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    THREE-DIMENSIONAL PRINTED CIRCUIT BOARD
    141.
    发明公开
    THREE-DIMENSIONAL PRINTED CIRCUIT BOARD 审中-公开
    三维印刷电路板

    公开(公告)号：EP1949773A2

    公开(公告)日：2008-07-30

    申请号：EP06851617.8

    申请日：2006-05-18

    Applicant: Honeywell International Inc.

    Inventor： BRAMAN, Todd L. ,  MYLES, A. Koshiol

    IPC: H05K3/34

    CPC classification number: H05K3/403 ,  H05K3/3405 ,  H05K3/366 ,  H05K3/4611 ,  H05K2201/09163 ,  H05K2201/09181 ,  H05K2201/10446 ,  H05K2201/10727 ,  Y10T29/49165 ,  Y10T29/49167

    Abstract: A three-dimensional PWB is provided that may include two or more layers stacked together forming a top surface, a bottom surface, and one or more side surfaces, and one or more solder pad situated on at least one of the one or more side surfaces. The one or more solder pads may include exposed voids in the one or more side surfaces. In some cases, the top surface and/or the bottom surface may have one or more solder pad. The one or more solder pads on at least one of the one or more side surfaces may be electrically connected to the one or more solder pads on the top surface and /or the bottom surface. In the illustrative PWB, the top surface and/or the bottom surface may be adapted to be mounted with an inertial sensor. The one or more side surfaces may be adapted to be mounted to a printed wiring board.

    Abstract translation: 提供三维PWB，其可以包括堆叠在一起的两个或更多个层，所述两个或更多个层形成顶表面，底表面和一个或更多个侧表面，以及位于所述一个或更多个侧表面中的至少一个上的一个或更多个焊盘 。 一个或多个焊盘可以包括在一个或多个侧表面中的暴露空隙。 在一些情况下，顶表面和/或底表面可具有一个或多个焊盘。 一个或多个侧表面中的至少一个上的一个或多个焊盘可以电连接到顶表面和/或底表面上的一个或多个焊盘。 在说明性的PWB中，顶表面和/或底表面可以适合于与惯性传感器一起安装。 该一个或多个侧表面可以适合于安装到印刷线路板。

    MICRO-CASTELLATED INTERPOSER
    143.
    发明公开
    MICRO-CASTELLATED INTERPOSER 审中-公开
    MICRO-CASTELLATED插入器

    公开(公告)号：EP1774582A2

    公开(公告)日：2007-04-18

    申请号：EP05769151.1

    申请日：2005-06-29

    Applicant: Honeywell International, Inc.

    Inventor： LEVINE, Aaron ,  STANKE, Jay, D.

    IPC: H01L21/48 ,  H01L23/538 ,  H01L23/498

    CPC classification number: H01L21/485 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/225 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/09645 ,  H01L2924/00

    Abstract: A miniature PWB (101) with features that incorporate the required circuitry changes and component footprints (105), which has been enhanced with micro-castellations (111) such as those found on ceramic surface mount packages. The miniature PWB (101) is mounted on the circuit board (125) using techniques well known in the art. This combination of technologies provides an adaptable, durable interconnect methodology, which allows for circuit (109) and part changes (113, 115, 117) without changing the layout of the base printed wiring board (125).

    Abstract translation: 一种微型PWB（101），其特征包括所需的电路变化和元件占位面积（105），这些元件占位面积已通过陶瓷表面贴装封装上的微型城堡（111）得到了增强。 使用本领域公知的技术将微型PWB（101）安装在电路板（125）上。 这种技术组合提供了一种适应性强，持久的互连方法，该方法允许电路（109）和部件更换（113,115,117），而不改变基座印刷电路板（125）的布局。

    Highly stable piezoelectric oscillator
    144.
    发明公开
    Highly stable piezoelectric oscillator 审中-公开
    Hochstabiler压电式振荡器

    公开(公告)号：EP1708357A1

    公开(公告)日：2006-10-04

    申请号：EP06006380.7

    申请日：2006-03-28

    Applicant: Epson Toyocom Corporation

    Inventor： Satoh, Tomio, c/o Epson Toyocom Corporation

    IPC: H03B5/32

    CPC classification number: H05K1/141 ,  H03B5/32 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09181 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10515

    Abstract: A highly stable piezoelectric oscillator includes a heat-generating component mounted on a base printed circuit board; an erected printed circuit board placed upright on the base printed circuit board by fitting a fitting end part in a fitting slit that is formed to penetrate the base printed circuit board; a piezoelectric resonator which is disposed horizontally and directly on the heat-generating component on the base printed circuit board and whose lead electrode part is connected and fixed on the erected printed circuit board; and an oscillation circuit component to obtain an oscillation output using the piezoelectric resonator as a frequency source. Further, connection pads are arranged opposite from each other on surfaces of the base printed circuit board along both opposing end edges of the fitting slit; arc-shaped side through holes are provided on the inner walls of the fitting slit that correspond to each of the connection pads; and lead pads are arranged so as to have positional relations to their respective connection pads on both surfaces of the fitting end part of the erected printed circuit board; and each connection pad having the side through hole is soldered to each lead pad of the fitting end part.

