公开(公告)号：EP2617515B1

公开(公告)日：2018-10-10

申请号：EP11814671.1

申请日：2011-08-03

Applicant: Senju Metal Industry Co., Ltd

Inventor： SAKAMOTO Yoshitsugu ,  YAMADA Hiroyuki ,  YAMANAKA Yoshie ,  OHNISHI Tsukasa ,  YOSHIKAWA Shunsaku ,  TADOKORO Kenzo

IPC: B23K35/14 ,  B22F3/26 ,  B23K1/00 ,  B23K35/26 ,  B23K35/30 ,  B23K35/40 ,  C22C9/02 ,  C22C13/00 ,  H01L21/52 ,  H05K3/34 ,  B23K101/40 ,  B23K35/02 ,  C22C1/08 ,  H01L23/373 ,  H01L23/00

CPC classification number: B23K35/262 ,  B22F2998/00 ,  B23K35/025 ,  B23K35/302 ,  B23K2101/40 ,  C22C1/08 ,  C22C9/02 ,  C22C13/00 ,  H01L23/3735 ,  H01L24/07 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29198 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83065 ,  H01L2224/8309 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01021 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/203 ,  H05K3/3463 ,  H05K2201/0116 ,  Y10T428/12479 ,  H01L2924/00014 ,  C22C1/0483 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2924/0002

Abstract: A semiconductor device is provided which has internal bonds which do not melt at the time of mounting on a substrate. A bonding material is used for internal bonding of the semiconductor device. The bonding material is obtained by filling the pores of a porous metal body having a mesh-like structure and covering the surface thereof with Sn or an Sn-based solder alloy.

公开(公告)号：EP2662151B1

公开(公告)日：2018-08-29

申请号：EP13159886.4

申请日：2013-03-19

Applicant: IMEC VZW ,  St. Petersburg Electrotechnical University

Inventor： Luchinin, Victor ,  Goloudina, Svetlana ,  Pasyuta, Vyacheslav ,  Ivanov, Alexey ,  Baklanov, Mikhail ,  Krishtab, Mikhail

IPC: B05D1/20 ,  C08G73/00 ,  H05K3/28

CPC classification number: B32B37/15 ,  B05D1/20 ,  B05D1/208 ,  B32B18/00 ,  B32B27/04 ,  B32B27/281 ,  B32B2260/046 ,  B32B2305/026 ,  B32B2305/07 ,  B32B2307/00 ,  B32B2307/204 ,  B32B2379/08 ,  B32B2457/00 ,  C08G73/1067 ,  C09D179/08 ,  H01L21/02285 ,  H01L21/02318 ,  H05K1/03 ,  H05K3/143 ,  H05K2201/01 ,  H05K2201/0104 ,  H05K2201/0116 ,  H05K2201/0154 ,  H05K2201/0162 ,  Y10T428/249979 ,  Y10T428/249991 ,  C08K5/175

Abstract: Method for pore sealing a porous substrate, comprising: forming a continuous monolayer of a polyimide precursor on a liquid surface, transferring said polyimide precursor monolayer onto the porous substrate with the Langmuir-Blodgett technique, and imidization of the transferred polyimide precursor monolayers, thereby forming a polyimide sealing layer on the porous substrate. Porous substrate having at least one surface on which a sealing layer is provided to seal pores of the substrate, wherein the sealing layer is a polyimide having a thickness of a few monolayers and wherein there is no penetration of the polyimide into the pores.

公开(公告)号：EP2413674B1

公开(公告)日：2018-08-01

申请号：EP11164848.1

申请日：2011-05-04

Applicant: Nitto Denko Corporation

Inventor： Hasegawa, Mineyoshi ,  Okumura, Keisuke ,  Inoue, Shinichi ,  Hanazono, Hiroyuki

IPC: H05K1/03 ,  C08J5/18 ,  C08L27/12 ,  H01B3/44 ,  H01M8/10 ,  H05K3/10 ,  H05K3/06

CPC classification number: H05K1/034 ,  H01B3/445 ,  H05K1/0393 ,  H05K3/06 ,  H05K3/108 ,  H05K3/28 ,  H05K2201/0116 ,  H05K2201/015

Abstract: A plurality of conductor traces (2) are formed on a porous base insulating layer (1) made of porous ePTFE (expanded polytetrafluoroethylene). Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer (3) is formed on the base insulating layer to cover each conductor trace. The ePTFE used as the porous base insulating layer has continuous pores. An average pore size of the ePTFE is not less than 0.05 µm and not more than 1.0 µm.

公开(公告)号：EP3325264A1

公开(公告)日：2018-05-30

申请号：EP16741600.7

申请日：2016-07-18

Applicant: Rogers Germany GmbH

Inventor： MEYER, Andreas ,  SCHMIDT, Karsten

IPC: B32B5/12 ,  B32B5/20 ,  B32B7/12 ,  B32B9/00 ,  B32B9/04 ,  B32B9/06 ,  B32B29/08

CPC classification number: B32B9/005 ,  B32B5/12 ,  B32B5/20 ,  B32B7/12 ,  B32B9/041 ,  B32B9/06 ,  B32B15/043 ,  B32B15/12 ,  B32B15/20 ,  B32B29/002 ,  B32B29/08 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2264/107 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2307/54 ,  B32B2457/08 ,  B32B2605/00 ,  C25D11/005 ,  C25D11/04 ,  C25D11/08 ,  C25D17/12 ,  H01L23/3735 ,  H05K1/0201 ,  H05K1/0313 ,  H05K1/053 ,  H05K3/4688 ,  H05K2201/0116 ,  H05K2201/0338 ,  H05K2203/0315 ,  H05K2203/11 ,  H05K2203/1126

