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公开(公告)号：CN105514073B
公开(公告)日：2018-06-22
申请号：CN201510621969.5
申请日：2015-09-25
申请人： 台湾积体电路制造股份有限公司
IPC分类号： H01L23/488 , H01L23/48 , H01L23/538 , H01L21/768 , H01L21/60
CPC分类号： H01L23/481 , H01L21/2885 , H01L21/76847 , H01L21/7685 , H01L21/76885 , H01L21/76898 , H01L23/525 , H01L23/53214 , H01L23/53228 , H01L23/53242 , H01L24/03 , H01L24/05 , H01L24/13 , H01L29/43 , H01L2224/0345 , H01L2224/03462 , H01L2224/0347 , H01L2224/03616 , H01L2224/0391 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05005 , H01L2224/05018 , H01L2224/05023 , H01L2224/05025 , H01L2224/05026 , H01L2224/05099 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/0518 , H01L2224/05181 , H01L2224/05184 , H01L2224/05541 , H01L2224/05552 , H01L2224/05567 , H01L2224/05568 , H01L2224/0557 , H01L2224/05571 , H01L2224/0558 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/0568 , H01L2224/05681 , H01L2224/1131 , H01L2224/1134 , H01L2224/11849 , H01L2224/13111 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2924/00 , H01L2924/00011 , H01L2924/00012 , H01L2924/00014 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/207
摘要： 本发明公开了一种互连结构和用于提供互连结构的方法，该互连结构包括具有减小的形貌变化的导电部件。互连结构包括设置在衬底上方的接触焊盘。接触焊盘包括第一导电材料的第一层和位于第一层上方的第二导电材料的第二层。第一导电材料和第二导电材料由基本相同的材料制成并且具有第一平均晶粒尺寸和第二平均晶粒尺寸，第二平均晶粒尺寸小于第一平均晶粒尺寸。互连结构还包括覆盖衬底和接触焊盘的钝化层，并且钝化层具有暴露出接触焊盘的开口。本发明还涉及具有限制层的互连结构。
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公开(公告)号：CN105210157A
公开(公告)日：2015-12-30
申请号：CN201480021985.4
申请日：2014-09-12
申请人： 积水化学工业株式会社
CPC分类号： H01R13/03 , H01B1/22 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0568 , H01L2224/05684 , H01L2224/2732 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29338 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29366 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29401 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29416 , H01L2224/29417 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29471 , H01L2224/29486 , H01L2224/29487 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32227 , H01L2224/83101 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8348 , H01L2224/83484 , H01L2224/83851 , H01L2224/83855 , H01L2224/83862 , H01L2224/83877 , H01L2924/15788 , H01R4/04 , H05K3/323 , H05K3/361 , H05K2201/0218 , H05K2201/0221 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05342 , H01L2924/0549 , H01L2924/0532 , H01L2924/01056 , H01L2924/0534 , H01L2924/01022 , H01L2924/01006 , H01L2924/01014 , H01L2924/01032 , H01L2924/01048 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2924/01015 , H01L2924/01005 , H01L2924/0781 , H01L2924/04563 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012
摘要： 本发明提供一种导电性粒子，其对电极间进行电连接的情况下，可以降低连接电阻。本发明的导电性粒子1具备：基材粒子2、配置于基材粒子2表面上的导电部3，导电部3在外表面上具有多个突起3a，导电部3具有晶体结构，在导电部3的具有突起3a的部分和不具有突起3a的部分，晶体结构是连续的。
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公开(公告)号：CN103124999B
公开(公告)日：2015-06-10
申请号：CN201180046428.4
申请日：2011-09-26
申请人： 积水化学工业株式会社
发明人： 王晓舸
CPC分类号： H01L24/29 , C08K9/02 , C09J9/02 , C09J11/04 , H01L24/05 , H01L24/16 , H01L24/32 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0568 , H01L2224/05684 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29347 , H01L2224/29386 , H01L2224/2939 , H01L2224/29447 , H01L2224/32145 , H01L2224/32227 , H01L2224/83101 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15788 , H01L2924/00 , H01L2924/3512
