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公开(公告)号：EP0723388B1
公开(公告)日：2002-07-31
申请号：EP96100757.2
申请日：1996-01-19
IPC分类号： H05K3/40 , H05K1/02 , H01L23/373
CPC分类号： H05K3/4069 , H01L21/4857 , H01L21/486 , H01L23/3677 , H01L23/5384 , H01L2224/16 , H01L2224/16235 , H01L2924/01046 , H01L2924/01079 , H01L2924/15311 , H05K1/0206 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , H05K2201/0209 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , Y10S428/901 , Y10T29/49124 , Y10T29/49155 , Y10T29/49156 , Y10T428/24917 , Y10T428/24926
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公开(公告)号：EP0343951B1
公开(公告)日：1995-10-18
申请号：EP89305242.3
申请日：1989-05-24
CPC分类号： B41M5/38207 , B41J17/40 , B41J31/14 , Y10T156/1153
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公开(公告)号：EP0568930A3
公开(公告)日：1994-04-06
申请号：EP93107031.2
申请日：1993-04-30
发明人： Hatakeyama, Akihito , Sogo, Hiroshi , Kojima, Tamao , Horio, Yasuhiko , Tsukamoto, Masahide , Fukumura, Yasushi
CPC分类号： H05K3/462 , H05K3/28 , H05K3/4069 , H05K3/4623 , H05K2201/0116 , H05K2201/0269 , H05K2201/0355 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , Y10S428/901 , Y10T29/49124 , Y10T29/49126 , Y10T29/49165 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： A method of manufacturing an organic substrate used for printed circuits, which includes the steps of forming through-holes (3) in a porous raw material (2) provided with free tackness films (1) and having compressive shrinkage, filling electro-conductive paste (4) into the through-holes (3), separating the free tackness films (1) from the porous raw material (2) filled with the electro-conductive paste (4) in its through-holes (3), applying metal foils (5) onto the surfaces of the porous raw material (2) from which the free tackness films (1) have been separated, and compressing the porous raw material (2) applied with the metal foils (5) through heating and pressurization, whereby the electro-conductive substances in the electro-conductive paste (4) are connected for electrical connection between the metal foils (5).
摘要翻译： 一种制造用于印刷电路的有机基板的方法，其包括以下步骤：在设置有自由粘性膜（1）并具有压缩收缩率的多孔原料（2）中形成通孔（3）;填充导电浆料 （4）插入通孔（3）中，将自由粘着膜（1）与填充有导电浆料（4）的多孔原料（2）在其通孔（3）中分离，将金属箔 （5）分散到已经分离了所述自由粘着膜（1）的多孔原料（2）的表面上，并且通过加热和加压来压缩涂有所述金属箔（5）的多孔原料（2），由此 导电浆料（4）中的导电物质被连接以用于金属箔（5）之间的电连接。
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4.发明授权
公开(公告)号：EP0258836B1
公开(公告)日：1992-08-12
申请号：EP87112545.6
申请日：1987-08-28
发明人： Kirihata, Yoshihiro c/o Tomoegawa Paper Co. Ltd. , Murata, Chikara c/o Tomoegawa Paper Co. Ltd. , Tsukamoto, Masahide , Nishimura, Yutaka
IPC分类号： B41M5/26
CPC分类号： B41M5/48 , Y10S430/146 , Y10S430/165
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公开(公告)号：EP0961533B1
公开(公告)日：2006-05-10
申请号：EP99108632.3
申请日：1999-05-12
CPC分类号： H05K3/20 , H05K3/007 , H05K3/205 , H05K3/386 , H05K3/4069 , H05K3/4614 , H05K3/4617 , H05K3/4623 , H05K3/4658 , H05K3/4688 , H05K2201/0116 , H05K2201/0195 , H05K2201/10378 , H05K2203/0152 , H05K2203/0384 , H05K2203/061 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24917 , Y10T428/2804
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公开(公告)号：EP1250033A3
公开(公告)日：2003-01-02
申请号：EP02013314.6
申请日：1997-12-23
发明人： Tsukamoto, Masahide
IPC分类号： H05K3/40 , H05K3/46 , H05K3/20 , H01L23/498 , H01L23/538
CPC分类号： H01L24/80 , H01L23/3107 , H01L23/49827 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K1/115 , H05K3/007 , H05K3/20 , H05K3/28 , H05K3/4007 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4658 , H05K2201/0367 , H05K2201/09509 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0152 , H05K2203/1461 , Y10T29/49126 , Y10T29/49165 , Y10T29/49345 , H01L2924/00
摘要： A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material layer, wherein a cross-sectional area of the second via hole is smaller than a cross-sectional area of said first via hole, and wherein the first and second via holes are filled with a conductive material.
