Abstract:
The invention relates to a HF-reactor for printed circuit boards. Said HF-reactor comprises an inductor and an ohmic resistor which is mounted in a parallel manner thereto. The inductor is made of a meandering-type conductor (16) belonging to the printed circuit-board (16). The ohmic resistor is made of a resistance layer (18) which has a higher specific resistance than the meandering-type guided conductor.
Abstract:
Techniques for reducing the number of layers in a multilayer signal routing device (10) are disclosed. In one particular exemplary embodiment, the techniques may be realized as a method wherein the multilayer signal routing device (10) has a plurality of electrically conductive signal path layers (16) for routing a plurality of electrical signals thereon. The method may comprise forming a plurality of electrically conductive vias (26) in the multilayer signal routing device for electrically connecting at least two of the plurality of electrically conductive signal path layers (16), wherein the plurality of vias (26) are arranged so as to form at least one channel in at least one other of the plurality of electrically conductive signal path layers (16). The method may also comprise grouping at least a portion of the plurality of electrical signals based at least in part upon their proximity to the at least one channel so that they may be efficiently routed therein.
Abstract:
A method of optimizing the frequency response of an interconnect system of the type which conveys high frequency signals between bond pads of separate integrated circuits (ICs) mounted on a printed circuit board (PCB) through inductive conductors, such as bond wires and package legs, and a trace on the surface of the PCB. To improve the interconnect system, capacitance is added to the trace and inductance is added to the conductors, with the added trace capacitance and conductor inductance being appropriately sized relative to one another and to various other interconnect system impedances to optimize the interconnect system impedance matching frequency response.
Abstract:
An apparatus comprises a first plane adapted to receive a first voltage level and a second plane adapted to receive a second voltage level. The apparatus further comprises a path asymmetrically positioned between the first plane and the second plane. The path is capable of providing the network connection to one or more devices within a processor-based system, typically for the purpose of management of one or more domains in the system.
Abstract:
Zwischen den zweidrahtigen Anschluss (2) und der Kommunikationseinrichtung (3) ist jeweils ein als Überstrom-Sicherung wirkendes, durch gedruckte Leiterbahnen gebildetes Längsglied (5) eingefügt, denen ein als Überspannungsschutz wirkendes Querglied (6) nachgeschaltet ist. Die geometrische Ausgestaltung der Längsglieder (5) und die Anordnung sowie die Eigenschaften des Quergliedes (6) sind derart aufeinander abgestimmt, dass eine möglichst hohe thermische Rückkopplung vom Querglied (6) auf die Längsglieder (5) erreicht wird. Die Schutzschaltung kann kostengünstig realisiert werden und ist für hohe Anforderung an Überspannungs- und Überstromschutz geeignet.
Abstract:
A gap-coupling bus system in which data can be transferred between all modules connected to a bus. The gap-coupling bus system has at least three modules (11-16) which each have at least one transmission/reception circuit, at least three signal lines (21-16) whose one ends are connected to the modules (11-16) respectively, and terminating resistors (31-36) which are connected to the other ends of the signal lines (21-26) and whose resistance values are nearly the same as the characteristic impedances of the signal lines (21-26). The at least three signal lines (21-26) have portions (1-2, 1-3, 2-3, ...) where the signal lines of two different modules among the at least three modules (11-16) are in parallel with each other.
Abstract:
A circuit board (32) such as a memory module board mounts a plurality of memory modules (40) that are electrically connected to a module bus (36) on a first surface of the board (32). The module bus is coupled to a connector (34) at a first end thereof that permits an electrical coupling of a plurality of electrical conductors of the module bus to an external large integrated circuit board, and a terminating resistor device (42) at a second end thereof for properly terminating predetermined ones of the plurality of electrical conductors of the module bus. The module bus (36) is extended beyond the last memory module (40) along the bus by a length which is sufficient to substantially limit reflections and/or crosstalk between the conductors and thereby improve signaling along the module bus. In a first embodiment, the module bus (36) is extended around an edge of the board and for a predetermined distance over any unused portions of the backside of the board (32). In a second embodiment, the module bus is extended for a maximum predetermined distance along any unused portions of the front side of the board (32) when the backside of the board is unavailable for extending the module bus (36).
Abstract:
A flat flexible electrical cable includes a pair of pseudo-twisted conductors (3a, 3b) on a flexible dielectric substrate (2, d). Each conductor includes alternate straight (4) and oblique (5) sections. The straight sections (4) of the conductors are generally parallel to each other and of uniform width. The oblique sections (5) of the conductors cross each other at a crossover point (8). Each oblique section (5) of each conductor is reduced in width uniformly in a direction from the straight-to-oblique transfer point (7) of the respective conductor to the crossover point (8) of the conductors (3a, 3b).