公开(公告)号：EP1039004A4

公开(公告)日：2001-02-21

申请号：EP98956011

申请日：1998-12-01

Applicant: NITTO BOSEKI CO LTD

Inventor： KONNO MICHIO ,  MIURA YASUSHI ,  SAITO SHOICHI ,  KASAI SHIN

IPC: D04H1/4218 ,  C03B37/01 ,  C03B37/08 ,  C03B37/083 ,  D04H1/42 ,  D04H1/4226 ,  D04H1/58 ,  D04H3/00 ,  D04H13/00 ,  H05K1/03 ,  C03B37/075 ,  D01D5/253

CPC classification number: H05K1/0366 ,  C03B37/083 ,  D04H1/4218 ,  D04H1/4226 ,  D04H1/4382 ,  D04H1/4391 ,  D04H3/00 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y02P40/57

Abstract: A nonwoven fabric constituted of high-flatness glass fibers whose cross sections have aspect ratios of 2.0 to 10 and rates of filling of 85 % or above, preferably 90 % or above. Such glass fibers have nearly rectangular cross sections and therefore can be arranged in an extremely dense state to give a nonwoven fabric which is extremely thin and has a high bulk density. The fabric can give laminates which are enhanced in the glass fiber content and improved in the surface smoothness, thus being suitably usable as the reinforcement for printed wiring boards. The glass fibers can be produced by the use of, e.g., a nozzle equipped with a tip which has a flat orifice and whose major-axis wall is partially cut out on one side.

Abstract translation: 非织造布由高度扁平的玻璃纤维构成，玻璃纤维是截面为平坦的平坦度为2.0至10的玻璃纤维，并且具有包装率至少为85％，优选至少90％ 。 在该无纺布中，玻璃纤维部的形状接近矩形，玻璃纤维可以非常密集地配置，形成体积密度高的薄型无纺布，作为层叠材料使用时，玻璃纤维 可以提高纤维含量，同时可以提高表面平滑性，并且可以适当地用作印刷线路板的增强材料。 此外，上述扁平玻璃纤维可以通过使用例如具有扁平喷嘴孔的喷嘴芯的长轴壁的一侧部分凹口的形状的喷嘴来制造。

公开(公告)号：EP0994215A1

公开(公告)日：2000-04-19

申请号：EP99307943.3

申请日：1999-10-08

Applicant: TEIJIN LIMITED

Inventor： Wada, Masanori, c/o Teijin Limited ,  Murayama, Sadamitsu, c/o Teijin Limited ,  Matsui, Michikage c/o Teijin Limited

IPC: D21H13/26 ,  H01B3/52

CPC classification number: H01B3/52 ,  D21H13/24 ,  D21H13/26 ,  D21H15/02 ,  D21H15/06 ,  D21H17/52 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/2973 ,  Y10T428/2976 ,  Y10T428/2978 ,  Y10T442/609 ,  Y10T442/61 ,  Y10T442/611 ,  Y10T442/69 ,  Y10T442/697

Abstract: A wholly aromatic polyamide (aramid) fiber synthetic paper sheet includes 70 - 96 wt% of an aramid staple fiber component which includes 30 wt% or more of a para-type aramid staple fibers each having two or more annular projections (DL1,DL2,DL3) spaced from each other and having an average ratio R/γ of the largest diameter R of the annular projections to the smallest diameter γ of the annular projection-free portions (DS1,DS2,DS3,DS4) of the staple fiber, of 1.1 or more, and 4 - 30 wt% of a binder component, namely a resinous binder and/or heat resistant fibrids.

