Patent search ap:("瑞萨电子株式会社") AND inv:"大崎明彦" Page 1

1.

发明授权
半导体器件及其制造方法有权

公开(公告)号：CN102379036B

公开(公告)日：2015-04-08

申请号：CN200980158496.2

申请日：2009-04-30

Applicant: 瑞萨电子株式会社

Inventor： 松本雅弘 , 藤泽雅彦 , 大崎明彦 , 石井敦司

IPC: H01L21/768 , H01L21/314 , H01L23/522

CPC classification number: H01L23/49503 , H01L21/76801 , H01L21/76807 , H01L21/76811 , H01L21/76832 , H01L23/3128 , H01L23/3192 , H01L23/5329 , H01L23/53295 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/02126 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/1147 , H01L2224/13022 , H01L2224/13099 , H01L2224/16225 , H01L2224/32014 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/73204 , H01L2224/73253 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/12041 , H01L2924/1306 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H01L2924/30105 , H01L2224/81 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2224/05556 , H01L2924/3512 , H01L2924/00012 , H01L2924/01004

Abstract: 本申请发明的目的在于提供一种提高半导体器件可靠性的技术，即使在层间绝缘膜的一部分中使用介电常数低于氧化硅膜的低介电常数膜的情况下，也能够提高半导体器件可靠性。具体而言，为了实现所述目的，由中杨氏模量膜形成构成第1精细层的层间绝缘膜IL1，因此能够使一体化的高杨氏模量层(半导体基板1S与接触层间绝缘膜CIL)与构成第2精细层的层间绝缘膜(低杨氏模量膜、低介电常数膜)IL2不直接接触地分离，能够分散应力。结果能够防止由低杨氏模量膜构成的层间绝缘膜IL2的膜剥离，能够提高半导体器件的可靠性。

2.

发明公开
半导体器件及其制造方法有权

公开(公告)号：CN102379036A

公开(公告)日：2012-03-14

申请号：CN200980158496.2

申请日：2009-04-30

Applicant: 瑞萨电子株式会社

Inventor： 松本雅弘 , 藤泽雅彦 , 大崎明彦 , 石井敦司

IPC: H01L21/768 , H01L21/314 , H01L23/522

CPC classification number: H01L23/49503 , H01L21/76801 , H01L21/76807 , H01L21/76811 , H01L21/76832 , H01L23/3128 , H01L23/3192 , H01L23/5329 , H01L23/53295 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/16 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/97 , H01L2224/02126 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/1147 , H01L2224/13022 , H01L2224/13099 , H01L2224/16225 , H01L2224/32014 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/73204 , H01L2224/73253 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/12041 , H01L2924/1306 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/16195 , H01L2924/181 , H01L2924/30105 , H01L2224/81 , H01L2224/83 , H01L2224/85 , H01L2924/00 , H01L2224/05556 , H01L2924/3512 , H01L2924/00012 , H01L2924/01004

Abstract: 本申请发明的目的在于提供一种提高半导体器件可靠性的技术，即使在层间绝缘膜的一部分中使用介电常数低于氧化硅膜的低介电常数膜的情况下，也能够提高半导体器件可靠性。具体而言，为了实现所述目的，由中杨氏模量膜形成构成第1精细层的层间绝缘膜IL1，因此能够使一体化的高杨氏模量层(半导体基板1S与接触层间绝缘膜CIL)与构成第2精细层的层间绝缘膜(低杨氏模量膜、低介电常数膜)IL2不直接接触地分离，能够分散应力。结果能够防止由低杨氏模量膜构成的层间绝缘膜IL2的膜剥离，能够提高半导体器件的可靠性。

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