摘要翻译： 印刷电路板具有：具有第一通孔的基材层; 以及具有第二通孔的绝缘层，所述绝缘层设置在所述基材层的一个表面上，其中所述第二通孔的横截面面积小于所述第一通孔的横截面面积，以及 其中所述第一和第二通孔被导电材料填充。
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7.发明授权A process for making a nonwoven fabric cloth substrate for printed wiring boards, and a process for making a prepreg using the same 失效用于印刷电路板基片和一种制造预浸渍材料的方法的非织造织物基材的制造方法
公开(公告)号：EP0807703B1
公开(公告)日：2002-10-02
申请号：EP97107832.4
申请日：1997-05-14
发明人： Sakai, Masayuki , Hatanaka, Hideo , Tsukamoto, Masahide , Nakatani, Seiichi , Okano, Masayuki , Kojima, Tamao
CPC分类号： H05K1/0366 , B32B15/14 , C08J5/04 , D04H1/00 , D04H1/4342 , D04H1/4382 , D04H1/64 , D21H13/26 , D21H17/52 , H05K1/024 , H05K2201/0239 , H05K2201/0278 , H05K2201/0293 , H05K2203/0783 , H05K2203/087 , H05K2203/097 , H05K2203/1105 , Y10T442/198 , Y10T442/2049 , Y10T442/2475 , Y10T442/2902 , Y10T442/626
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公开(公告)号：EP0851724A2
公开(公告)日：1998-07-01
申请号：EP97122824.2
申请日：1997-12-23
发明人： Tsukamoto, Masahide
IPC分类号： H05K3/40 , H05K3/46 , H05K3/20 , H01L23/498
CPC分类号： H01L24/80 , H01L23/3107 , H01L23/49827 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K1/115 , H05K3/007 , H05K3/20 , H05K3/28 , H05K3/4007 , H05K3/4069 , H05K3/4602 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4658 , H05K2201/0367 , H05K2201/09509 , H05K2201/09536 , H05K2201/096 , H05K2201/10378 , H05K2203/0152 , H05K2203/1461 , Y10T29/49126 , Y10T29/49165 , Y10T29/49345 , H01L2924/00
摘要： A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material layer, wherein a cross-sectional area of the second via hole is smaller than a cross-sectional area of said first via hole, and wherein the first and second via holes are filled with a conductive material.
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9.发明公开Chip carrier and semiconductor device using the same 失效Chipträgerund Halbleiteranordnung mit diesemChipträger
公开(公告)号：EP0797253A2
公开(公告)日：1997-09-24
申请号：EP97104493.8
申请日：1997-03-17
发明人： Tsukamoto, Masahide
IPC分类号： H01L23/498 , H01L23/14
CPC分类号： H01L23/562 , H01L23/145 , H01L23/49827 , H01L23/4985 , H01L24/32 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/83051 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/15153 , H01L2924/1517 , H01L2924/15174 , H01L2924/15313 , H01L2924/16152 , H01L2924/18161 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/00012
摘要： A carrier substrate (108) comprises a flexible insulating substrate (101) containing aramid fiber as a reinforcer, first bonding pads (102) formed on one side of the flexible insulating substrate (101), and second bonding pads (105) formed on the other side of the flexible insulating substrate (101), where the first bonding pads (102) and the second bonding pads (105) are electrically bonded by via-holes (103) punched in the flexible insulating substrate (101). The carrier substrate (108) and a peripheral stiffener (106) made of a material whose thermal expansion coefficient is higher than that of the carrier substrate (108) compose a chip carrier, and an LSI chip (201) is mounted on the recess of the chip carrier.
摘要翻译： 载体基板（108）包括含有作为增强件的芳族聚酰胺纤维的柔性绝缘基板（101），形成在柔性绝缘基板（101）的一侧的第一接合焊盘（102）和形成在柔性绝缘基板 柔性绝缘基板（101）的另一侧，其中第一接合焊盘（102）和第二接合焊盘（105）通过冲压在柔性绝缘基板（101）中的通孔（103）电连接。 由热膨胀系数高于载体基板（108）的材料制成的载体基板（108）和周边加强件（106）构成芯片载体，LSI芯片（201）安装在 芯片载体。
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10.发明公开
公开(公告)号：EP0382554A3
公开(公告)日：1992-09-30
申请号：EP90301391.0
申请日：1990-02-09
CPC分类号： H01J29/085 , H01J9/14 , H01J29/28
摘要： Disclosure is given for methods of effectively forming a metal-backed layer and an anode using a metal film transferring sheet in which micro-holes are formed. A the metal film transferring sheet is structured by forming a metal film on a mold-releasable, highly characteristic sheet. Then, the metal film having micro-holes of the metal film transferring sheet is transferred onto a phosphor screen. Or, on the metal film of the above-mentioned metal film transferring sheet is formed a phosphor screen and these metal film, phosphor screen, etc. are collectively transferred onto a face plate thereby to form an anode of a cathode-ray tube. Then the disclosed methods are applied for making phosphor products for example, a cathode-ray tube or a plasma display. There is no need to use a large-scaled manufacturing facility and high quality, low-in-cost products are obtainable.
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