aus dem inneren Bereich (3) mittels des Elektronenstrahls und Abscheiden einer Schicht auf dem Substrat.
摘要:
The present invention relates to a device for drilling a substrate (5), in particular a device for generating a hole or recess or well in an electrically insulating or semiconducting substrate (5), more specifically a device for generating a plurality of holes or recesses or wells in an electrically insulating or semiconducting substrate (5). The present invention also relates to a method for drilling a substrate (5). Furthermore, the present invention relates to a use of the device for drilling a substrate (5).
摘要:
Die Erfindung betrifft ein Verfahren zum Herstellen einer epitaktischen Schicht aus einem Halbleitermaterial, bei dem zunächst ein Trockenätzen mindestens eines Oberflächenbereichs eines einkristallinen Substrates innerhalb einer Arbeitskammer erfolgt. Anschließend wird eine nicht-epitaktische Halbleiterschicht auf dem geätzten Oberflächenbereich des einkristallinen Substrates abgeschieden, indem ein Halbleitermaterial mittels eines Elektronenstrahls verdampft wird, wodurch sich Dampfpartikel des verdampften Halbleitermaterials auf dem geätzten Oberflächenbereich des einkristallinen Substrates niederschlagen. Abschließend wird die nicht-epitaktische Halbleiterschicht mittels eines Energieeintrages kristallisiert.
摘要:
A multibeam system in which a charged particle beam and one or more additional beams can be directed to the target within a single vacuum chamber. A first beam column preferably produces a beam for rapid processing, and a second beam column produces a beam for more precise processing. A third beam column can be used to produce a beam useful for forming an image of the sample while producing little or no change in the sample.
摘要:
A process for controllably forming silicon nanostructures such as a silicon quantum wire array. A silicon surface is sputtered by a uniform flow of nitrogen molecular ions in an ultrahigh vacuum so as to form a periodic wave-like relief in which the throughs of said relief are level with the silicon-insulator border of the SOI material. The ion energy, the ion incidence angle to the surface of said material, the temperature of the silicon layer, the formation depth of the wave-like relief, the height of said wave-like relief and the ion penetration range into silicon are all determined on the basis of a selected wavelength of the wave-like relief in the range of 9 nm to 120 nm. A silicon nitride mask having pendant edges is used to define the area of the silicon surface on which the array is formed. Impurities are removed from the silicon surface within the mask window prior to sputtering. For the purpose of forming a silicon quantum wire array, the thickness of the SOI silicon layer is selected to be greater than the sum of said formation depth, said height and said ion penetration range, the fabrication of the silicon wires being controlled by a threshold value of a secondary ion emission signal from the SOI insulator. The nanostructure may be employed in optoelectronic and nanoelectronic devices such as a FET.
摘要:
Provided herein are approaches for forming a gate oxide layer for a DRAM device, the method including providing a finned substrate having a recess formed therein, and performing an ion implant into a sidewall surface of the recess to form a gate oxide layer having a non-uniform thickness, wherein a thickness of the gate oxide layer at a top section of the sidewall surface is greater than a thickness of the gate oxide layer at a bottom section of the sidewall surface. In some approaches, the ion implant is provided as a series of ion implants at multiple different implant angles, varied along with an ion implantation energy and/or an ion dose to increase the thickness of the gate oxide of the top section of the sidewall surface. In some approaches, the finned substrate is also exposed to a plasma, either during or after, the ion implantation.
摘要:
A method for fabricating a multilayer structure includes providing a mask on a device stack disposed on the substrate, the device stack comprising a first plurality of layers composed of a first layer type and a second layer type; directing first ions along a first direction forming a first non-zero angle of incidence with respect to a normal to a plane of the substrate, wherein a first sidewall is formed having a sidewall angle forming a first non-zero angle of inclination with respect to the normal, the first sidewall comprising a second plurality of layers from at least a portion of the first plurality of layers and composed of the first layer type and second layer type; and etching the second plurality of layers using a first selective etch wherein the first layer type is selectively etched with respect to the second layer type.
摘要:
A method is provided for the internal processing of a transparent substrate in preparation for a cleaving step. The substrate is irradiated with a focused laser beam that is comprised of pulses having an energy and pulse duration selected to produce a filament within the substrate. The substrate is translated relative to the laser beam to irradiate the substrate and produce an additional filament at one or more additional locations. The resulting filaments form an array defining an internally scribed path for cleaving said substrate. Laser beam parameters may be varied to adjust the filament length and position, and to optionally introduce V-channels or grooves, rendering bevels to the laser-cleaved edges. Preferably, the laser pulses are delivered in a burst train for lowering the energy threshold for filament formation, increasing the filament length, thermally annealing of the filament modification zone to minimize collateral damage, improving process reproducibility, and increasing the processing speed compared with the use of low repetition rate lasers.
摘要:
Embodiments of methods of modifying surface features (280, 285) on a workpiece (210) with a gas cluster ion beam (202) are generally described herein. Other embodiments may be described and claimed.
摘要:
The objective of the invention is to provide: a substrate holding apparatus that is advantageous in terms of separating a substrate from a seal member in a short time when the substrate is to be unloaded; and a lithography apparatus. The present invention relates to a substrate holding apparatus 10 that holds a substrate 3. The substrate holding apparatus 10 has: a holding member 16 that includes a center portion 40 having suction holes 32 that are formed for the purpose of evacuating a space 42 between the substrate 3 and the holding member, and an outer peripheral portion 41 which surrounds the center portion 40, and which is formed in a position lower than that of the center portion 40; and a seal member 31 with which the holding member 16 is provided, and which defines the space 42. Holes 33 independent from an evacuating system, which is connected to the suction holes 32, are formed in the outer peripheral portion 41 and/or the sealing member 31.