摘要:
[Subject] To provide an integral extrusion-molded item and a constructional member comprising the same, comprising a covering layer which shows sufficient adhesiveness even after long-term storage or use, and repeated heating and cooling or contact with water. [Means to Solve] An integral extrusion-molded item comprising a metal core, a covering layer containing a polyolefin resin and wood flour and formed over the external surface of the core, and an adhesive layer formed between the covering layer and the core, wherein the adhesive layer comprised a copolymer prepared by polymerizing at least an ±-olefin and an epoxy group-containing unsaturated monomer.
摘要:
There are provided a resin composition which has excellent heat resistance, exhibits high optical reflectance in an ultraviolet light region and a visible light region, undergoes less deterioration in optical reflectance when subjected to a heat treatment, and can be used suitably for an LED-mounting printed wiring board; a prepreg containing the resin composition; and a metal foil-clad laminate containing the resin composition, or the like. The resin composition of the present invention contains a fluorene-containing epoxy resin (A) having a specific structure, an acid anhydride (B) of a completely or partially hydrogenated product of an aromatic polycarboxylic acid, titanium dioxide (C), and a wet dispersing agent (D).
摘要:
The present invention provides a resin composition that not only has high flame retardancy but also has excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and a single-layer or laminated sheet using the same, a metal foil-clad laminate using the prepreg, and the like. The resin composition of the present invention is a resin composition having polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by the following formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. wherein m represents an integer of 1 to 3.
摘要:
The invention relates to an adhesion promoter composition containing at least one polymer A selected from at least one epoxy resin-phenolic resin pre-condensate, a mixture of at least one epoxy resin-phenolic resin pre-condensate and epoxy resins, a mixture of epoxy resins and phenolic resins, polyamide resins or blends thereof, and also relates to at least one copolyamide-based hot-melt adhesive. Further disclosed is a primer composition containing at least one polymer B selected from saturated polyester resins, epoxy resin-phenolic resin pre-condensates, mixtures of epoxy resins and phenolic resins and blends thereof, at least one cross-linking resin selected from the group consisting of melamine resins, blocked isocyanate resins or blends thereof, at least one catalyst and at least one copolyamide-based hot-melt adhesive.
摘要:
This invention discloses a new process of preparing highly reflective coatings with thermal resistance on substrates of metals. The thermal resistant coating layers include a mirror-like coating with high reflectivity and a transparent protective coating, which are coated on metallic substrates with surfaces pre-treated by anodizing or thermal resistant primers (base coating layers).