Abstract translation: 全芳族聚酰胺（芳族聚酰胺）纤维合成纸片包括70-96重量％的芳族聚酰胺短纤维组分，其包含30重量％或更多的每个具有两个或更多个环形突起（DL1，DL2， DL3）彼此间隔开并且具有环形突起的最大直径R与短纤维的环形无凸起部分（DS1，DS2，DS3，DS4）的最小直径γ的平均比R /γ 1.1重量％以上，4〜30重量％的粘合剂成分，即树脂粘合剂和/或耐热纤维质。

公开(公告)号：EP0908559A2

公开(公告)日：1999-04-14

申请号：EP98118922.8

申请日：1998-10-07

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC. ,  Kuraray Co., Ltd.

Inventor： Gaku, Morio c/o Mitsubishi Gas Chemical Co., Inc. ,  Nozaki, Mitsuru c/o Mitsubishi Gas Chem. Co., Inc. ,  Saimen, Kenji c/o Kuraray Co., Ltd. ,  Esaki, Tamemaru c/o Kuraray Co., Ltd.

IPC: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/00

CPC classification number: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24322 ,  Y10T442/2475

Abstract: There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement comprises a wet-system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290°C or higher( component A ) and a thermotropic cystalline polyester binder which has a melting point of 290°C or higher and is in the form of a film having holes including at least 5 holes /mm 2 each with an area of opening of 400 to 10000 µm 2 ( component B ), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring ( base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.

Abstract translation: 有圆盘游离缺失的印刷电路基板的非织造增强件的非织造增强件包括一个湿体系无纺布构成热嗜cystalline聚酯纤维的具有290℃或更高（A成分）的熔点，且具有热嗜cystalline聚酯粘合 的290℃或更高的熔点，是在具有通孔包括至少5个孔/毫米<2>各自具有在400至10000微米<2>（B成分）开口的面积的膜的形式，所述 A组分被固定由组分B; 生产上述非织造增强的工序; 从上述非织造增强所产生的印刷配线基板; 和印刷电路板由上述印刷布线基板制造。 非织造增强件和印刷电路（基极）板具有优异的各种性能：如均匀性，尺寸稳定性，耐热性和检查介电constasnt和介电损耗角正切的电特性。

公开(公告)号：EP0786505A3

公开(公告)日：1998-10-21

申请号：EP97300453

申请日：1997-01-24

Applicant: GORE & ASS

Inventor： KORLESKI JOSEPH E JR

IPC: C09J11/04 ,  B32B5/28 ,  C08L27/18 ,  C09J7/02 ,  C09J7/04 ,  C09J123/06 ,  C09J123/12 ,  C09J127/18 ,  C09J201/00 ,  H05K1/03

CPC classification number: B32B5/28 ,  C08L27/18 ,  C09J7/21 ,  C09J2400/263 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/249953 ,  Y10T428/249978 ,  Y10T428/249982 ,  Y10T428/249985 ,  Y10T428/249986 ,  Y10T428/249987 ,  Y10T428/24999 ,  Y10T428/249991 ,  Y10T428/249992 ,  Y10T428/249993 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  Y10T428/2878 ,  Y10T428/2883 ,  Y10T428/31511 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31678 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31935 ,  Y10T428/31938 ,  Y10T442/2861 ,  Y10T442/291 ,  Y10T442/2918 ,  Y10T442/2926 ,  Y10T442/2934 ,  Y10T442/2951 ,  Y10T442/2975 ,  Y10T442/2984 ,  Y10T442/2992 ,  Y10T442/56 ,  Y10T442/57 ,  Y10T442/699

Abstract: A method of preparing an adhesive composite is provided where a fluoropolymer having nodes and interconnected fibrils with a void volume formed from the node and interconnected fibril structure is at least partially filled with a paste formed from a thermoset or thermoplastic adhesive and a particulate vapor phase formed inorganic filler having uniform surface curvature, sufficient adhesive and filler are present to provide a composite having between about 5 to about 40 volume percent polymeric substrate, 10 - 95 volume percent adhesive and filler imbibed within the voids of said substrate and 5 to 85 volume percent inorganic filler is contained within the composite.

