Abstract:
Un système de connexions électriques, par exemple un tableau de connexions à face rabattables, comporte un profilé de support (12) recevant des premiers connecteurs (14) dont les contacts sont orientés vers l'extérieur du profilé (12). Un câble introduit entre le profilé et les connecteurs se divise en conducteurs individuels aboutissant à des contacts (34, 36) via des fentes (30) dans les parois du profilé. Un second connecteur (16) porte des prises de communications vocales ou de données classiques (19) qui sont reliées aux premiers connecteurs par l'intermédiaire de cartes de circuits imprimés (38) qui s'enfichent dans des fentes (40) des premiers connecteurs. Les connecteurs plats des cartes ont une discontinuité sur une surface, et une moitié du contact est reliée au contact sur l'autre face pour permettre une connexion directe entre les rangées de contacts supérieures (34) et inférieures (36) des premiers connecteurs dans une première position des seconds connecteurs, et permettre également un contact entre les rangées de contacts supérieures et inférieures et les prises classiques (19) dans une seconde position.
Abstract:
Die Erfindung betrifft eine Schaltungsplatine für die optimale Entkopplung von Schaltungen mit digitalen IC's. Die Platine ist gekennzeichnet durch eine mit einem SMD-Kondensator (7) und zwei damit verbundenen und zu den zu entkoppelnden Punkten führenden Leiterbahnen (3, 4) versehene Platine (1), die mit allen vorhandenen Präzisionskontaktanschlüssen bestückbar ist. Weiterhin ist die Platine der Form des IC's oder des IC-Sockels angepaßt und weist jeweils eine der Anzahl der Kontaktstifte des IC's oder der Kontaktanschlüsse des IC-Sockels entsprechende Anzahl von Bohrungen (2) auf, wobei die zum SMD-Kondensator (7) führenden Leiterbahnen verhältnismäßig breit ausgebildet sind und zu den Anschlüssen der zu entkoppelnden Punkte führen.
Abstract:
A double-sided board circuit includes a board (11) having insertion holes (12), a pair of electrically conductive patterns (15) disposed on the face and back of the board (11), and an electronic component (13) having directly connected electrically conductive wires (13a) inserted respectively through the insertion holes (12), at least one of the conductive wires being soldered at two positions to the conductive patterns (15) on the face and back of the board (11) to electrically connect the conductive patterns (15).
Abstract:
Ce plot de report de connexion de bord est destiné à la fixation d'une broche de connexion (30). Il présente deux plages étamables (17, 18) placées en vis à vis sur les côtés opposés d'un bord de substrat (10), aux endroits de préhension des griffes (33, 34, 35) de la broche (30) qui forment les mâchoires d'une pince élastique. Ces plages étamables (17, 18) sont entaillées de rainures (19, 20) aux emplacements des chemins de coulissement suivis par les griffes (33, 34, 35) lors de la mise emplace de la broche (30). Elles ont, dans le cas d'une broche (30) à trois griffes de même largeur totale qu'elles, l'une (17) la forme générale d'un U et l'autre (18) celle d'un T. Leur intérêt est de restreindre l'amplitude de l'ouverture de la pince de la broche et de lui assurer un centrage automatique sur le plot lorsque les plages (17, 18) sont déjà étamées.
Abstract:
A display device comprises a display panel having electrodes with a plurality of terminals, a driver circuit having electrodes corresponding to the display panel electrodes, and anisotropic conductive film for electrically connecting the display panel electrodes with the driver circuit electrodes, the connecting part of each of the driver circuit electrodes to be connected with each of the display panel electrodes comprising a first connecting portion and a second connecting portion, the first connecting portion being narrower than the second connecting portion.
Abstract:
A substrate (10) for mounting electrically-powered light radiation sources, e.g. LED sources, includes a base layer (12) of electrically-insulating material, such as PET, and a contact layer (141, 142) of electrically conductive material, e.g. copper. The contact layer includes a mounting area for a light radiation source having opposed anode and cathode terminals, including two portions (141, 142) with a gap (143) therebetween. Therefore, the light radiation source may be mounted bridge-like across gap (143), with anode and cathode terminals soldered to respective soldering surfaces (S1, S2) provided in the one (141) and the other (142) of said two portions (141, 142) of the mounting area. The latter portions include respective solder flow blocking formations including fork-shaped apertures (161, 162) in contact layer (141, 142) leaving base layer (12) uncovered. The fork-shaped apertures (161, 162) have a web portion (1610, 1620) and prongs (1612, 1622) extending from web portion (1610, 1620) towards said soldering surfaces (S1, S2).
Abstract:
A light emitting device includes a substrate, a plurality of first wiring members, a plurality of second wiring members and a plurality of light emitting elements. The first wiring members extend in a first direction. The second wiring members extend in a second direction. Each of the second wiring members is segmented into a plurality of second wiring portions. The light emitting elements are disposed along the second direction. A first electrode of the light emitting element is connected to a corresponding one of the first wiring members. A second electrode of the light emitting element has a first connection part and a second connection part that is linked to the first connection part. The first connection part and the second connection part are connected to a corresponding one of the second wiring members and bridge at least two of the segmented second wiring portions in the second direction.
Abstract:
The objective of the present invention is to improve reliability in a solder connection portion between an electronic component and a wiring pattern. A pair of wiring patterns (31A and 31B) are formed on a circuit wiring board (30) with an insulation layer (37) therebetween. Each wiring pattern (31A and 31B) has a land (33a or 33b) and a wiring portion (34a or 34b) that is narrower than the land. By way of solder (42), a chip component (41) is soldered to the lands (33a and 33b). The x (width) direction center (Xa) of each connection portion (53) where a respective wiring portion (34a or 34b) is connected to a respective land (33a or 33b) is disposed at a position that is outside of both the region in which a region of predetermined width (Wc) of the chip component (41) extends in the x (longitudinal) direction, and the region in which a region of predetermined length (Lc) of the chip component (41) extends in a y (transverse) direction.
Abstract:
The invention proposes a printed circuit board (100) having a plurality of layers, which have at least one outer layer (110, 120) and at least one inner layer (130, 140) adjoining the outer layer (110, 120). The printed circuit board (100) has a plurality of micro throughplatings (170), which are formed between a supply voltage area of the at least one outer layer (110, 120) and a supply voltage area of the at least one inner layer (130, 140).