    Abstract translation: 高度稳定的压电振荡器包括安装在基底印刷电路板上的发热元件; 通过将配合端部嵌合在形成为穿过基底印刷电路板的配合狭缝中而直立放置在基板印刷电路板上的直立印刷电路板; 压电谐振器，其水平地并且直接放置在基板印刷电路板上的发热部件上，其引线电极部分连接固定在竖立的印刷电路板上; 以及使用压电谐振器作为频率源获得振荡输出的振荡电路部件。 此外，连接焊盘沿着配合狭缝的两个相对的端部边缘彼此相对布置在基底印刷电路板的表面上; 弧形侧通孔设置在与每个连接垫对应的装配狭缝的内壁上; 并且引线焊盘被布置成与竖立的印刷电路板的装配端部的两个表面上的各自的连接焊盘具有位置关系; 并且具有侧通孔的每个连接垫焊接到装配端部的每个引线焊盘。

    Miniaturized imaging module
    145.
    发明公开
    Miniaturized imaging module 有权
    Miniaturisiertes Bilderzeugungsmodul

    公开(公告)号：EP1662778A1

    公开(公告)日：2006-05-31

    申请号：EP05257354.0

    申请日：2005-11-30

    Applicant: Psion Teklogix Systems Inc.

    Inventor： Kricorissian, Gregg ,  Zhang, Tao

    IPC: H04N5/225 ,  H05K1/14

    CPC classification number: H04N5/2253 ,  H04N5/2256 ,  H05K1/116 ,  H05K1/144 ,  H05K3/3405 ,  H05K3/366 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/048 ,  H05K2201/09145 ,  H05K2201/09181 ,  H05K2201/09481 ,  H05K2201/10287 ,  H05K2201/2072 ,  H05K2203/128 ,  Y10T29/49144 ,  Y10T29/49169

    Abstract: A method of constructing an image reader module and the image reader are described. The image reader module includes two or more circuit boards in a stacked configuration. Corresponding notches for receiving supports are formed along adjacent edges of the boards, which also have electrical contact points at the edges of each board connected to circuits on the boards. The supports are mounted in the notches between the two or more circuit boards to structurally interconnect the boards. Each of the supports, which may be flex cables or conductive bus bars, have one or more electrical conductors that are electrically connected to the contact points on the boards to electrically interconnect the boards, whereby the connections between the electrical conductors and the contact points form test points for the module. The notches may be substantially rectangular to receive the flex cable or may be slots to receive a bus bar. One end of the structural support flex cable or bus bar may be flush with one of the circuit boards and the other end of the structural support may extend past another one of the circuit boards. The supports may be soldered to the edges of the boards within the notches, which may be initially plated. In the image reader module an image sensor may be located on one of the circuit boards and an illumination assembly may be located on another of the circuit boards.

    Abstract translation: 描述了构建图像读取器模块和图像读取器的方法。 图像读取器模块包括堆叠配置中的两个或多个电路板。 用于接收支撑件的相应凹口沿着板的相邻边缘形成，其在每个板的边缘处还具有连接到板上的电路的电接触点。 支撑件安装在两个或多个电路板之间的凹口中，以在板上结构互连。 可以是柔性电缆或导电母线的每个支撑件具有一个或多个电导体，其电连接到板上的接触点以电连接板，由此电导体和接触点之间的连接形成 测试点为模块。 凹口可以是基本上矩形的以接收柔性电缆，或者可以是用于接收汇流条的槽。 结构支撑柔性电缆或汇流条的一端可以与电路板中的一个齐平，并且结构支撑件的另一端可以延伸经过另一个电路板。 支撑件可以焊接到凹槽内的板的边缘，其可以最初被电镀。 在图像读取器模块中，图像传感器可以位于电路板中的一个上，并且照明组件可以位于另一个电路板上。

    CONDUCTIVE POLYMER DEVICE AND METHOD OF MANUFACTURING SAME
    148.
    发明公开
    CONDUCTIVE POLYMER DEVICE AND METHOD OF MANUFACTURING SAME 有权
    导电聚合物组分及其制造方法

    公开(公告)号：EP1570496A1

    公开(公告)日：2005-09-07

    申请号：EP03721372.5

    申请日：2003-03-14

    Applicant: Bourns, Inc.

    Inventor： BURKE, Ray ,  O'BRIEN, Maurice ,  LAN, Poting ,  CHU, Stelar

    IPC: H01C1/14 ,  H01C7/02

    CPC classification number: H01C7/027 ,  H01C1/1406 ,  H01C1/148 ,  H01C7/02 ,  H01C17/28 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/09181 ,  H05K2201/09554 ,  H05K2201/09845

    Abstract: An electronic device is manufactured using printed circuit board manufacturing processes. In particular, a laminar device comprises a first metal layer (12), a second metal layer (14), at least one layer of device material sandwiched between the first and second metal layers. A first layer of insulating material (40) substantially covers the first metal layer (12). A third metal layer (48) is provided on the first layer of insulating material (40). This third metal layer (48) is divided to provide a first terminal (90) and a second terminal (92). The first terminal (90) is electrically connected to the first metal layer (12) by a conductive interconnect (84) formed through said first layer of insulating material (40), and the second terminal (92) is electrically connected to said second metal layer (14) by a conductive path (68) comprising an insulated conductive channel which passes through and is insulated from said first metal layer (12) and said at least one layer of device material (16). The use of an insulated channel provides a cost effective method of manufacture and maximizes the effective area of device material used. A PTC component is built through this method.

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