公开(公告)号：EP2918706A1

公开(公告)日：2015-09-16

申请号：EP15152403.0

申请日：2015-01-23

Applicant: Senju Metal Industry Co., Ltd

Inventor： Kawasaki, Hiroyoshi ,  Roppongi, Takahiro ,  Soma, Daisuke ,  Sato, Isamu

IPC: C25D5/10 ,  C25D5/12 ,  C25D7/00 ,  H05K3/34 ,  B23K35/26 ,  B22F9/08 ,  C22F1/08 ,  C22C9/00 ,  C22C13/00 ,  B23K35/30 ,  B23K35/02 ,  H01B1/02 ,  H01L23/00 ,  C25D3/60

CPC classification number: C25D3/60 ,  B22F1/025 ,  B22F9/08 ,  B22F2301/10 ,  B22F2301/30 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/302 ,  B23K2201/40 ,  C22C9/00 ,  C22C13/00 ,  C25D3/30 ,  C25D5/12 ,  C25D5/20 ,  F16B5/08 ,  H01B1/02 ,  H01L24/13 ,  H01L2224/13014 ,  H01L2224/13147 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0109 ,  H01L2924/01092 ,  H01L2924/12042 ,  H01L2924/15321 ,  H05K3/3436 ,  H05K2201/0218 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A Cu core ball suppresses a soft error and its alpha dose is low. Its surface roughness does not affect a mounting process. A pure degree of the Cu ball as an internal ball is equal to or larger than 99.9% and equal to or less than 95%. A total contained amount of Pb and/or Bi in impurity contained in the Cu ball is equal to or larger than 1 ppm. Its sphericity is equal to or higher than 0.95. A solder plating film coated on the Cu ball is a Sn solder plating film or a solder plating film comprising a lead free solder alloy whose primary component is Sn. In the solder plating film, a contained amount of U is equal to or less than 5 ppb and that of Th is equal to or less than 5 ppb. A total alpha dose of the Cu ball and the solder plating film is equal to or less than 0.0200 cph/cm 2 . An arithmetic average roughness of the Cu core ball is equal to or less than 0.3 µm.

Abstract translation: 铜芯球抑制软错误，其α剂量低。 其表面粗糙度不影响安装过程。 作为内部球的Cu球的纯度等于或大于99.9％且等于或小于95％。 包含在Cu球中的杂质中Pb和/或Bi的总含量等于或大于1ppm。 其球形度等于或高于0.95。 涂覆在Cu球上的焊料镀膜是Sn焊料镀膜或包含无铅焊料合金的焊锡镀膜，其主要成分为Sn。 在焊锡镀膜中，U的含量等于或小于5ppb，Th的含量等于或小于5ppb。 Cu球和焊料镀膜的总α剂量等于或小于0.0200cph / cm 2。 Cu芯球的算术平均粗糙度等于或小于0.3μm。

公开(公告)号：EP1837119B1

公开(公告)日：2015-02-11

申请号：EP05814212.6

申请日：2005-12-06

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： TAKAOKA, Hidekiyo ,  NAKANO, Kosuke

IPC: B23K35/22 ,  H05K3/34 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362

CPC classification number: B23K35/0244 ,  B23K35/025 ,  B23K35/226 ,  B23K35/262 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0272

公开(公告)号：EP2145337B1

公开(公告)日：2014-08-13

申请号：EP08718986.6

申请日：2008-04-04

Applicant: MBDA UK Limited

Inventor： DUNLEAVY, Michael ,  HAQ, Sajad ,  DAVIES, Joseph, Maurice ,  REW, Jason, Karl

IPC: H01B3/00

CPC classification number: B29C39/10 ,  H01B3/006 ,  H01G4/206 ,  H05K1/024 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0254 ,  Y10T428/24967

公开(公告)号：EP2667990A1

公开(公告)日：2013-12-04

申请号：EP12739136.5

申请日：2012-01-25

Applicant: Lockheed Martin Corporation

Inventor： ZINN, Alfred, A.

