公开(公告)号：EP0228212A3

公开(公告)日：1989-09-27

申请号：EP86309619.4

申请日：1986-12-10

Applicant: HITACHI, LTD.

Inventor： Funamoto, Takao ,  Katou, Mituo ,  Kajiwara, Ryoichi ,  Matsuzaka, Takeshi ,  Shida, Tomohiko ,  Takahashi, Kazuya ,  Wachi, Hiroshi ,  Watanabe, Masatoshi ,  Yamada, Minoru ,  Sugawara, Katuo ,  Nakanishi, Keiichirou

IPC: H05K7/20 ,  H01L23/46 ,  H01L23/52 ,  H01L23/42

CPC classification number: H05K1/0373 ,  H01L23/473 ,  H01L23/5383 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/064 ,  H01L2924/00

Abstract: An integrated circuit device has a wiring substrate (2) on one surface of which integrated circuit chips (l) are mounted. A power source substrate (5) of a laminated structure is in contact with the opposite surface of the wiring substrate (2), the power source substrate being of alternate laminations of conductor layers (7) of a heat conductive metal and insulating layers (6) of an elec­trically insulating material, which layers are bonded together. Means such as pins (4) electrically connect the wiring substrate and the power source substrate to each other, and hence connect the chips (l) to the conductive layers (7), a heat radiating means is provided in at least one of either or both of the conductor layers (7) and the insulating layers (6) and radiates heat, which occurs in the power source substrate (5), to the exterior of the device. Such an integrated circuit device has a power source substrate (5) of a remarkably high heat radiating effici­ency, and may permit a high density of integrated circuit chips (l) on the wiring substrate (2).

公开(公告)号：EP2042655B1

公开(公告)日：2017-09-13

申请号：EP07790761.6

申请日：2007-07-13

Applicant: MITSUBISHI CHEMICAL CORPORATION

Inventor： YANO, Hiroyuki ,  NOGI, Masaya ,  IFUKU, Shinsuke ,  ABE, Kentarou ,  HANDA, Keishin

IPC: D21H11/08 ,  C08J5/04

CPC classification number: H05K1/0366 ,  D21H11/08 ,  H05K2201/0251 ,  H05K2201/0284 ,  Y10T442/2869

公开(公告)号：EP1963455A1

公开(公告)日：2008-09-03

申请号：EP06820829.7

申请日：2006-08-10

Applicant: Electrovac AG

Inventor： TANG, Xinhe ,  TSE, Ka, Chun ,  HAMMEL, Ernst ,  TANG, Ben, Zhong

IPC: C09J163/00 ,  B32B7/12 ,  B32B27/20

CPC classification number: C09J163/00 ,  B32B7/12 ,  B32B9/005 ,  B32B9/041 ,  B32B15/20 ,  B32B27/20 ,  B32B27/36 ,  B32B27/38 ,  B32B2250/40 ,  B32B2255/26 ,  B32B2262/02 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2307/208 ,  B32B2307/302 ,  B82Y10/00 ,  B82Y30/00 ,  C08K7/02 ,  C08K2201/011 ,  C09J11/00 ,  H01L23/373 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/386 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/24 ,  Y10T428/24058 ,  Y10T428/24132 ,  Y10T428/249942 ,  Y10T428/31515 ,  H01L2924/00

Abstract: Disclosed is a multilayer material in which at least two components are joined to each other via an adhesive bond. Said adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive.

公开(公告)号：EP1950236A1

公开(公告)日：2008-07-30

申请号：EP06832729.5

申请日：2006-11-16

Applicant: Rimtec Corporation

Inventor： TAKIMOTO, Tomohiko ,  MIURA, Takahiro

IPC: C08G61/00 ,  B29C45/00 ,  B29C45/14 ,  C08K3/26 ,  C08K7/10 ,  C08L65/00 ,  B29K45/00 ,  B29K105/12

CPC classification number: C08L65/00 ,  B29C67/246 ,  B29K2023/083 ,  B29K2023/38 ,  B29K2105/16 ,  C08F287/00 ,  C08K3/26 ,  C08K7/10 ,  C08K2201/016 ,  C08L51/006 ,  C08L53/02 ,  H05K1/0373 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0251 ,  Y10T428/31692 ,  C08L2666/02 ,  C08L2666/04

Abstract: A norbornene-based resin molded article obtained by bulk polymerizing a norbornene-based monomer in a mold; wherein said norbornene-based resin molded article is characterized by comprising a hybrid filler obtained by high-speed mixing the two or more kinds of fillers in dry method. Preferably, said hybrid filler is obtained by high-speed mixing, at least a fibrous filler having 5 to 100 aspect ratio and a particulate filler having 1 to 2 aspect ratio, in dry method. The present invention provides the norbornene-based resin molded article superior in rigidity and dimensional stability; and the method of production thereof.

Abstract translation: 通过将降冰片烯系单体在模具中本体聚合而得到的降冰片烯系树脂成型体， 其中所述降冰片烯系树脂成型体的特征在于，含有通过干式高速混合所述两种或更多种填料得到的混合填料。 优选地，所述混合填料通过高速混合，至少具有5至100纵横比的纤维填料和具有1至2纵横比的颗粒填料以干法获得。 本发明提供刚性和尺寸稳定性优异的降冰片烯系树脂成型体， 及其生产方法。

公开(公告)号：EP1867464A1

公开(公告)日：2007-12-19

申请号：EP07252356.6

申请日：2007-06-11

Applicant: NITTO DENKO CORPORATION

Inventor： Nakatsuka, Yasuo, Nitto Denko Corporation ,  Kiyohara, Susumu, Nitto Denko Corporation ,  Tan, Michio, Nitto Denko Corporation ,  Ikeda, Kenichi, Nitto Denko Corporation ,  Tanaka, Katsufumi c/o Nat. Univ. Corp. Kyoto Inst. of Techn. ,  Akiyama, Ryuichi c/o Nat. Univ. Corp. Kyoto Inst. of Techn.

