公开(公告)号：EP2711971A1

公开(公告)日：2014-03-26

申请号：EP12185564.7

申请日：2012-09-21

Applicant: JUMO GmbH & Co. KG

Inventor： Wolf, Andreas

IPC: H01L21/027 ,  H05K3/04

CPC classification number: H01L21/0272 ,  H05K3/048 ,  H05K2201/0116 ,  H05K2201/0317 ,  H05K2203/0545 ,  H05K2203/0746

Abstract: Verfahren zur Herstellung einer strukturierten Dünnschicht (6), umfassend:
a) Aufbringen wenigstens einer Opferschichtstruktur (1) auf ein Substrat (3),
b) Aufbringen einer Funktionsschicht (5) in Dünnschichttechnik auf das Substrat (3), wobei die Funktionsschicht (5) zumindest bereichsweise das Substrat (3) und zumindest bereichsweise die Opferschichtstruktur (1) bedeckt,
c) Abtragen der Opferschichtstruktur (1) vom Substrat (3) mittels eines Strahls einer Flüssigkeit,
d) wobei die Opferschichtstruktur (1) zumindest bereichsweise porös ausgebildet ist.

Abstract translation: 该方法包括将牺牲层结构（1）作为糊料沉积在基底（3）上。 将固体，玻璃和/或陶瓷颗粒和粘贴剂与有机粘合剂和有机溶剂的糊剂施加在基材上，然后在100-200℃下干燥5-30分钟。 功能层（5）沉积在基板上。 由功能层组成的基板被牺牲层结构部分地覆盖。 部分地形成在牺牲层结构上的多孔区域通过注入水和/或有机溶剂从衬底去除。 组件或电路板包含一个独立的声明。

公开(公告)号：EP2508048A1

公开(公告)日：2012-10-10

申请号：EP10787284.8

申请日：2010-11-23

Applicant: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.

Inventor： KOHN, Cordula ,  KÜBLER, Rainer ,  MÜLLER, Sebastian

IPC: H05K3/28 ,  H05K3/32 ,  H01L31/0224 ,  H01R4/00

CPC classification number: H05K3/245 ,  H01L31/022425 ,  H05K3/321 ,  H05K2201/0116 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0338 ,  H05K2201/10977 ,  H05K2203/1131 ,  H05K2203/1147 ,  H05K2203/1476 ,  Y02E10/50

Abstract: The invention relates to a metal-contacted substrate (1), in which at least one surface of the substrate is entirely or partially provided with a metal contact (2, 3). For mechanical stabilisation, the metal contact is provided with a matrix material (5). The invention also relates to a method for producing such a substrate.

公开(公告)号：EP1931186A4

公开(公告)日：2012-09-26

申请号：EP06796550

申请日：2006-08-18

Applicant: UNIV TOHOKU

Inventor： OHMI TADAHIRO ,  TERAMOTO AKINOBU ,  MORIMOTO AKIHIRO

IPC: H05K3/46

CPC classification number: H05K1/024 ,  H05K3/4602 ,  H05K3/4626 ,  H05K3/4673 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0254

公开(公告)号：EP2487030A2

公开(公告)日：2012-08-15

申请号：EP12003577.9

申请日：2007-02-16

Applicant: Daicel Chemical Industries, Ltd.

Inventor： Shimizu, Kiyoshi ,  Yamato, Yo

IPC: B32B5/18 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/036 ,  B32B5/18 ,  B32B15/08 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/12 ,  H05K3/185 ,  H05K2201/0116 ,  Y10T29/49155 ,  Y10T428/24331 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/249979

Abstract: A multilayer assembly includes a base which is a metallic foil base and, arranged on at least one side thereof, a porous layer and has a large number of continuous micropores with an average pore diameter of 0.01 to 10 µm. The multi-layer assembly suffers from no interfacial delamination between the base and the porous layer when examined in a tape peeling test according to the following procedure:
Tape Peeling Test
A 24-mm wide masking tape [Film Masking Tape No. 603 (#25)] supplied by Teraoka Seisakusho Co., Ltd. is applied to a surface of the porous layer of the multilayer assembly and press-bonded thereto with a roller having a diameter of 30 mm and a load of 200 gf to give a sample; and the sample is subjected to a T-peel test with a tensile tester at a peel rate of 50 mm/min.

