公开(公告)号：EP1659839A3

公开(公告)日：2006-09-20

申请号：EP05077548.5

申请日：2005-11-07

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Sarma, Dwadasi H. ,  Myers, Bruce A.

IPC: H05K1/02

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/0306 ,  H05K3/341 ,  H05K3/4061 ,  H05K2201/066 ,  H05K2201/10674 ,  H05K2201/2036 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board assembly (50,60,70) with a substrate (10) having a laminate construction of ceramic layers, such as an LTCC ceramic substrate (10). The substrate (10) is configured for the purpose of improving the thermal management of power circuit devices mounted to the substrate (10).
Thermally-conductive vias (16,76) extend through the substrate (10) from a first surface (24) thereof to a second surface (26) thereof. A circuit device (14,74) is mounted to the first surface (24) of the substrate (10) and is electrically interconnected to conductor lines (30) of the substrate (10). The device (14,74) is also thermally coupled to the thermally-conductive vias (16,76) with a first solder material (32,72). A heat sink (22) located adjacent the second surface (26) of the substrate (10) is bonded to the thermally-conductive vias (16,76) with a second solder material (34,78), such that the first solder material (32,72), the thermally-conductive vias (16,76), and the second solder material (34,78) define a thermal path from the device (14,74) to the heat sink (22).

公开(公告)号：EP1942557B1

公开(公告)日：2019-05-22

申请号：EP07120978.7

申请日：2007-11-19

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Nair, Deepukumar M.

IPC: H01P1/20 ,  H05K1/02 ,  H01Q15/00

公开(公告)号：EP2814310A3

公开(公告)日：2015-04-08

申请号：EP14171564.9

申请日：2014-06-06

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

IPC: H05K7/20

CPC classification number: H05K7/20927 ,  H05K7/20236 ,  H05K7/20872

Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metal sleeve around the perimeter of the dielectric plates to form a device assembly (10). The configuration allows for more direct contact between the electronic device and the coolant (16), while protecting the electronic device from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

公开(公告)号：EP2775516A3

公开(公告)日：2014-12-03

申请号：EP14154512.9

申请日：2014-02-10

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Eesley, Gary L.

IPC: H01L23/373 ,  H01L23/495 ,  H01L21/60

CPC classification number: H01L23/49575 ,  H01L23/3735 ,  H01L23/49513 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49861 ,  H01L23/562 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/75981 ,  H01L2224/83203 ,  H01L2224/83439 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/12036 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3511 ,  Y10T29/4913 ,  Y10T29/49149 ,  Y10T29/49169 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An assembly (10) for packaging one or more electronic devices (12) in die form includes substrates (26, 34) on opposite sides of the assembly (10), with lead frames (42, 60) between the electronic devices (12) and the substrates (26, 34). The substrates (26, 34), lead frames (42, 60) and electronic devices (12) are sintered together using silver-based sintering paste (68, 70, 72, 74) between the one or more electronic devices (12) and the lead frames (42, 60) and between the lead frames (42, 60) and the substrates (26, 34). The material and thicknesses of the substrates (26, 34) and lead frames (42, 60) are selected so that stresses experienced by the electronic devices (12) caused by changes in temperature of the assembly (10) are balanced from the centre of the assembly (10), thereby eliminating the need for balancing stresses at a substrate level by applying substantially matching metal layers to both sides of the substrates.

公开(公告)号：EP2645839A2

公开(公告)日：2013-10-02

申请号：EP13160107.2

申请日：2013-03-20

Applicant: Delphi Technologies, Inc.

Inventor： Brandenburg, Scott D. ,  Parker, Richard D. ,  Gerbsch, Erich W. ,  Eesley, Gary L. ,  Berlin, Carl W.

IPC: H05K7/20

CPC classification number: H05K7/20927

Abstract: A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metallic seal between the device assembly (10) and a housing (18). The configuration allows for more direct contact between the electronic device (12) and the coolant (16), while protecting the electronic device (12) from contact with potentially electrically conductive coolant (16). Material used to form the dielectric plates and the housing (18) are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract translation: 一种液体冷却配置为使用导电的冷却剂（16）以冷却功率电子器件做功率电子组件（10）用来与周围的电介质板的周边的金属密封件，以形成一个装置组件（10）密封的电介质板，然后 形成器件组件（10）和壳体（18）之间的另一个金属密封件。 该配置允许电子设备（12）和冷却剂（16）之间的更直接的接触，而具有潜在的导电的冷却剂（16）保护所述电子设备（12）从接触。 材料用于形成电介质板与所述壳体（18）被选择为具有象在密封件的可靠性最大化热膨胀（CTE）的系数相似。

公开(公告)号：EP1748688A3

公开(公告)日：2009-06-03

申请号：EP06076287.9

申请日：2006-06-23

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Chengalva, Suresh K. ,  Brandenburg, Scott D. ,  Myers, Bruce A.

IPC: H05K7/20

CPC classification number: H01L23/473 ,  H01L23/44 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K7/20236 ,  H05K7/20909 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic package having circulated submersed cooling fluid and method are provided. The electronic package has a housing defining a sealed enclosure and electronic devices located in the housing. The electronic devices have thermal emitting electrical circuitry. A dielectric fluid, such as a liquid, is located in the housing in heat transfer relationship with the electronic devices. A fluid circulator, such as a piezo fan, is located in the housing in contact with the dielectric liquid for circulating the dielectric liquid to cool the electronic devices.