Abstract translation: 提供了一种制备粘合剂复合材料的方法，其中具有由节点和相互连接的原纤维结构形成的具有空隙体积的节点和相互连接的原纤维的含氟聚合物至少部分地填充有由热固性或热塑性粘合剂形成的糊剂和形成的颗粒气相 具有均匀表面曲率的无机填料，存在足够的粘合剂和填料以提供具有介于约5体积％至约40体积％之间的聚合物基材，吸收在所述基材的空隙内的10-95体积％粘合剂和填料以及5体积％至85体积％ 无机填料包含在复合材料内。

公开(公告)号：EP0851885A1

公开(公告)日：1998-07-08

申请号：EP96930255.0

申请日：1996-09-12

Applicant: International Business Machines Corporation

Inventor： AFZALI-ARDAKANI, Ali ,  GELORME, Jeffrey, Donald ,  KOSBAR, Laura, Louise

IPC: B32B27 ,  C08G59 ,  C08H3 ,  C08H6 ,  C08H7 ,  C08J5 ,  C08K3 ,  C08K5 ,  C08L5 ,  C08L63 ,  C08L91 ,  C08L93 ,  C08L97 ,  C08L99 ,  H05K1

CPC classification number: C08H6/00 ,  C08L97/005 ,  H05K1/0313 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/178

Abstract: Biobased cross-linked compositions, methods of fabrication and structures, in particular biobased printed wiring boards using the compositions and methods of making the structures are described. Biobased materials such as lignin, crop oils, wood resins, tannins, and polysaccharides and combinations thereof are cross-linked, preferably using heat, a cross-linking agent, and an initiator. The materials fabricated have suitable properties for printed wiring boards which are made by impregnating a fibreglass or biobased cloth with an admixture of the biobased material, cross-linking agent and initiator which is processed by conventional methods to produce a printed wiring board.

公开(公告)号：EP0807703A1

公开(公告)日：1997-11-19

申请号：EP97107832.4

申请日：1997-05-14

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD

Inventor： Sakai, Masayuki ,  Hatanaka, Hideo ,  Tsukamoto, Masahide ,  Nakatani, Seiichi ,  Okano, Masayuki ,  Kojima, Tamao

IPC: D04H1/00 ,  D04H1/58 ,  H05K1/03 ,  D21H13/18

CPC classification number: H05K1/0366 ,  B32B15/14 ,  C08J5/04 ,  D04H1/00 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/64 ,  D21H13/26 ,  D21H17/52 ,  H05K1/024 ,  H05K2201/0239 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0783 ,  H05K2203/087 ,  H05K2203/097 ,  H05K2203/1105 ,  Y10T442/198 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2902 ,  Y10T442/626

Abstract: A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250°C)/E' (30°C)) and a 0.05 or less loss tangent (Tanδ ) peak value at 30-250°C, and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.

Abstract translation: 一种包含芳族聚酰胺纤维并具有0.7-1.0动态弹性模量比（E'（250℃）/ E'（30℃））和0.05或更小的损耗角正切（Tanδ）的印刷线路板的无纺布基底 ）峰值，以及使用该无纺布基板的预浸料坯和印刷线路板。

公开(公告)号：EP0536107B1

公开(公告)日：1997-06-11

申请号：EP92890204.8

申请日：1992-09-25

Applicant: ISOVOLTA Österreichische Isolierstoffwerke Aktiengesellschaft

Inventor： Eichberger, Walter

IPC: B23B35/00 ,  H05K3/00

CPC classification number: B23B35/005 ,  B27N7/005 ,  H05K3/0047 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0156 ,  H05K2203/0214

公开(公告)号：EP0707038A1

公开(公告)日：1996-04-17

申请号：EP95114852.7

申请日：1995-09-21

Applicant: ROGERS CORPORATION

Inventor： St. Lawrence, Michel E. ,  Landi, Vincent R. ,  Hand, Doris I. ,  Walker, Robert H. ,  Gazit, Samuel ,  Miskiavitch, Raymond R.