Abstract translation: 一种多层组件，其特征在于，具有作为金属箔基材的基材，在其至少一个面上配置有多孔质层，并且具有多个平均孔径为0.01〜10μm的连续的微孔。 当根据以下程序在带剥离测试中检查时，多层组件在基底和多孔层之间没有界面分层：带剥离测试将24mm宽的掩蔽带[膜掩蔽带号603（＃25 ）]由Teraoka Seisakusho Co.，Ltd。提供，涂覆在多层组件的多孔层的表面上，并用直径为30mm，载荷为200gf的辊压粘结到样品上; 并用拉伸试验机以50mm / min的剥离速率对样品进行T-剥离试验。

公开(公告)号：EP1704758B1

公开(公告)日：2012-04-11

申请号：EP04803475.5

申请日：2004-12-03

Applicant: Würth Elektronik Rot am See GmbH & Co. KG ,  Lüberg Elektronik GmbH & Co. Rothfischer KG ,  Reifenhäuser GmbH & Co. Maschinenfabrik ,  Lehmann & Voss & Co. KG

Inventor： LANGENFELDER, Dieter ,  AHLSTAEDT, Volker

IPC: H05K1/03 ,  H05K3/46 ,  H05K3/02 ,  B29C44/32

CPC classification number: H05K3/022 ,  B29C44/322 ,  B29C47/0014 ,  B29C47/0019 ,  B29C47/065 ,  B29C47/10 ,  B29C47/145 ,  B29C47/366 ,  B29C47/8845 ,  B29C47/90 ,  B29C2793/009 ,  B29K2071/00 ,  B29K2105/04 ,  B29K2105/06 ,  B29K2105/256 ,  B29K2105/26 ,  H05K1/036 ,  H05K2201/0116 ,  H05K2201/0129

Abstract: Thermoplastic raw material with high temperature resistance is fused in a cascade of two extruders, then treated with gas and/or chemical propellants, homogenised and cooled. Outer layers are optionally applied to the foamed core layer, before the melt exits the nozzle gap. The melt strip foams up and is cooled in a burnishing unit. Copper films can simultaneously be introduced by means of the rollers of the burnishing unit, to give a composite of melt strip and copper film which are then drawn together.

公开(公告)号：EP1796164A4

公开(公告)日：2011-11-09

申请号：EP05782084

申请日：2005-09-07

Applicant: DENKI KAGAKU KOGYO KK

Inventor： IWAMOTO GOH ,  HIROTSURU HIDEKI ,  HIRAHARA KAZUNORI

IPC: H01L23/373

CPC classification number: H05K1/05 ,  C04B41/009 ,  C04B41/5155 ,  C04B41/88 ,  C04B2111/00844 ,  H01L23/13 ,  H01L23/142 ,  H01L23/15 ,  H01L23/3733 ,  H01L2924/0002 ,  H05K1/0284 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/09018 ,  Y10T428/12007 ,  Y10T428/249957 ,  Y10T428/249971 ,  Y10T428/249974 ,  Y10T428/249986 ,  Y10T428/249987 ,  Y10T428/24999 ,  Y10T428/26 ,  C04B35/565 ,  C04B38/00 ,  C04B41/4521 ,  C04B41/4523 ,  H01L2924/00

Abstract: To provide an aluminum/silicon carbide composite suitable as a base plate for a ceramic circuit plate on which semiconductor components are mounted, for which high reliability is required. An aluminum/silicon carbide composite which is prepared by infiltrating a flat silicon carbide porous body with a metal containing aluminum as the main component, which has an aluminum alloy layer made of a metal containing aluminum as the main component on both principal planes, and of which one principal plane is bonded to a circuit plate and the other principal plane is utilized as a radiation plane, characterized in that the radiation plane of the silicon carbide porous body is formed or machined into a convexly bowed shape, and after infiltration with the metal containing aluminum as the main component, the aluminum alloy layer on the radiation plane is further machined to form bow.

公开(公告)号：EP2292421A1

公开(公告)日：2011-03-09

申请号：EP09762486.0

申请日：2009-06-09

Applicant: Daicel Chemical Industries, Ltd.

Inventor： YAMATO, Yo

IPC: B32B5/18 ,  B32B7/02 ,  B32B37/06 ,  C08J9/28

CPC classification number: B32B33/00 ,  B32B38/0036 ,  B32B2305/026 ,  B32B2307/20 ,  B32B2307/412 ,  C08J2205/044 ,  H05K1/0218 ,  H05K1/0274 ,  H05K3/12 ,  H05K3/386 ,  H05K2201/0108 ,  H05K2201/0116 ,  H05K2201/09681 ,  H05K2203/1105 ,  Y10T428/24802 ,  Y10T428/249979 ,  Y10T428/31504

Abstract: The present invention provides a layered product having a porous layer made mainly of a polymer on a base, and a process for producing the same; and a functional layered product wherein a pattern of a functional material, such as an conductive material, is formed onto a light-transmitting base using the layered product having the porous layer, and a process for producing the functional layered product. A layered product comprising a base and a porous layer on at least one surface of the base, wherein the porous layer is constituted of a composition containing a polymer as a main component, the porous layer has micropores having an average pore diameter of 0.01 to 10 µm, and has a porosity of 30 to 85%, the composition constituting the porous layer has a glass transition temperature of 20°C or higher, and the porous layer is a layer which is convertible to a transparent layer by a heat treatment through disappearance of the micropores. A conductive pattern is formed on the porous layer surface of the layered product, and then the resultant layered product is subjected to a heat treatment to cause the micropores in the porous layer to disappear, thereby converting the porous layer to a transparent layer.

