公开(公告)号：EP1705971B1

公开(公告)日：2007-10-31

申请号：EP06013130.7

申请日：2005-06-21

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Sakai, Tadahiko ,  Maeda, Tadashi

IPC: H05K3/34

CPC classification number: H05K3/3436 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/1182 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2224/29499 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/758 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/035 ,  H05K2203/0338 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

公开(公告)号：EP1772876A3

公开(公告)日：2007-10-03

申请号：EP06018840.6

申请日：2006-09-08

Applicant: E.I. du Pont de Nemours and Company

Inventor： Akimoto, Hideki

IPC: H01C17/242

CPC classification number: H01C17/24 ,  H05K1/095 ,  H05K1/167 ,  H05K3/125 ,  H05K3/247 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2203/013 ,  H05K2203/0361 ,  H05K2203/171

Abstract: Described herein is a resistor (11) to which a trimming process is applied (hereinafter, also called a trimming resistor), a method for manufacturing a trimming resistor (11) and a circuit substrate (30a) using the trimming resistor (11).

公开(公告)号：EP1713170A2

公开(公告)日：2006-10-18

申请号：EP06007600.7

申请日：2006-04-11

Applicant: FANUC LTD

Inventor： Odaka, SHunichi ,  Kariya, Isao, Rm. 6-303

IPC: H02N1/00

CPC classification number: H05K1/0254 ,  H02N1/004 ,  H05K3/244 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/098 ,  Y10T29/49002 ,  Y10T29/49009

Abstract: A method of production of electrodes for an electrostatic motor generating electrostatic force between a facing stator and slider, including forming core electrodes on a board of at least one of the stator and the slider by patterning a conductive substance and depositing a conductive substance on the core electrodes so that the side edges become rounded. Any method selected from electroplating, electroless plating, electrostatic coating, or screen printing can be used to deposit the conductive substance on the core electrodes. The core electrodes may be patterned using non-etching means. Further, electrodes for an electrostatic motor generating an electrostatic force between a facing stator and slider provided with core electrodes patterned on the board of at least one of the stator and the slider and a conductive substance deposited on the core electrodes to form deposition layers so that the side edges become rounded.

Abstract translation: 生产电极的用于在静电马达产生面向定子和滑动件之间的静电力，其中包括在所述定子的至少一个的板以及通过对所述芯图案化的导电物质和沉积导电物质滑块形成芯电极的方法 电极所以没有侧边变得圆润。 从电镀，化学镀，静电涂装法，或丝网印刷中的任意方法可以被用来对导电电极芯沉积物质。 芯电极可以使用非蚀刻装置来形成图案。 此外，电极，用于在设置有图案化在所述定子的至少一个的板和滑块并沉积在芯电极的导电物质，以形成沉积层，从而做芯电极的面临定子和滑动件之间的静电力的静电马达产生 侧边缘变圆。

公开(公告)号：EP1488880A2

公开(公告)日：2004-12-22

申请号：EP04012883.7

申请日：2004-06-01

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Akamatsu, Hiroshi ,  Kawamura, Yukinori ,  Kai, Hiroshi ,  Kuramoto, Osamu ,  Iwasaki, Shigeru ,  Asai, Kenji ,  Hibino, Minoru

IPC: B23K1/19

CPC classification number: H05K3/3415 ,  B23K3/0638 ,  B23K2201/42 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10992 ,  H05K2203/0545 ,  H05K2203/111 ,  H05K2203/1121 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T428/12493

Abstract: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.

Abstract translation: 形成了具有优良特性的锌基无铅焊料的焊料接合结构体的结构是游离缺失盘。 第一无铅焊料层和焊接垫之间，下面的层是儿童：在形成于焊盘上的锡 - 铜合金层; 形成的第二无铅层的哪个主要成分是锡和银的第一合金层; 和第二合金层中的第一合金层和第一无铅焊料之间形成。 这种结构允许形成形成具有高接合强度的锌基无铅焊料的焊料接合结构。

公开(公告)号：EP1215701A3

公开(公告)日：2004-03-31

申请号：EP01129851.0

申请日：2001-12-14

Applicant: CANON KABUSHIKI KAISHA

Inventor： Uda, Yoshimi ,  Ishiwata, Kazuya ,  Kubo, Shinsaku ,  Watanabe, Yasuyuki

IPC: H01J29/02 ,  H05K1/02

CPC classification number: H05K1/0271 ,  H01J29/02 ,  H01J31/127 ,  H01J2329/0489 ,  H01J2329/861 ,  H05K1/092 ,  H05K3/248 ,  H05K2201/035 ,  H05K2201/09745 ,  H05K2203/0514 ,  Y10T29/49147 ,  Y10T29/49174 ,  Y10T29/53204 ,  Y10T29/53209

Abstract: As a substrate having a fine line and capable of suppressing crack generation in the substrate and peeling of the fine line, the invention discloses a configuration in which plural recesses are arranged on the fine line, and particularly a configuration in which the interval of the plural recesses does not exceed 200 µm. There is also disclosed a configuration in which the plural recesses are arranged along a direction crossing the longitudinal direction of the fine line.

公开(公告)号：EP1278405A1

公开(公告)日：2003-01-22

申请号：EP01270088.6

申请日：2001-12-04

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： TAKENAKA, Toshiaki ,  NISHII, Toshihiro ,  SUGITA, Yuichiro ,  NAKAMURA, Shinji ,  KOMODA, Hideaki ,  KONDO, Toshikazu

IPC: H05K3/40 ,  H05K3/28 ,  H05K3/46 ,  B05C11/00 ,  B05D7/00

CPC classification number: H05K3/4069 ,  H05K1/095 ,  H05K3/1233 ,  H05K3/247 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2203/1461 ,  H05K2203/1476 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through- holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through- holes or the blind-holes.