IPC: B22F9/18

CPC classification number: B22F1/0018 ,  B22F1/0062 ,  B22F9/24 ,  B22F2999/00 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/125 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2203/0514 ,  H05K2203/107 ,  B22F2301/10 ,  B22F2304/054

Abstract: Processes for synthesizing metal nanoparticles, particularly copper nanoparticles, are described. The processes can involve reacting an insoluble complex of a metal salt with a reducing agent in a reaction mixture containing a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant. More specifically, processes for forming copper nanoparticles can involve forming a first solution containing a copper salt, a primary amine first surfactant, a secondary amine second surfactant, and a diamine chelating agent third surfactant; allowing an insoluble complex of the copper salt to form from the first solution; combining a second solution containing a reducing agent with the insoluble complex; and forming copper nanoparticles from the insoluble complex. Such copper nanoparticles can be about 10 nm or smaller in size, more particularly about 3 nm to about 6 nm in size, and have a fusion temperature of about 200° C. or lower.

公开(公告)号：EP2308904A4

公开(公告)日：2012-11-14

申请号：EP09802911

申请日：2009-07-27

Applicant: SEKISUI CHEMICAL CO LTD

Inventor： WADA TAKUYA ,  NAGATANI NAOYUKI

IPC: C08F220/10 ,  C08J3/12

CPC classification number: H05K3/323 ,  C01P2004/84 ,  C08F220/18 ,  C08F222/1006 ,  C09C3/10 ,  H05K2201/0218 ,  H05K2201/0221

公开(公告)号：EP2461655A1

公开(公告)日：2012-06-06

申请号：EP10193841.3

申请日：2010-12-06

Applicant: Nederlandse Organisatie voor Toegepast -Natuurwetenschappelijk Onderzoek TNO

Inventor： Abbel, Robert J. ,  Meulendijks, Nicole ,  Meinders, Erwin Rinaldo ,  Boersma, Arjen

IPC: H05K1/09 ,  H05K3/12

CPC classification number: H01B1/16 ,  H01B19/04 ,  H05K1/092 ,  H05K3/12 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/026

Abstract: The invention relates to a method for preparing a conductive or semi-conductive element, comprising
- providing a dispersion of an anisotropic particulate hybrid material in a continuous phase, which hybrid material comprises (a) anisotropic particles, and (b) a conductive or semi-conductive material or a precursor for a conductive or semi-conductive material;
- applying the dispersion to a surface of a substrate; and
- forming the conductive or semi-conductive element from the dispersion applied to the surface.
Further the invention relates to materials useful for use in a method of the invention and an electronic device obtainable by a method according to the invention.

Abstract translation: 本发明涉及一种制备导电或半导电元件的方法，包括 - 提供各向异性颗粒混合材料在连续相中的分散体，该混合材料包括（a）各向异性颗粒，和（b）导电或半导体 导电材料或导电或半导体材料的前体; - 将分散体施加到基材的表面; 以及 - 从施加到表面的分散体形成导电或半导体元件。 此外，本发明涉及可用于本发明方法的材料和通过根据本发明的方法获得的电子装置。

公开(公告)号：EP1921176A3

公开(公告)日：2012-04-04

申请号：EP07119869.1

申请日：2007-11-02

Applicant: Sulzer Metco (US) Inc.

Inventor： Schmid, Dr., Richard K. ,  Doesburg, Jacobus C.

IPC: C23C4/12 ,  C23C24/04 ,  B23K35/26 ,  B22F3/115 ,  B22F1/02 ,  H05K3/34

CPC classification number: C23C24/04 ,  B22F1/025 ,  B22F3/115 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K35/36 ,  B23K35/383 ,  C23C4/12 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2203/0425 ,  H05K2203/1344 ,  Y10T428/12181

Abstract: The present invention provides a powder blend or composite powder that is fed into a kinetic spray device, accelerated towards a substrate or part in order to form a composite solder with thermal and electrical properties better than existing solder. The other advantages of building a solder layer in this manner include a low oxide content to improve subsequent soldcrability, excellent control of the deposition thickness, excellent control of the deposition chemistry and lastly, high speed of manufacture.

公开(公告)号：EP2346680A1

公开(公告)日：2011-07-27

申请号：EP09813434.9

申请日：2009-08-20

Applicant: Lockheed Martin Corporation

Inventor： ZINN, Alfred, A.

IPC: B32B15/02

CPC classification number: C23C24/08 ,  B22F1/0018 ,  B22F1/0062 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2203/107 ,  Y10S977/777 ,  Y10T428/12028 ,  Y10T428/12049 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220 0C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers.

