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公开(公告)号:CN104769713A
公开(公告)日:2015-07-08
申请号:CN201380052391.5
申请日:2013-01-09
Applicant: 晟碟半导体(上海)有限公司 , 晟碟信息科技(上海)有限公司
CPC classification number: H01L25/18 , H01L23/145 , H01L23/3128 , H01L23/3135 , H01L23/5389 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/743 , H01L24/83 , H01L24/85 , H01L24/92 , H01L25/00 , H01L25/165 , H01L25/50 , H01L2224/05554 , H01L2224/27318 , H01L2224/2732 , H01L2224/27848 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48228 , H01L2224/49175 , H01L2224/49433 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/83855 , H01L2224/83856 , H01L2224/83986 , H01L2224/85986 , H01L2224/92247 , H01L2225/06562 , H01L2924/00014 , H01L2924/0665 , H01L2924/12042 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/143 , H01L2924/1438 , H01L2924/15311 , H01L2924/181 , H01L2924/19103 , H01L2924/19105 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
Abstract: 公开了包括多个堆叠的半导体裸芯的半导体封装体和形成所述半导体封装体的方法。为了简化对控制器裸芯的引线键合要求,控制器裸芯可以以倒装芯片布置直接安装到基板上,而不需要控制器裸芯之外的引线键合体或足印。然后,可以将隔垫物层附着到基板,在控制器裸芯周围,以提供要安装一个或多个闪存裸芯的平表面。隔垫物层可以设置为各种不同的配置。
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公开(公告)号:CN104769713B
公开(公告)日:2017-12-12
申请号:CN201380052391.5
申请日:2013-01-09
Applicant: 晟碟半导体(上海)有限公司 , 晟碟信息科技(上海)有限公司
CPC classification number: H01L25/18 , H01L23/145 , H01L23/3128 , H01L23/3135 , H01L23/5389 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/743 , H01L24/83 , H01L24/85 , H01L24/92 , H01L25/00 , H01L25/165 , H01L25/50 , H01L2224/05554 , H01L2224/27318 , H01L2224/2732 , H01L2224/27848 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32265 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48228 , H01L2224/49175 , H01L2224/49433 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2224/83855 , H01L2224/83856 , H01L2224/83986 , H01L2224/85986 , H01L2224/92247 , H01L2225/06562 , H01L2924/00014 , H01L2924/0665 , H01L2924/12042 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/143 , H01L2924/1438 , H01L2924/15311 , H01L2924/181 , H01L2924/19103 , H01L2924/19105 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
Abstract: 公开了包括多个堆叠的半导体裸芯的半导体封装体和形成所述半导体封装体的方法。为了简化对控制器裸芯的引线键合要求,控制器裸芯可以以倒装芯片布置直接安装到基板上,而不需要控制器裸芯之外的引线键合体或足印。然后,可以将隔垫物层附着到基板,在控制器裸芯周围,以提供要安装一个或多个闪存裸芯的平表面。隔垫物层可以设置为各种不同的配置。
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公开(公告)号:CN103718279B
公开(公告)日:2017-01-25
申请号:CN201180071126.2
申请日:2011-12-16
Applicant: 晟碟半导体(上海)有限公司 , 晟碟信息科技(上海)有限公司
IPC: H01L21/56 , H01L21/44 , H01L23/34 , H01L23/552
CPC classification number: H01L23/552 , H01L21/561 , H01L21/565 , H01L21/566 , H01L23/4334 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2223/5442 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/1434 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 公开了一种存储装置和制造存储装置的方法,该存储装置包括屏蔽电磁辐射和/或散热的金属层。金属层形成于金属层转印组件上。金属层转印组件和未封装的存储装置被置于模具中并被封装。在封装和固化模塑料期间,将金属层从屏蔽转印到封装的存储装置。
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公开(公告)号:CN103718279A
公开(公告)日:2014-04-09
申请号:CN201180071126.2
申请日:2011-12-16
Applicant: 晟碟半导体(上海)有限公司 , 晟碟信息科技(上海)有限公司
IPC: H01L21/56 , H01L21/44 , H01L23/34 , H01L23/552
CPC classification number: H01L23/552 , H01L21/561 , H01L21/565 , H01L21/566 , H01L23/4334 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/0657 , H01L2223/5442 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2225/06562 , H01L2924/00014 , H01L2924/1434 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2224/85 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: 公开了一种存储装置和制造存储装置的方法,该存储装置包括屏蔽电磁辐射和/或散热的金属层。金属层形成于金属层转印组件上。金属层转印组件和未封装的存储装置被置于模具中并被封装。在封装和固化模塑料期间,将金属层从屏蔽转印到封装的存储装置。
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