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公开(公告)号:CN1245272C
公开(公告)日:2006-03-15
申请号:CN01112135.1
申请日:2001-03-26
申请人: 德克萨斯仪器股份有限公司
CPC分类号: H01L23/53238 , H01L21/288 , H01L23/53233 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/04042 , H01L2224/05082 , H01L2224/05111 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05171 , H01L2224/0518 , H01L2224/05184 , H01L2224/05556 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/0568 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4845 , H01L2224/48463 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48669 , H01L2224/4868 , H01L2224/48724 , H01L2224/48739 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48769 , H01L2224/4878 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/4888 , H01L2224/78252 , H01L2224/78253 , H01L2224/85013 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/10253 , H01L2924/14 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/3025 , H01L2924/01004 , H01L2224/78 , H01L2924/00 , H01L2224/48824 , H01L2224/48869 , H01L2224/48744
摘要: 实现集成电路的互连铜金属化的电气丝/带连接的坚固而可靠的低成本金属结构和工艺。该结构包括沉积在无氧化铜表面上阻止铜扩散的一层阻挡金属层(从镍、钴、铬、钼、钛、钨及其合金中选出),其厚度能把在250℃下铜的扩散比没有阻挡金属层时减少超过80%;以及最外可焊接层(最外可焊接金属层从金、铂和银中选出),它能把在250℃下阻挡金属层的扩散比没有可焊接金属时减少超过80%。最后,把一金属丝焊接到最外层以进行冶金连接。
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公开(公告)号:CN105047572A
公开(公告)日:2015-11-11
申请号:CN201510101427.5
申请日:2015-03-09
申请人: 富士电机株式会社
IPC分类号: H01L21/60
CPC分类号: H01L24/78 , B23K20/004 , B23K20/10 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/05599 , H01L2224/29101 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48227 , H01L2224/4847 , H01L2224/73265 , H01L2224/78252 , H01L2224/78313 , H01L2224/78353 , H01L2224/78611 , H01L2224/789 , H01L2224/85048 , H01L2224/85099 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/85207 , H01L2224/85399 , H01L2224/859 , H01L2924/00014 , H01L2924/2076 , H01L2924/20102 , H01L2924/20103 , H01L2924/014 , H01L2924/00 , H01L2924/00015
摘要: 提供一种能够将直径500μm以上且600μm以下的引线接合到半导体元件上的电极的引线接合装置以及引线接合方法。在本发明的引线接合装置、即通过引线接合来对电极与铝合金制的引线进行电连接的引线接合装置(100)中,具备:引线提供装置(10),其用于提供直径500μm以上且600μm以下的引线(6);加热装置(11),其用于将引线(6)加热到50℃以上且100℃以下;加压装置(12),其用于在电极(2、7)处对引线(6)进行加压;以及超声波产生装置(13),其用于对由加压装置(12)加压后的引线(6)施加超声波振动。
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公开(公告)号:CN105047572B
公开(公告)日:2019-07-05
申请号:CN201510101427.5
申请日:2015-03-09
申请人: 富士电机株式会社
IPC分类号: H01L21/60
CPC分类号: H01L24/78 , B23K20/004 , B23K20/10 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L2224/05599 , H01L2224/29101 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45147 , H01L2224/48227 , H01L2224/4847 , H01L2224/73265 , H01L2224/78252 , H01L2224/78313 , H01L2224/78353 , H01L2224/78611 , H01L2224/789 , H01L2224/85048 , H01L2224/85099 , H01L2224/85181 , H01L2224/85201 , H01L2224/85205 , H01L2224/85207 , H01L2224/85399 , H01L2224/859 , H01L2924/00014 , H01L2924/2076 , H01L2924/20102 , H01L2924/20103 , H01L2924/014 , H01L2924/00 , H01L2924/00015
摘要: 提供一种能够将直径500μm以上且600μm以下的引线引线接合到半导体元件上的电极的引线接合装置以及引线接合方法。在本发明的引线接合装置、即通过引线接合来对电极与铝合金制的引线进行电连接的引线接合装置(100)中,具备:引线提供装置(10),其用于提供直径500μm以上且600μm以下的引线(6);加热装置(11),其用于将引线(6)加热到50℃以上且100℃以下;加压装置(12),其用于在电极(2、7)处对引线(6)进行加压;以及超声波产生装置(13),其用于对由加压装置(12)加压后的引线(6)施加超声波振动。
