Abstract:
An electronic circuit includes an array of a plurality of memory cells that are functionally organized in rows and columns. The circuit comprises test means that are selectively operative to access all cells of the array in parallel. An IDDQ-test then discovers whether or not there is a defect in any of the cells.
Abstract:
An SRAM has a plurality of respective memory cells coupled to a respective one of a plurality of word lines and to a pair of bit lines. The SRAM comprises IDDQ test means to render the word lines active in parallel by cumulatively increasing a number of active ones among the word lines. This permits the writing of a specific logic state in all cells of a column through the tiny bit line drivers that are progressively assisted by the cells already written, thus avoiding the use of additional heavy write circuitry for IDDQ test purposes only.
Abstract:
An active power supply filter effectively eliminates power supply noise using a resistive element and a capacitive element coupled at a node, and a switch with a control terminal controlled by the node. The active power supply filter is suitable for high frequency operation of a voltage-controlled oscillator (VCO) in a phase-locked loop (PLL) of a high-speed microprocessor. The active power supply filter removes VCO noise that would otherwise create jitter that reduces the effective clock cycle of the microprocessor. The active power supply filter is similarly useful in applications other than VCOs, PLLs, and microprocessors in which removal of substantial amounts of noise from the power supply is useful.
Abstract:
A system for testing and adjusting threshold voltages in flash EEPROMs is disclosed. The system includes a memory cell array (5) comprising a plurality of cell columns. Each cell column includes a plurality of memory cells (10). Each memory cell (10) has a control gate terminal (14), a drain terminal (12) and a source terminal 11. A control system comprising a wordline decoder (16), a column decoder (19) and a microprocessor (21) applies selected voltages to the respective terminals of the memory cells (10), and selects one of the plurality of cell columns for compaction verification. A detector (30) determines whether any one of the memory cells (10) of the selected cell column has a threshold voltage below a predetermined positive voltage, and supplies an output signal to the control system. The control system increases respective threshold voltages of the memory cells (10) of the selected cell column in response to the output signal of the detector (30).
Abstract:
An object of the present invention is to provide a semiconductor device that permits easy and efficient testing. A nonvolatile semiconductor memory comprises word lines WLi and bit lines BLi, a memory cell matrix 17 consisting of nonvolatile memory cells Cij, a sense amplifier 15, a write/erase timing circuit 9 for performing timing control necessary for write and erase operations, and a status register 2 for storing the operating state of the memory at the completion of the operation of the circuit 9, wherein there are provided, outside the address of the memory cell matrix 17, two kinds of dummy cells, D1, D2, D3,..., whose values are fixed to different values that induce different outputs from the sense amplifier 15. A pass condition or a fail condition is generated by accessing the dummy cells.
Abstract:
A method for setting the threshold voltage of a reference memory cell (RMC) of a memory device is described, the reference memory cell (RMC) being used as a reference current generator for generating a reference current which is compared by a sensing circuit (1,2,3) of the memory device with currents sunk by memory cells to be sensed, belonging to a memory matrix (MM) of the memory device. The method comprises a first step in which the reference memory cell (RMC) is submitted to a change in its threshold voltage, and a second step in which the threshold voltage of the reference memory cell (RMC) is verified. The second step provides for performing a sensing of the reference memory cell (RMC) using a memory cell (MC) with known threshold voltage (V TUV ) belonging to the memory matrix (MM) as a reference current generator for generating a current (IC) which is compared by the sensing circuit (1,2,3) with the current (IR) sunk by the reference memory cell (RMC).
Abstract:
A method employing a test structure (10) identical to the memory array whose gate oxide or interpoly dielectric quality is to be determined, except for the fact that the cells are connected electrically (13-15, 17, 18, 19-21) parallel to one another. The test structure is subjected to electrical stress of such a value and polarity as to extract electrons from the floating gate of the defective-gate-oxide or defective-interpoly-dielectric cells and so modify the characteristic of the cell while leaving the charge of the non-defective cells unchanged. In this way, only the threshold of the defective cells is altered. A subthreshold voltage is then applied to the test structure, and the drain current through the cells, which is related to the presence of at least one defective cell in the structure, is measured. Measurement and analysis of the current-voltage characteristic provides for determining the number of defective cells. The method is suitable for in-line quality control of the gate oxide or interpoly dielectric of EPROM, EEPROM and flash-EEPROM memories.