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    ELEKTRONISCHE SCHALTUNG
    115.
    发明公开
    ELEKTRONISCHE SCHALTUNG 审中-公开

    公开(公告)号：EP2294618A1

    公开(公告)日：2011-03-16

    申请号：EP09757233.3

    申请日：2009-05-29

    Applicant: PolyIC GmbH & Co. KG

    Inventor： KNOBLOCH, Alexander ,  FIX, Walter

    IPC: H01L27/28 ,  H01L51/00

    CPC classification number: H01L27/283 ,  H01L51/0018 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/162 ,  H05K3/28 ,  H05K2201/09763 ,  H05K2201/09909

    Abstract: The invention relates to an electronic circuit (1, 10, 100, 101, 102) comprising at least two organic components (I, II, III, IV, V) connected to each other by means of circuit paths, said components having a mutual carrier substrate (2). The components (I, II, III, IV, V) and the circuit paths are formed from layer positions (3a, 3b, 3c, 3d). An upper layer position (3d') of the electronic circuit (1, 10, 100, 101, 102) facing away from the carrier substrate (2) is configured from an electrically conducting material in the manner of a pattern. The pattern-shaped upper layer position (3d') is equipped with at least one protective layer (4a, 4b, 4c, 4d) that is congruent to the upper most layer position (3d') on the side thereof facing away from the carrier substrate (2). The at least two organic components (I, II, III, IV, V) comprise at least one first component (I, II) of a first component type, and at least one second component (III, IV, V) of a second component type differing thereto. Components (I, II) of the same component type are protected by a protective layer (4a) of the same composition and/or the same construction.

    Abstract translation: 本发明涉及包括通过电路路径彼此连接的至少两个有机部件（I，II，III，IV，V）的电子电路（1,10,100,101,102），所述部件具有互相 载体基板（2）。 元件（I，II，III，IV，V）和电路路径由层位置（3a，3b，3c，3d）形成。 背离载体衬底（2）的电子电路（1,10,100,101,102）的上层位置（3d'）由导电材料以图案的方式配置。 图案形状的上层位置（3d'）配备有至少一个保护层（4a，4b，4c，4d），所述保护层在其背向载体的一侧上与最上层位置（3d'）一致 衬底（2）。 所述至少两种有机组分（I，II，III，IV，V）包含第一组分类型的至少一种第一组分（I，II）和至少一种第二组分 组件类型不同。 相同部件类型的部件（I，II）由相同组成和/或相同结构的保护层（4a）保护。

    METHOD FOR ELECTROCONDUCTIVE CIRCUIT FORMATION
    118.
    发明公开
    METHOD FOR ELECTROCONDUCTIVE CIRCUIT FORMATION 有权
    VERFAHREN ZURELEKTROLEITFÄHIGENSCHALTUNGSBILDUNG

    公开(公告)号：EP1976352A1

    公开(公告)日：2008-10-01

    申请号：EP07707217.1

    申请日：2007-01-23

    Applicant: SANKYO KASEI CO., LTD.

    Inventor： YUMOTO, Tetsuo

    IPC: H05K3/18 ,  H05K3/00

    CPC classification number: H05K3/184 ,  H05K1/0373 ,  H05K3/182 ,  H05K3/381 ,  H05K2201/0158 ,  H05K2201/0212 ,  H05K2201/09118 ,  H05K2201/09909 ,  H05K2203/0773

    Abstract: An electroconductive circuit, in which a masking material and a substrate both have low dielectric loss tangent to high-frequency signal and have excellent adhesion to each other, can be formed in a simple and low-cost manner. A cycloolefin resin with a flexible polymer mixed and dispersed therein is injection molded to form a primary substrate 1, and a cycloolefin resin having compatibility in which a flexible polymer has not been mixed, is injection molded on the surface of the primary substrate 1 to form a masking layer 2. Since the cycloolefin resin itself has etching resistance, for only the surface of the primary substrate 1 not covered with the masking layer 2, that is, only a part 1a on which an electroconductive circuit is to be formed, the flexible polymer can be dissolved for roughening and only the part 1a can be rendered hydrophilic. Accordingly, an electroconductive layer 4 can be selectively formed by electroless plating only onto the part 1a not covered with the masking layer 2.

    Abstract translation: 可以以简单且低成本的方式形成导电电路，其中掩模材料和基板都具有与高频信号相切的低介电损耗并且彼此具有优异的粘合性。 将其中混合并分散有柔性聚合物的环烯烃树脂注射成型以形成初级基底1，并将具有柔性聚合物未混合的相容性的环烯烃树脂注射到初级基底1的表面上以形成 掩模层2.由于环烯烃树脂本身具有耐腐蚀性，因此仅对未被掩模层2覆盖的一次基板1的表面即仅形成有导电电路的部分1a，柔性 聚合物可以溶解以进行粗糙化，并且只有部分1a可以变成亲水性。 因此，可以通过无电镀仅选择性地形成导电层4到未被掩模层2覆盖的部分1a上。

    Flexible circuit board and liquid crystal display having the same
    119.
    发明公开
    Flexible circuit board and liquid crystal display having the same 有权
    灵活的Leiterplatte undFlüssigkristallanzeigedamit

    公开(公告)号：EP1942709A1

    公开(公告)日：2008-07-09

    申请号：EP08100004.4

    申请日：2008-01-02

    Applicant: Samsung SDI Co., Ltd.

    Inventor： Chung, Jaemo ,  Kim, Sunghwan ,  Sung, Jinhee

    IPC: H05K1/18 ,  H05K1/02 ,  G02B6/00 ,  G02F1/13

    CPC classification number: H05K1/0274 ,  G02F1/133615 ,  G02F1/13452 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0112 ,  H05K2201/09909 ,  H05K2201/10106 ,  H05K2201/10522

    Abstract: A flexible circuit board (100) and a liquid crystal display having the same prevents emission of light from a light source to peripheral undesired areas, and firmly connects the board to a mold frame. The board includes a first insulating film (110), conductive patterns (120) formed on the first insulating film, a second insulating film (130) formed on the first insulating film to cover the conductive patterns, a light source (140) coupled to the conductive patterns, and a light absorbing layer (160,162) formed on the outer circumference of the light source to absorb light from the light source. Also, a mold frame includes an outer frame, an inner frame, and a guide boss. The board is connected to the mold frame, the light guide plate is connected to the mold frame and optically coupled to the board, and the liquid crystal display panel is placed on the light guide plate and coupled to the board.

    Abstract translation: 柔性电路板（100）和具有该柔性电路板的液晶显示器防止从光源向周边不期望的区域发射光，并将该板牢固地连接到模架上。 该板包括第一绝缘膜（110），形成在第一绝缘膜上的导电图案（120），形成在第一绝缘膜上以覆盖导电图案的第二绝缘膜（130），耦合到 导电图案，以及形成在光源的外圆周上以吸收来自光源的光的光吸收层（160,162）。 此外，模框包括外框架，内框架和导向凸台。 该板与模架连接，导光板与模架连接并光耦合到板上，并将液晶显示面板放置在导光板上并耦合到板上。

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