摘要： 本发明提供一种导电性粒子及使用了该导电性粒子各向异性导电材料及连接结构体，其中，即使对导电性粒子赋予较大的力，在导电层中也不易产生较大的裂纹。本发明的导电性粒子(1)具备基体材料粒子(2)和设置在该基体材料粒子(2)的表面(2a)上的铜-锡层(3)。铜-锡层(3)含有铜和锡的合金。铜-锡层(3)整体中的铜的含量为超过20重量%且75重量%以下，且锡的含量为25重量%以上且低于80重量%。本发明的各向异性导电材料含有导电性粒子(1)和粘合剂树脂。本发明的连接结构体具备第一连接对象部件、第二连接对象部件和连接该第一、第二连接对象部件的连接部。上述连接部由导电性粒子(1)或含有导电性粒子(1)的各向异性导电材料形成。
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公开(公告)号：CN104471650A
公开(公告)日：2015-03-25
申请号：CN201380037610.2
申请日：2013-09-30
申请人： 积水化学工业株式会社
发明人： 西冈敬三
CPC分类号： H01B1/02 , B22F1/025 , H01B1/04 , H01B1/22 , H01B1/24 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05187 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0568 , H01L2224/05684 , H01L2224/271 , H01L2224/2731 , H01L2224/2732 , H01L2224/27334 , H01L2224/2929 , H01L2224/29338 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29366 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29399 , H01L2224/294 , H01L2224/29401 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29414 , H01L2224/29416 , H01L2224/29417 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29438 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/2946 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29471 , H01L2224/2948 , H01L2224/29484 , H01L2224/29487 , H01L2224/2949 , H01L2224/29499 , H01L2224/32227 , H01L2224/8301 , H01L2224/83022 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2924/15788 , H01L2924/30101 , H01L2924/365 , H01R11/01 , H01R13/03 , H05K3/323 , H05K3/361 , H05K2201/0221 , H01L2924/00012 , H01L2924/05442 , H01L2924/01006 , H01L2924/00014 , H01L2924/01014 , H01L2924/01032 , H01L2924/01048 , H01L2924/0543 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/01015 , H01L2924/01005 , H01L2924/04563 , H01L2924/04541 , H01L2924/0455 , H01L2924/01073 , H01L2924/01013 , H01L2924/01031 , H01L2924/00
摘要： 本发明提供一种在对电极间进行了连接的情况下可以使连接电阻降低的导电性粒子、以及使用了该导电性粒子的导电材料。本发明的导电性粒子1具备基体材料粒子2、以及在基体材料粒子2的表面上的一部分区域配置的导电材料4，且导电材料4的材质为莫氏硬度高于镍的材质。
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公开(公告)号：CN103650063A
公开(公告)日：2014-03-19
申请号：CN201280033707.1
申请日：2012-07-25
申请人： 积水化学工业株式会社
CPC分类号： H01R4/04 , H01B1/22 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0568 , H01L2224/05684 , H01L2224/2929 , H01L2224/294 , H01L2224/29455 , H01L2224/29484 , H01L2224/29499 , H01L2224/32225 , H01L2224/83851 , H01L2224/83855 , H01L2924/00014 , H01L2924/15788 , H01L2924/01005 , H01L2224/05552 , H01L2924/00
摘要： 本发明的目的在于提供能够抑制多个导电性粒子发生凝聚、并且在用于电极间的连接时能够降低电极间的接触电阻的导电性粒子，以及使用了该导电性粒子的导电材料。本发明的导电性粒子(1)具有基体材料粒子(2)和导电层(3)，该导电层(3)设置于基体材料粒子(2)的表面上，且包含钨和钼中的至少一种金属成分以及镍、硼。
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公开(公告)号：CN102194761B
公开(公告)日：2013-07-24
申请号：CN201010257040.6
申请日：2010-08-17
申请人： 台湾积体电路制造股份有限公司
IPC分类号： H01L23/00
CPC分类号： H01L21/6836 , H01L23/3114 , H01L24/13 , H01L2221/68327 , H01L2221/68381 , H01L2221/68386 , H01L2224/0401 , H01L2224/05624 , H01L2224/05655 , H01L2224/0568 , H01L2224/1132 , H01L2224/1146 , H01L2224/11849 , H01L2224/13099 , H01L2224/13111 , H01L2924/14 , H01L2924/00014 , H01L2924/00
摘要： 本发明涉及一种无残留物晶片的制造方法。有机粘着胶带通常于凸块形成后在晶片制作的过程中用来固定与保护凸块。在所述制造方法中，于胶带去层压后，若有机粘着胶带残留于晶片上，则于层压胶带前，涂布一凸块模板层于凸块上，以便于残留物后续移除，得到一无残留物晶片。本发明实施例的方法能够于晶片研磨后形成无残留物(residue-free)凸块区域且允许一宽的工艺容许度。