Abstract: The invention relates to a substrate (1, 10) for electrical circuits, comprising at least one metal layer (2, 3, 14) and a paper ceramic layer (11), which is joined face to face with the at least one metal layer (2, 3, 14) and has a top side and bottom side (11a, 11b), wherein the paper ceramic layer (11) has a large number of cavities in the form of pores. Especially advantageously, the at least one metal layer (2, 3, 14) is connected to the paper ceramic layer (11) by means of at least one glue layer (6, 6a, 6b), which is produced by applying at least one glue (6a', 6a'', 6b', 6b'') to the metal layer (2, 3, 14) and/or to the paper ceramic layer (11), wherein the cavities in the form of pores in the paper ceramic layer (11) are filled at least at the surface by means of the applied glue (6a', 6a'', 6b', 6b'').

公开(公告)号：EP1976007B1

公开(公告)日：2017-11-29

申请号：EP08005811.8

申请日：2008-03-27

Applicant: Fujifilm Corporation

Inventor： Hotta, Yoshinori ,  Touma, Takashi ,  Hatanaka, Yusuke

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49827 ,  G01R1/06755 ,  G01R1/07378 ,  H01L21/486 ,  H01L2924/0002 ,  H01L2924/3025 ,  H05K3/4038 ,  H05K2201/0116 ,  H05K2203/0315 ,  H01L2924/00

Abstract: An anisotropically conductive member has an insulating base material, and conductive paths composed of a conductive material which pass in a mutually insulated state through the insulating base material in a thickness direction thereof and which are provided in such a way that a first end of each conductive path is exposed on a first side of the insulating base material and a second end of each conductive path is exposed on a second side of the insulating base material. The conductive paths have a density of at least 2 million paths/mm 2 and the insulating base material is a structure composed of an anodized aluminum film having micropores therein.

公开(公告)号：EP2299452A4

公开(公告)日：2017-08-02

申请号：EP09794425

申请日：2009-07-07

Applicant: FUJIFILM CORP

Inventor： HATANAKA YUSUKE ,  SUZUKI SHINYA

IPC: H05K3/32 ,  H01L23/00

CPC classification number: H05K3/323 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16 ,  H01L2224/29076 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/3011 ,  H05K2201/0116 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2203/1189 ,  Y10T428/24997 ,  Y10T428/24998 ,  H01L2924/00

公开(公告)号：EP3068927A1

公开(公告)日：2016-09-21

申请号：EP14784375.9

申请日：2014-10-13

Applicant: Cambridge Nanotherm Limited

Inventor： SHASHKOV, Pavel ,  USOV, Sergey

IPC: C25D11/02 ,  C25D11/06 ,  H05K1/05

CPC classification number: H05K1/028 ,  C25D11/02 ,  C25D11/024 ,  H05K1/0237 ,  H05K1/0306 ,  H05K1/05 ,  H05K1/053 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/44 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2203/0315 ,  H05K2203/1147

Abstract: A flexible electronic substrate (FES) includes a metallic layer, a dielectric nanoceramic layer formed by oxidation of a surface of the metallic layer, and an electrical circuit formed on a surface of the dielectric layer. The FES may be used for supporting a device, for example a flexible display, an OLED, an optoelectronic device, or a rf device. The dielectric nanoceramic layer has a crystalline structure consisting of substantially equiaxed grains having an average grain size of 100 nanometres or less, a thickness of between 1 micrometre and 50 micrometres, a dielectric strength of greater than 20 KV mm−1, and a thermal conductivity of greater than 3 W/mK. The FES has a minimum bend radius of lower than 25 cm.

公开(公告)号：EP2926367A4

公开(公告)日：2016-07-27

申请号：EP12889427

申请日：2012-12-03

Applicant: NCC NANO LLC

Inventor： EDD ANDREW E ,  MUNSON CHARLES C

IPC: H05K3/12 ,  H01B1/22 ,  H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/14

CPC classification number: H01B1/22 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K3/102 ,  H05K3/1283 ,  H05K3/14 ,  H05K2201/0116 ,  H05K2203/0143 ,  H05K2203/0278 ,  H05K2203/1545

公开(公告)号：EP1636300B1

公开(公告)日：2015-12-23

申请号：EP04752732.0

申请日：2004-05-20

Applicant: Dow Global Technologies LLC ,  Valette, Ludovic

Inventor： MARESIN, Catherine ,  MERCIER, Regis

IPC: C08J9/26 ,  C08G59/14

CPC classification number: B32B15/08 ,  B32B27/04 ,  B32B2457/00 ,  B82Y30/00 ,  C08G59/1433 ,  C08G59/1438 ,  C08G59/18 ,  H05K1/0313 ,  H05K3/0011 ,  H05K2201/0116 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/24998 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529

公开(公告)号：EP2273181B1

公开(公告)日：2014-05-07

申请号：EP10168269.8

申请日：2010-07-02

Applicant: Siteco Beleuchtungstechnik GmbH

Inventor： Metzeroth, Stefan ,  Meyer, Clemens ,  Härtl, Michael

IPC: F21V29/00 ,  F21K99/00 ,  H05K1/05 ,  F21Y101/02 ,  F21W131/10 ,  H05K3/14

CPC classification number: H05K1/053 ,  F21V3/00 ,  F21V29/70 ,  F21W2131/10 ,  F21W2131/103 ,  F21W2131/107 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K3/14 ,  H05K3/246 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09018 ,  H05K2201/10106