Abstract translation: 本发明提供了具有主要在基底由聚合物制成的多孔层，以及用于制造它们的方法的层状产品; 和功能性叠层体worin的功能性材料，颜色的图案：如上的导电材料时，到透光基底使用具有多孔层的叠层体形成，并且用于制造功能性叠层体的方法。 一种层状产品，其包括一个基座和所述基材的至少一个表面上的多孔层，worin多孔层由含有高分子作为主成分的组合物的，所述多孔层具有上的0点01分至10平均孔径具有微孔 微米，并且具有30〜85％的孔隙率，构成上述多孔层的组合物具有20℃或更高的玻璃化转变温度，并且所述多孔层是所有这些是转变为透明层的加热处理通过消失 的微孔。 的导电图案形成在叠层体的多孔层表面上，然后将得到的层叠物进行热处理，以使在多孔层中的微孔消失，从而在多孔层转变为透明层。

公开(公告)号：EP2273181A2

公开(公告)日：2011-01-12

申请号：EP10168269.8

申请日：2010-07-02

Applicant: Siteco Beleuchtungstechnik GmbH

Inventor： Metzeroth, Stefan ,  Meyer, Clemens ,  Härtl, Michael

IPC: F21K99/00 ,  H05K1/05

CPC classification number: H05K1/053 ,  F21V3/00 ,  F21V29/70 ,  F21W2131/10 ,  F21W2131/103 ,  F21W2131/107 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K3/14 ,  H05K3/246 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09018 ,  H05K2201/10106

Abstract: Die Erfindung betrifft ein LED-Trägerelement (1), das Folgendes umfasst: einen metallischen Kern, der auf zumindest einem Teilbereich seiner Oberfläche (21) eine Oxidkeramikschicht (22) aufweist, wobei die Oxidkeramikschicht (22) eine Porosität aufweist, welche von der Grenzfläche zum metallischen Kern (2) zur Oberfläche (21) des Trägerelements hin zunimmt, wenigstens eine Leiterbahn (3), die auf einem Teilbereich auf der von dem metallischen Kern (2) abgewandten Seite der Oxidkeramikschicht (22) angeordnet ist, und wenigstens eine LED (5), die in elektrischem Kontakt mit der Leiterbahn (3) steht.

Abstract translation: 本发明涉及一种LED支撑元件（1），包括：金属芯，其上至少在其表面的一部分区域（21）包括氧化物陶瓷层（22），其中，所述氧化物陶瓷层（22）具有的孔隙率，其界面的 在金属芯（2）的朝向所述至少一个导体轨道支撑构件增加所述表面（21）（3），所述氧化物陶瓷层（22）从局部区域背向于所述金属芯的侧（2）布置，并且至少一个LED （5），这是在与导体轨道（3）的电接触。

公开(公告)号：EP2135987B1

公开(公告)日：2010-12-22

申请号：EP09290464.8

申请日：2009-06-18

Applicant: Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： Revol Cavalier, Frédéric ,  David, Nadine ,  Schoumacker, Sébastien

IPC: D06B11/00 ,  D06Q1/04 ,  D06M11/83 ,  D06M15/19 ,  D06M23/16 ,  H05K3/00 ,  H05K3/12 ,  C03C25/10

CPC classification number: H05K3/184 ,  D06M10/001 ,  D06M11/83 ,  D06M13/513 ,  D06M15/00 ,  D06M23/16 ,  H05K1/0366 ,  H05K2201/0116 ,  H05K2201/0376 ,  H05K2203/1147

公开(公告)号：EP2211295A2

公开(公告)日：2010-07-28

申请号：EP10000633.7

申请日：2010-01-22

Applicant: Phytrex Technology Corporation

Inventor： Hsiao, Feng-Chi ,  Yang, Kun-Shan ,  Lin, Tung-Fu ,  Cheng, Chin-Fen ,  Lee, Chih-Wei

IPC: G06K19/077 ,  H05K1/00

CPC classification number: G06K19/077 ,  G06K19/041 ,  G06K19/07739 ,  G06K19/07743 ,  G06K19/07749 ,  G06K19/07769 ,  H04B1/3816 ,  H05K1/028 ,  H05K1/0281 ,  H05K3/0064 ,  H05K2201/0116 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10037

Abstract: The present invention provides a signal processing device comprising: a first substrate (11), one side surface thereof (20) being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a second substrate (10), one side surface thereof being provided with at least an integrated circuit (102) or an antenna (13); and a first connecting portion (12) for connecting the first and second substrates; wherein the second and fourth contacts are electrically connected to the integrated circuit or antenna via the first connecting portion.

Abstract translation: 本发明提供了一种信号处理装置，包括：第一基板（11），其一个侧表面（20）设置有至少第一触点和第二触点，而另一个侧表面设置有至少第三触点 和第四触点，在第一和第三触点之间存在电连接; 第二基板（10），其一个侧表面至少设置有集成电路（102）或天线（13）; 和用于连接第一和第二基板的第一连接部分（12） 其中所述第二和第四触点经由所述第一连接部分电连接到所述集成电路或天线。