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公开(公告)号：CN101752334A
公开(公告)日：2010-06-23
申请号：CN200910224397.1
申请日：2009-12-02
申请人： 株式会社瑞萨科技
IPC分类号： H01L23/48 , H01L23/485 , H01L23/49 , H01L21/60
CPC分类号： H01L24/05 , H01L21/565 , H01L22/32 , H01L23/485 , H01L23/49816 , H01L24/06 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/81 , H01L24/85 , H01L25/0657 , H01L2224/02166 , H01L2224/02205 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/05027 , H01L2224/05082 , H01L2224/05083 , H01L2224/05084 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05173 , H01L2224/05181 , H01L2224/05184 , H01L2224/05553 , H01L2224/05554 , H01L2224/05558 , H01L2224/05564 , H01L2224/05568 , H01L2224/05572 , H01L2224/05583 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/0568 , H01L2224/06183 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/2919 , H01L2224/29198 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/4502 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/46 , H01L2224/4807 , H01L2224/48095 , H01L2224/48145 , H01L2224/48158 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48471 , H01L2224/48507 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/4868 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/4878 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/4888 , H01L2224/49171 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81193 , H01L2224/81801 , H01L2224/83101 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2225/0651 , H01L2225/06517 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01065 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/078 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H01L2924/00014 , H01L2924/01039 , H01L2924/0665 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2924/0002 , H01L2924/00015
摘要： 本发明提供一种半导体集成电路器件。在用于车辆用途等的半导体集成电路器件中，为便于安装，通常通过导线键合等，使用金导线等将半导体芯片上的铝焊盘和外部器件彼此耦合。然而，这种半导体集成电路器件由于在相对较高温度(约150℃)下长时间的使用中铝和金之间的相互作用而造成连接故障。本申请的发明提供一种半导体集成电路器件(半导体器件或电子电路器件)，其包括作为该器件的一部分的半导体芯片、经由阻挡金属膜设置在半导体芯片上基于铝的键合焊盘之上的电解金镀覆表面膜(基于金的金属镀覆膜)和用于该镀覆表面膜和设置在布线板等(布线衬底)之上的外部引线之间的互连的金键合导线(基于金的键合导线)。
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公开(公告)号：CN105009266A
公开(公告)日：2015-10-28
申请号：CN201380074382.6
申请日：2013-10-04
申请人： 三菱电机株式会社
CPC分类号： H01L24/05 , H01L21/78 , H01L23/49531 , H01L23/49562 , H01L24/03 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/83 , H01L24/95 , H01L2224/0345 , H01L2224/0347 , H01L2224/03848 , H01L2224/04026 , H01L2224/05007 , H01L2224/05011 , H01L2224/05073 , H01L2224/05124 , H01L2224/05563 , H01L2224/05565 , H01L2224/05583 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05666 , H01L2224/0568 , H01L2224/26145 , H01L2224/29027 , H01L2224/291 , H01L2224/29111 , H01L2224/32257 , H01L2224/33181 , H01L2224/45015 , H01L2224/45124 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/48472 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48755 , H01L2224/48766 , H01L2224/4878 , H01L2224/73215 , H01L2224/73265 , H01L2224/831 , H01L2224/83801 , H01L2224/83815 , H01L2224/94 , H01L2924/1305 , H01L2924/13055 , H01L2924/181 , H01L2924/014 , H01L2924/00012 , H01L2924/00014 , H01L2924/01047 , H01L2924/01029 , H01L2924/01014 , H01L2224/03 , H01L2924/00
摘要： 元件电极(103)设置于半导体元件(101)的表面。金属膜(105)设置于元件电极(103)上，并具有内侧区域(105a)和位于内侧区域(105a)周围的外侧区域(105b1)。在金属膜(105)中设置有在内侧区域(105a)及外侧区域(105b1)之间将元件电极(103)露出的开口(TR)。元件电极(103)具有比金属膜(105)的焊料浸润性低的焊料浸润性。外部电极(117)与金属膜(105)的内侧区域(105a)进行焊料接合。
