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    SPLITTER ASSEMBLY WITH HIGH DENSITY BACKPLANE BOARD
    11.
    发明公开
    SPLITTER ASSEMBLY WITH HIGH DENSITY BACKPLANE BOARD 审中-公开
    用高密度的前后板分配装置，

    公开(公告)号：EP1405531A2

    公开(公告)日：2004-04-07

    申请号：EP02742264.1

    申请日：2002-06-24

    Applicant: ADC Telecommunications, Inc.

    Inventor： SCHMOKEL, Paul, W.

    IPC: H04Q1/10 ,  H05K7/00 ,  H04M11/06

    CPC classification number: H05K1/0216 ,  H04Q1/06 ,  H04Q1/14 ,  H04Q2201/10 ,  H04Q2201/12 ,  H04Q2201/14 ,  H05K2201/044 ,  H05K2201/0723 ,  H05K2201/09336

    Abstract: A telecommunications device including a plurality of splitter cards (55) mounted in a chassis (52). The device also includes a circuit board (68) and plurality of card edge connectors (96) for providing electrical connections between the splitter cards and the circuit board. The device further includes POTS connectors, LINE connectors and DATA connectors. The circuit board includes a first layer having first tracings that electrically connect contacts of at least one of the POTS, LINE or DATA connectors to at least one of the card edge connectors; a second layer having second tracings that electrically connect contacts of at least one of the POTS, LINE or DATA connectors to at least one of the card edge connectors; and a third layer having third tracings that electrically connect contacts of at least one of the POTS, LINE or DATA connectors to at least one of the card edge connectors. The second layer is positioned between the first and third layers. A majority of the second layer is covered by a grounding plane. The grounding plane and the second tracings are co-planar such that the grounding plane adds no additional thickness to the second layer. The grounding plane is positioned between the first and third tracings to reduce cross-talk between the first and third tracings.

    Printed-wiring board
    12.
    发明公开
    Printed-wiring board 有权
    Gedruckte Leiterplatte

    公开(公告)号：EP1098555A2

    公开(公告)日：2001-05-09

    申请号：EP00309666.6

    申请日：2000-11-01

    Applicant: CANON KABUSHIKI KAISHA

    Inventor： Otaki, Toru ,  Inagawa, Hideho ,  Osaka, Toru

    IPC: H05K1/11

    CPC classification number: H05K1/112 ,  H05K2201/09227 ,  H05K2201/09336 ,  H05K2201/0939 ,  H05K2201/09627 ,  H05K2201/10734

    Abstract: A printed wiring board having assembled thereon a grid array type package, a multi-terminal device with many terminals arranged in matrix, is provided, through first signal connection holes, signal lines, and second connection holes, with many numbers of lands divided into plural blocks, being arranged in matrix on a first layer to connect each terminal of the multi-terminal device correspondingly, signal line patterns connected with many lands, and drawn out in the same direction per block, and first signal patterns from lands positioned on the innermost line of many lands. Then, the wiring patterns of the signal lines are drawn out regularly from many lands formed in matrix on the assembling surface of the grid array type package to make it easier for the printed wiring board to effectuate wiring connections without making them complicated or increasing the number of layers of the printed wiring board. Also, with the provision of ground patterns that surround signal lines, it is made possible to reduce unwanted radiation, as well as to suppress the occurrence of malfunctions of electronic equipment due to reflections and ground bounces.

    Abstract translation: 通过第一信号连接孔，信号线和第二连接孔，设置有多个阵列型封装的印刷电路板，具有多个端子排列成矩阵状的多端子装置，其中多个焊盘分成多个 块，以矩阵形式布置在第一层上，以相应地连接多终端设备的每个终端，与许多焊盘相连并沿与每块相同的方向拉出的信号线图案，以及位于最内层的焊盘的第一信号图案 许多土地线。 然后，信号线的布线图形从格栅阵列型封装的组装表面上的矩阵形状的多个区域中规则地拉出，使得印刷布线板更容易实现布线连接而不使其复杂或增加数量 的印刷线路板的层。 此外，通过提供环绕信号线的接地图案，可以减少不需要的辐射，并且抑制由于反射和地面反弹而导致的电子设备故障的发生。

    Rain sensor embedded on printed circuit board
    16.
    发明公开
    Rain sensor embedded on printed circuit board 有权
    Regensensor，Regereensor，Leiterplatte montiert ist

    公开(公告)号：EP2100783A2

    公开(公告)日：2009-09-16

    申请号：EP09155248.9

    申请日：2009-03-16

    Applicant: Guardian Industries Corp.

    Inventor： Veerasamy, Vijayen S.

    IPC: B60S1/08 ,  B32B17/10 ,  G01D5/24 ,  G01N21/25 ,  H05K1/02

    CPC classification number: B60S1/0825 ,  B32B17/10036 ,  B32B17/10174 ,  B32B17/10761 ,  B32B17/10788 ,  B60S1/0822 ,  B60S1/087 ,  G01D5/2405 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09663

    Abstract: A system and/or method for sensing the presence of moisture (e.g., rain) and/or other material(s) on a window such as a vehicle window (e.g., vehicle windshield, sunroof or backlite). In certain example embodiments, a plurality of sensing capacitors are supported by a window such as a vehicle windshield, the capacitors each having a different field and/or pattern. A sensing circuit outputs an analog signal that is based on and/or related to the capacitances of one or more of the sensing capacitors. In certain example embodiments, a flexible printed circuit board (PCB) mountable in or on a vehicle window is provided. First and second sensing circuits are formed on opposing sides of the flexible PCB, with each said sensing circuit comprising a plurality of different fractal structures. A ground plane is located between the first and second sensing circuits, with the ground plane being arranged so as to decouple the first and second capacitor arrays and to shield the first capacitor array from fields emanating from the second capacitor array and vice versa. The electronic device is configured to detect moisture on an exterior surface of the vehicle window, humidity on an interior surface of the vehicle window, and EMI.

    Abstract translation: 用于感测诸如车辆窗口（例如，车辆挡风玻璃，天窗或背衬）的窗户上的湿气（例如雨）和/或其他材料的存在的系统和/或方法。 在某些示例性实施例中，多个感测电容器由诸如车辆挡风玻璃的窗户支撑，每个电容器具有不同的场和/或图案。 感测电路输出基于和/或与一个或多个感测电容器的电容相关的模拟信号。 在某些示例性实施例中，提供可安装在车窗中或其上的柔性印刷电路板（PCB）。 第一和第二感测电路形成在柔性PCB的相对侧上，每个所述感测电路包括多个不同的分形结构。 接地平面位于第一感测电路和第二感测电路之间，其中接地平面布置成使第一和第二电容器阵列去耦，并且使第一电容器阵列与从第二电容器阵列发出的场屏蔽起来，反之亦然。 电子设备被配置为检测车辆窗口的外表面上的湿气，车窗内表面上的湿度和EMI。

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