Abstract translation: 一种制造多层电路板的方法，包括：用于在板状或片状基板材料上形成通孔或盲孔的孔形成步骤，以及将糊料填充到通孔或盲孔中的填充步骤 通过使用填充装置在孔形成步骤中形成的孔。 通过使用糊料供给装置，在糊料的填充处理中，向浆料供给第二糊料，使糊料的粘度稳定，并且可靠地将糊料填充到通孔或盲孔中。

公开(公告)号：EP1081990A3

公开(公告)日：2002-03-20

申请号：EP00250275.5

申请日：2000-08-11

Applicant: Micro-Tec Company, Ltd.

Inventor： Sano, Yasushi, c/o Micro-Tec Company, Ltd.

IPC: H05K3/34

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/1132 ,  H01L2224/11901 ,  H01L2924/00013 ,  H05K3/1216 ,  H05K3/3452 ,  H05K2201/035 ,  H05K2203/043 ,  H01L2224/29099

Abstract: This invention provides screen printing for forming a higher solder ball (bump). In first printing step, a first solder layer is printed. After drying in drying step, a second solder layer is printed on the first solder layer in second printing step. Then, in re-flow processing step, re-flow processing is performed, and the first solder layer and the second solder layer are melted. Finally, the melted layer is solidified in a ball shape to form the solder ball (bump). Since solder paste is printed in layers, an amount of the solder paste can be increased. Hence, a higher solder ball (bump) can be formed.

公开(公告)号：EP0790644B1

公开(公告)日：2001-09-05

申请号：EP97101426.1

申请日：1997-01-30

Applicant: AB Mikroelektronik Gesellschaft m.b.H.

Inventor： Wilczek, Klaus-Peter

IPC: H01L21/70 ,  H01L27/01 ,  H01C17/28

CPC classification number: H05K1/167 ,  H01C17/283 ,  H05K1/092 ,  H05K3/1291 ,  H05K3/248 ,  H05K2201/035 ,  H05K2203/086 ,  H05K2203/1126

公开(公告)号：EP1009205A1

公开(公告)日：2000-06-14

申请号：EP98923141.0

申请日：1998-06-05

Applicant: IBIDEN CO., LTD.

Inventor： ENOMOTO, Ryo, Ogaki-kita-kojou, Ibiden K.K. ,  HIRAMATSU, Yasuji, Ogaki-kita-kojou, Ibiden K.K.

IPC: H05K3/46 ,  H05K3/40

CPC classification number: H05K3/4617 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/382 ,  H05K3/386 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/035 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0733 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Holes (40a) are formed with a laser beam through an insulating substrate (40) on which a metallic layer (42) is formed and via holes (36a) are formed by filling up the holes (40a) with a metal (46). After the via holes (36a) are formed, a conductor circuit (32a) is formed by etching the metallic layer (42) and a single-sided circuit board (30A)is formed by forming projecting conductors (38a) on the surfaces of the via holes (36a). The projecting conductors (38a) on the circuit board (30A) are put on the conductor circuit (32b) of another single-sided circuit board (30B) with adhesive layers (50) composed of an uncured resin in-between and heated and pressed against the circuit (32b). The projecting conductors (38a) get in the uncured resin by pushing aside the resin and are electrically connected to the circuit (32b). Since single-sided circuit boards (30A, 30B, 30C, and 30D) can be inspected for defective parts before the boards (30A, 30B, 30C, and 30D) are laminated upon one another, only defectless single-sided circuit can be used in the step of lamination.

公开(公告)号：EP1009204A1

公开(公告)日：2000-06-14

申请号：EP98923140.2

申请日：1998-06-05

Applicant: IBIDEN CO., LTD.

Inventor： ENOMOTO, Ryo, Ogaki-kita-kojou, Ibiden K.K. ,  HIRAMATSU, Yasuji, Ogaki-kita-kojou, Ibiden K.K.

IPC: H05K3/46

CPC classification number: H05K3/4617 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/382 ,  H05K3/386 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/035 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0733 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Holes (40a) are formed with a laser beam through an insulating substrate (40) on which a metallic layer (42) if formed. After the holes (40A) are formed, via holes (36a) are formed by filling up the holes (40a) with a metal (46) and a conductor circuit (32a) is formed by etching the metallic layer (42). Then, a single-sided circuit board (30A)is formed by forming projecting conductors (38a) on the surfaces of the via holes (36a). The projecting conductors (38a) of the circuit board (30A) are put on the conductor circuit (32b) of another single-sided circuit board (30B) with adhesive layers (50) composed of an uncured resin in between and heated and pressed against the circuit (32b). The projecting conductors (38a) get in the uncured resin by pushing aside the resin and are electrically connected to the circuit (32b). Since single-sided circuit boards (30A, 30B, 30C, and 30D) can be inspected for defective parts before the boards (30A, 30B, 30C, and 30D) are laminated upon another, only defectless single-sided circuit boards can be used in the step of lamination.

Abstract translation: 穿过其上形成有金属层（42）的绝缘衬底（40）的激光束形成孔（40a）。 在形成孔40A之后，通过用金属46填充孔40a形成通孔36a，并且通过蚀刻金属层42形成导体电路32a。 然后，通过在通孔（36a）的表面上形成突出导体（38a）形成单面电路板（30A）。 将电路板30A的突出导体38a放置在另一个单面电路板30B的导体电路32b上，其中粘合剂层50由未固化的树脂构成， 电路（32b）。 突出导体（38a）通过推开树脂而进入未固化树脂中并电连接到电路（32b）。 由于在板（30A，30B，30C和30D）彼此层叠之前可以检查单面电路板（30A，30B，30C和30D）的缺陷部分，所以只能使用无缺陷的单面电路板 在层压步骤中。