IPC: C08L9/00 ,  H05K1/03

CPC classification number: C08J5/24 ,  C08J2309/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L7/00 ,  C08L9/00 ,  C08L9/02 ,  C08L9/06 ,  C08L15/00 ,  C08L23/04 ,  C08L53/00 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/3431 ,  Y10T442/3569 ,  C08L2666/06 ,  C08L2666/08 ,  C08L2666/24

Abstract: An electrical circuit material is presented which comprises:

(a) a thermosetting composition comprising a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene containing polymer capable of participating in crosslinking with said polybutadiene or polyisoprene resin in an amount of from 25 to 50 volume percent;
(b) a woven fabric in an amount from 10 to 40 volume percent;
(c) a particulate filler in an amount of from 5 to 60 volume percent; and
(d) a free radical cure initiator.

Abstract translation: 被呈现的电路材料，其包括：（a）一种热固性组合物，包括聚丁二烯或聚异戊二烯树脂和不饱和的丁二烯或异戊二烯含聚合物能够以25〜50％（体积）的量参与交联与所述聚丁二烯或聚异戊二烯树脂在 ; （B）的机织织物在10％到40％的体积量; （C）在5〜60体积％的量的颗粒填料; 和（d）自由基固化引发剂。

公开(公告)号：EP0536107A3

公开(公告)日：1993-05-19

申请号：EP92890204.8

申请日：1992-09-25

Applicant: ISOVOLTA Österreichische Isolierstoffwerke Aktiengesellschaft

Inventor： Eichberger, Walter

IPC: B23B35/00 ,  H05K3/00

CPC classification number: B23B35/005 ,  B27N7/005 ,  H05K3/0047 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0156 ,  H05K2203/0214

Abstract: Verfahren zur Herstellung einer Bohrunterlage aus einem plattenförmigen, durch Komprimierung von gegebenenfalls mit Kunstharzen beleimten Holzfasern hergestellten Kern, der an beiden Seiten mit duromere Kunstharze enthaltenden Trägermaterialien beschichtet ist, dadurch gekennzeichnet, daß als plattenförmiger Kern eine nach dem Trockenverfahren hergestellte Holzfaserplatte eingesetzt wird, auf welche an beiden Seiten das mit dem duromeren Kunstharz imprägnierte, faserförmige Trägermaterial durch Heißverpressen aufgebracht wird, wobei das duromere Kunstharz aushärtet.

公开(公告)号：EP0536107A2

公开(公告)日：1993-04-07

申请号：EP92890204.8

申请日：1992-09-25

Applicant: ISOVOLTA Österreichische Isolierstoffwerke Aktiengesellschaft

Inventor： Eichberger, Walter

IPC: B23B35/00 ,  H05K3/00

CPC classification number: B23B35/005 ,  B27N7/005 ,  H05K3/0047 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/0156 ,  H05K2203/0214

Abstract: Verfahren zur Herstellung einer Bohrunterlage aus einem plattenförmigen, durch Komprimierung von gegebenenfalls mit Kunstharzen beleimten Holzfasern hergestellten Kern, der an beiden Seiten mit duromere Kunstharze enthaltenden Trägermaterialien beschichtet ist, dadurch gekennzeichnet, daß als plattenförmiger Kern eine nach dem Trockenverfahren hergestellte Holzfaserplatte eingesetzt wird, auf welche an beiden Seiten das mit dem duromeren Kunstharz imprägnierte, faserförmige Trägermaterial durch Heißverpressen aufgebracht wird, wobei das duromere Kunstharz aushärtet.

Abstract translation: 如果适当的话，用合成树脂压缩木纤维来制造钻孔基底的方法，该芯片的两侧用含有热固性合成树脂的基材进行涂覆，其特征在于使用木质纤维板作为 通过干法生产的片状芯，其两侧都浸渍有热固性合成树脂的纤维基材通过热压进行，其中热固性合成树脂固化。