公开(公告)号：EP1798766A3

公开(公告)日：2008-09-17

申请号：EP06077173.0

申请日：2006-12-05

Applicant: Delphi Technologies, Inc.

Inventor： Djordjevic, Aleksandra ,  Berlin, Carl W.

IPC: H01L23/498

CPC classification number: H01L23/49861 ,  H01L21/4846 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method for forming a leadframe assembly (22) is provided. The method includes the steps of providing a sheet (10) of leadframe material and depositing a brazing alloy (12) on a first surface of the sheet (10). The method also includes the steps of placing one or more substrates (16) on the first surface of the sheet (10) and in contact the brazing alloy (12), and heating the brazing alloy (12) to bond the substrate (16) to the first surface of the sheet (10).

公开(公告)号：EP1942557A1

公开(公告)日：2008-07-09

申请号：EP07120978.7

申请日：2007-11-19

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Nair, Deepukumar M.

IPC: H01Q15/00 ,  H01P1/203

CPC classification number: H01Q15/0026 ,  H01P1/2005 ,  H01Q15/006 ,  H05K1/0216 ,  H05K2201/09309 ,  H05K2201/09609 ,  Y10T29/49016

Abstract: A high-frequency Electromagnetic Bandgap (EBG) device (70,90), and a method (100) for making the device are provided. The device (70,90) includes a first substrate (72) including multiple conducting vias (74) forming a periodic lattice. The vias (74) ofthe first substrate (72) extend from the lower surface ofthe first substrate (72) to the upper surface of the first substrate (72). The device (70,90) also includes a second substrate (76) having multiple conducting vias (78) forming a periodic lattice. The vias (78) ofthe second substrate (76) extend from the lower surface of the second substrate (76) to the upper surface of the second substrate (76). The second substrate (76) is positioned adjacent to, and overlapping, the first substrate (72), such that the lower surface of the second substrate (76) is in contact with the upper surface of the first substrate (72), and such that a plurality of vias (78) of the second substrate (76) are in contact with a corresponding plurality of vias (74) of the first substrate (72).

Abstract translation: 提供高频电磁带隙（EBG）装置（70,90）和制造该装置的方法（100）。 器件（70,90）包括第一衬底（72），其包括形成周期性晶格的多个导电通孔（74）。 第一基板（72）的通孔（74）从第一基板（72）的下表面延伸到第一基板（72）的上表面。 器件（70,90）还包括具有形成周期性晶格的多个导电通孔（78）的第二衬底（76）。 第二基板（76）的通路（78）从第二基板（76）的下表面延伸到第二基板（76）的上表面。 第二基板（76）定位成与第一基板（72）相邻并重叠，使得第二基板（76）的下表面与第一基板（72）的上表面接触， 所述第二基板（76）的多个通孔（78）与所述第一基板（72）的对应的多个通孔（74）接触。

公开(公告)号：EP1628515A1

公开(公告)日：2006-02-22

申请号：EP05076577.5

申请日：2005-07-11

Applicant: Delphi Technologies, Inc.

Inventor： Chang, Shih-chia ,  Berlin, Carl W. ,  Myers, Bruce A. ,  Fairchild, Ray M. ,  Peugh, Darrel E.

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20254 ,  H05K1/0206 ,  H05K1/0272 ,  H05K3/4611 ,  H05K2201/064

Abstract: The present invention provides a method for producing an electronic assembly and an electronic assembly (10, 100, 200, 300, 600) with an integrated cooling system for dissipating heat. The electronic assembly comprises a base (18, 218, 318, 618); and at least one electrical component (30, 230, 330, 630) attached to the base (18, 218, 318, 618). The base (18, 218, 318, 618) defines an integrated cooling system having a fluid channel (11, 211, 311, 611) spanning within the base (18, 218, 318, 618) and at least one heat exchanger (12, 13) in heat communication with the fluid channel (11, 211, 311, 611). The integrated cooling system may further include a pump (14) attached to the base (18, 218, 318, 618) for directing the flow of the fluid within the fluid channel (11, 211, 311, 611), and a port (16) in fluid communication with the fluid channel (11, 211, 311, 611) for receiving fluid from an external source.

Abstract translation: 本发明提供了一种用于制造电子组件和具有用于散热的集成冷却系统的电子组件（10,100,200,300,600）的方法。 电子组件包括基座（18,218,318,618）; 以及附接到基座（18,218,318,618）的至少一个电气部件（30,230,330,630）。 底座（18,218,318,618）限定了一个整体的冷却系统，该冷却系统具有横跨在基座（18,218,318,618）内的流体通道（11,211,311,611）和至少一个热交换器 ，13）与所述流体通道（11,211,311,611）热连通。 集成冷却系统还可以包括附接到基座（18,218,318,618）的泵（14），用于引导流体在流体通道（11,211,311,611）内的流动，以及一个端口 16）与流体通道（11,211,311,611）流体连通，用于从外部源接收流体。