IPC: B29C70/62 ,  B29C70/88 ,  B29K703/06 ,  B29K301/00

CPC classification number: B29C70/62 ,  B29C70/882 ,  B29K2105/18 ,  B29K2705/00 ,  B29K2709/02 ,  B29K2995/0006 ,  B29K2995/0013 ,  B29L2031/3061 ,  H01G4/206 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2203/105 ,  Y10T428/249994

Abstract: The present invention provides a composite material sheet wherein a filler is oriented in a given direction in an organic resin matrix by an electric field. The composite material sheet of the present invention (10) contains filler (1) and organic resin (3), and is characterized in that the filler (1) is aggregated in the organic resin matrix and oriented in the thickness direction. As a result, properties such as dielectric property, conductivity, thermal conductivity and the like can be strikingly improved as compared to conventional composite materials obtained by simply dispersing a filler.

Abstract translation: 本发明提供一种复合材料片，其中填料通过电场在有机树脂基体中沿给定方向取向。 本发明的复合材料片（10）含有填料（1）和有机树脂（3），其特征在于，所述填料（1）在所述有机树脂基体中聚集并在厚度方向取向。 结果，与通过简单地分散填料得到的常规复合材料相比，能够显着提高介电性，导电性，导热性等性能。

公开(公告)号：EP1225248B1

公开(公告)日：2005-02-02

申请号：EP01250396.7

申请日：2001-11-09

Applicant: Matsushita Electric Works, Ltd.

Inventor： Ikegawa, Naoto ,  Sato, Masahiro ,  Kondo, Naoyuki

IPC: C23C14/02 ,  C23C14/20 ,  H01L21/56

CPC classification number: H05K1/0373 ,  C08L51/06 ,  C08L55/02 ,  C23C14/022 ,  C23C14/20 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K2203/095 ,  Y10S428/901 ,  Y10T428/249951 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/252 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31533 ,  Y10T428/31681 ,  Y10T428/31699 ,  C08L2666/14 ,  C08L2666/02 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP1225248A1

公开(公告)日：2002-07-24

申请号：EP01250396.7

申请日：2001-11-09

Applicant: Matsushita Electric Works, Ltd.

Inventor： Ikegawa, Naoto ,  Sato, Masahiro ,  Kondo, Naoyuki

IPC: C23C14/02 ,  C23C14/20 ,  H01L21/56

CPC classification number: H05K1/0373 ,  C08L51/06 ,  C08L55/02 ,  C23C14/022 ,  C23C14/20 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K2203/095 ,  Y10S428/901 ,  Y10T428/249951 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/252 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31533 ,  Y10T428/31681 ,  Y10T428/31699 ,  C08L2666/14 ,  C08L2666/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Moulded resin components (A) for application in electronics comprising a combination of a thermoplast or a thermosetting resin as the base constituent and a rubber-like elastic material and further comprising a plasma activated surface (2) onto which a metal layer (1) was applied by a physical deposition method chosen from among sputtering, vacuum deposition and ion plating.

Abstract translation: 用于应用在电子学中的模制树脂组分（A）包括热塑性塑料或热固性树脂作为基础组分的组合和橡胶状弹性材料，并且还包括等离子体活化表面（2），金属层（1） 通过从溅射，真空沉积和离子电镀中选择的物理沉积方法施加。

公开(公告)号：EP1222843A1

公开(公告)日：2002-07-17

申请号：EP00960727.6

申请日：2000-09-20

Applicant: Ahlstrom Glassfibre OY

Inventor： KOMLENIC, Rod,C/o Ahlstrom Filtration, Inc. ,  RENNELS, Kelly,C/o Ahlstrom Filtration, Inc. ,  RÖKMAN, Kay ,  SABEL, Hakan

IPC: H05K1/03

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50 % by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80 % straight polyacrylonitrile fibers and 40-20 % fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40 % of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

公开(公告)号：EP1197129A2

公开(公告)日：2002-04-17

申请号：EP01925139.6

申请日：2001-03-21

Applicant: WORLD PROPERTIES, INC.

Inventor： LANDI, Vincent R.

IPC: H05K1/03 ,  B32B15/08

CPC classification number: C08J5/24 ,  B32B15/08 ,  C08J2309/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  C08L23/16 ,  C08L53/00 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/2934 ,  Y10T442/2992 ,  Y10T442/3415 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3455 ,  C08L2666/06 ,  C08L2666/24

Abstract: An electrical substrate material is presented comprising a resin matrix which includes a thermosetting polybutadiene or polysoprene resin, and ethylene propylene rubber, and optionally a thermoplastic unsaturated butadiene- or isoprene-containing polymer; a particulate filler, a flame retardant addititive, a curing agent, and a woven or unwoven fabric. The presence of the ethylene propylene rubber enhances the heat age properties of the substrate material, particularly the dielectric strengh and the mechanical properties, while other electrical, chemical, and mechanical properties of the material are not adversely effected.

公开(公告)号：EP1019246A1

公开(公告)日：2000-07-19

申请号：EP98949433.1

申请日：1998-09-23

Applicant: Fibermark, Inc.

Inventor： KEMPF, Ulrich

IPC: B32B5/00 ,  B32B5/08

CPC classification number: D21H21/54 ,  B32B27/04 ,  C08J5/24 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H25/06 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/27 ,  Y10T428/2933 ,  Y10T428/2962 ,  Y10T428/31663

Abstract: A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.