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公开(公告)号：CN103681595A
公开(公告)日：2014-03-26
申请号：CN201310725962.9
申请日：2009-12-02
申请人： 瑞萨电子株式会社
IPC分类号： H01L23/498 , H01L23/49
CPC分类号： H01L24/05 , H01L21/565 , H01L22/32 , H01L23/485 , H01L23/49816 , H01L24/06 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/78 , H01L24/81 , H01L24/85 , H01L25/0657 , H01L2224/02166 , H01L2224/02205 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/05027 , H01L2224/05082 , H01L2224/05083 , H01L2224/05084 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05173 , H01L2224/05181 , H01L2224/05184 , H01L2224/05553 , H01L2224/05554 , H01L2224/05558 , H01L2224/05564 , H01L2224/05568 , H01L2224/05572 , H01L2224/05583 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/0568 , H01L2224/06183 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/2919 , H01L2224/29198 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/4502 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/46 , H01L2224/4807 , H01L2224/48095 , H01L2224/48145 , H01L2224/48158 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48471 , H01L2224/48507 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/4868 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/4878 , H01L2224/48824 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/4888 , H01L2224/49171 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/78301 , H01L2224/81193 , H01L2224/81801 , H01L2224/83101 , H01L2224/85181 , H01L2224/85186 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2225/0651 , H01L2225/06517 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01061 , H01L2924/01065 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/078 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H01L2924/00014 , H01L2924/01039 , H01L2924/0665 , H01L2224/48227 , H01L2924/00 , H01L2924/00012 , H01L2924/0002 , H01L2924/00015
摘要： 本发明提供一种半导体集成电路器件。在用于车辆用途等的半导体集成电路器件中，为便于安装，通常通过导线键合等，使用金导线等将半导体芯片上的铝焊盘和外部器件彼此耦合。然而，这种半导体集成电路器件由于在相对较高温度(约150℃)下长时间的使用中铝和金之间的相互作用而造成连接故障。本申请的发明提供一种半导体集成电路器件(半导体器件或电子电路器件)，其包括作为该器件的一部分的半导体芯片、经由阻挡金属膜设置在半导体芯片上基于铝的键合焊盘之上的电解金镀覆表面膜(基于金的金属镀覆膜)和用于该镀覆表面膜和设置在布线板等(布线衬底)之上的外部引线之间的互连的金键合导线(基于金的键合导线)。
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公开(公告)号：CN102810623A
公开(公告)日：2012-12-05
申请号：CN201210083699.3
申请日：2012-03-27
申请人： LG伊诺特有限公司
IPC分类号： H01L33/62 , F21S2/00 , F21Y101/02
CPC分类号： H01L33/62 , F21K9/27 , F21Y2113/13 , F21Y2115/10 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0753 , H01L2224/05609 , H01L2224/05623 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05671 , H01L2224/05676 , H01L2224/05679 , H01L2224/0568 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/4848 , H01L2224/48499 , H01L2224/48997 , H01L2224/4911 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/12041 , H01L2924/181 , H01L2924/19107 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/48455
摘要： 公开了一种发光器件封装和照明系统。该发光器件封装包括：布置在第一引线框架上的发光器件，在该发光器件的上表面上具有电极焊盘；用于将电极焊盘和与第一引线框架间隔开的第二引线框架相互电连接的第一金属线；和布置在第二引线框架上的第一焊接球，该第一焊接球从与第一金属线和第二引线框架接触的第一接触点间隔开，其中第一焊接球布置在第一金属线和第二引线框架之间以将第一金属线和第二引线框架相互电连接。在该发光器件封装中，在金属线焊接时使用焊接球固定金属线，由此防止金属线在与引线框架间的焊接部分处从引线框架分离。而且，金属线经由焊接球而被电连接到引线框架，由此改善金属线焊接的可靠性。
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