Abstract translation: 组合物可以具有直径为20纳米或更小的金属纳米颗粒并且具有小于约220℃的熔化温度。 制造金属纳米粒子的方法可以包括制备溶剂，向溶剂中加入具有金属的前体，添加第一表面活性剂，混合在还原剂中，并添加第二表面活性剂以停止纳米粒子的形成。 所形成的铜和/或铝纳米粒子组合物可用于电子元件到电路板的无铅焊接。 组合物可以包括纳米颗粒，其可以具有铜纳米芯，无定形铝壳和有机表面活性剂涂层。 组合物可以具有铜或铝纳米颗粒。 约30-50％的铜或铝纳米颗粒可以具有20纳米或更小的直径，并且剩余的70-50％的铜或铝纳米颗粒可以具有大于20纳米的直径。

公开(公告)号：EP2130627A1

公开(公告)日：2009-12-09

申请号：EP09160745.7

申请日：2009-05-20

Applicant: Xerox Corporation

Inventor： Chretien, Michelle ,  Wu, Yiliang ,  Chopra, Naveen

IPC: B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  B01J13/02 ,  H05K1/09

CPC classification number: B22F1/0018 ,  B01J13/02 ,  B22F1/025 ,  B22F9/24 ,  B82Y30/00 ,  H05K1/097 ,  H05K2201/0218 ,  Y10S977/777

Abstract: A method of forming bimetallic core-shell metal nanoparticles including a core of a first metal material and a shell of a second metal material, the method including photochemically producing metallic nanoparticle cores of the first metal material, and forming a shell of the second metal material around the cores. The shell can be formed by adding shell-forming precursor materials to a solution or suspension of the cores and photochemically forming the shells around the cores, or by separately photochemically producing metallic nanoparticles of the second metal material and mixing the metallic nanoparticles of the second metal material and the metallic nanoparticle cores to cause the metallic nanoparticles of the second metal material to form a shell around the metallic nanoparticle cores.

Abstract translation: 一种形成双金属核 - 壳金属纳米颗粒的方法，包括第一金属材料的芯和第二金属材料的壳，所述方法包括光化学制备第一金属材料的金属纳米颗粒芯，并形成第二金属材料的壳 围绕核心。 可以通过将壳形成前体材料添加到芯的溶液或悬浮液中并在芯周围光化学形成壳体，或者通过单独光化学制备第二金属材料的金属纳米颗粒并混合第二金属的金属纳米颗粒来形成壳 材料和金属纳米颗粒芯，以使第二金属材料的金属纳米颗粒在金属纳米颗粒芯周围形成壳。

公开(公告)号：EP1387367A1

公开(公告)日：2004-02-04

申请号：EP02710342.3

申请日：2002-01-24

Applicant: JSR Corporation

Inventor： ITO, Nobuyuki, c/o JSR CORPORATION ,  MASUKO, Hideaki, c/o JSR CORPORATION ,  HASEGAWA, Satomi, c/o JSR CORPORATION ,  YOSHIMURA, Nakaatsu, c/o JSR CORPORATION

IPC: H01B3/00 ,  H01B3/12 ,  C08K3/22 ,  C08K9/00 ,  H05K1/03 ,  H01G4/20

CPC classification number: H01L24/49 ,  C08K9/02 ,  H01L23/145 ,  H01L23/49527 ,  H01L23/49589 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01038 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/0239 ,  H05K2201/0257 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/135 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The dielectric-forming composition according to the invention is characterized by consisting of:

composite particles for dielectrics in which part or all of the surfaces of inorganic particles with permittivity of 30 or greater are coated with a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material; and
(B) a resin component constituted of at least one of a polymerizable compound and a polymer.

In addition, another dielectric-forming composition according to the invention is characterized by containing:

ultrafine particle-resin composite particles composed of (J) inorganic ultrafine particles with the average particle size of 0.1 µm or smaller, and (B) a resin component constituted of at least one of a polymerizable compound and a polymer, wherein part or all of the surfaces of the inorganic ultrafine particles (J) are coated with the resin component (B), and the ultrafine particle-resin composite particles contain 20% by weight or more of the inorganic ultrafine particles (J); and
inorganic particles with the average particle size of 0.1 to 2 µm and permittivity of 30 or greater, or inorganic composite particles in which a conductive metal or a compound thereof, or a conductive organic compound or a conductive inorganic material is deposited on the part or all of the surfaces of the inorganic particles.