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公开(公告)号:CN103377958B
公开(公告)日:2016-03-23
申请号:CN201310115912.9
申请日:2013-04-03
申请人: 先进科技新加坡有限公司
IPC分类号: H01L21/603
CPC分类号: H01L24/81 , H01L24/13 , H01L24/16 , H01L24/75 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16238 , H01L2224/75251 , H01L2224/75263 , H01L2224/75744 , H01L2224/75753 , H01L2224/78252 , H01L2224/78253 , H01L2224/81048 , H01L2224/81121 , H01L2224/81191 , H01L2224/81203 , H01L2224/81224 , H01L2224/81907 , H01L2224/81986 , H01L2224/9205 , H01L2924/07802 , H01L2924/12042 , H01L2924/15192 , H01L2924/15311 , H01L2924/00014 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00
摘要: 本发明公开了一种热压缩键合,准备晶粒进行热压缩键合,首先将晶粒上的电气触点和衬底上的键合盘对齐定位,该晶粒将被安装至该衬底上;在对齐定位晶粒之后,使用键合工具将晶粒上的电气触点抵靠于衬底上的键合盘固定;通过提供热量至晶粒的局部以将晶粒的局部处的温度提升至电气触点所包含的焊料的熔点之上以致于熔融设置在晶粒所述局部的电气触点的至少部分焊料的方式,将晶粒部分键合至衬底上;其后将整个晶粒热压缩,和加热至电气触点的焊料的熔点之上,以便于位于晶粒所述局部之外的电气触点的焊料也被熔融而将晶粒键合至衬底上。
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公开(公告)号:CN103377958A
公开(公告)日:2013-10-30
申请号:CN201310115912.9
申请日:2013-04-03
申请人: 先进科技新加坡有限公司
IPC分类号: H01L21/603
CPC分类号: H01L24/81 , H01L24/13 , H01L24/16 , H01L24/75 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16238 , H01L2224/75251 , H01L2224/75263 , H01L2224/75744 , H01L2224/75753 , H01L2224/78252 , H01L2224/78253 , H01L2224/81048 , H01L2224/81121 , H01L2224/81191 , H01L2224/81203 , H01L2224/81224 , H01L2224/81907 , H01L2224/81986 , H01L2224/9205 , H01L2924/07802 , H01L2924/12042 , H01L2924/15192 , H01L2924/15311 , H01L2924/00014 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00
摘要: 本发明公开了一种热压缩键合,准备晶粒进行热压缩键合,首先将晶粒上的电气触点和衬底上的键合盘对齐定位,该晶粒将被安装至该衬底上;在对齐定位晶粒之后,使用键合工具将晶粒上的电气触点抵靠于衬底上的键合盘固定;通过提供热量至晶粒的局部以将晶粒的局部处的温度提升至电气触点所包含的焊料的熔点之上以致于熔融设置在晶粒所述局部的电气触点的至少部分焊料的方式,将晶粒部分键合至衬底上;其后将整个晶粒热压缩,和加热至电气触点的焊料的熔点之上,以便于位于晶粒所述局部之外的电气触点的焊料也被熔融而将晶粒键合至衬底上。
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公开(公告)号:CN1317389A
公开(公告)日:2001-10-17
申请号:CN01112135.1
申请日:2001-03-26
申请人: 德克萨斯仪器股份有限公司
CPC分类号: H01L23/53238 , H01L21/288 , H01L23/53233 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/04042 , H01L2224/05082 , H01L2224/05111 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05171 , H01L2224/0518 , H01L2224/05184 , H01L2224/05556 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/0568 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4845 , H01L2224/48463 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48669 , H01L2224/4868 , H01L2224/48724 , H01L2224/48739 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48769 , H01L2224/4878 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/4888 , H01L2224/78252 , H01L2224/78253 , H01L2224/85013 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/10253 , H01L2924/14 , H01L2924/19043 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/3025 , H01L2924/01004 , H01L2224/78 , H01L2924/00 , H01L2224/48824 , H01L2224/48869 , H01L2224/48744
摘要: 实现集成电路的互连铜金属化的电气丝/带连接的坚固而可靠的低成本金属结构和工艺。该结构包括沉积在无氧化铜表面上阻止铜扩散的一层阻挡层金属(从镍、钴、铬、钼、钛、钨及其合金中选出),其厚度能把在250℃下铜的扩散比没有阻挡层金属时减少不止80%;以及最外可焊接层(最外可焊接金属层从金、铂和银中选出),它能把在250℃下阻挡层金属的扩散比没有可焊接金属时减少不止80%。最后,把一金属丝焊接到最外层以进行冶金连接。
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