公开(公告)号：EP0915125B1

公开(公告)日：2004-07-14

申请号：EP98120989.3

申请日：1998-11-05

申请人： OJI PAPER CO., LTD.

发明人： Kato, Yoshihisa ,  Adachi, Takekazu ,  Murata, Mamoru

IPC分类号： C08J5/24 ,  C08J5/04 ,  B32B27/02 ,  D21H13/22 ,  D21H13/26

CPC分类号： B32B5/26 ,  B32B5/022 ,  B32B5/28 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2457/08 ,  C08J5/048 ,  C08J5/24 ,  C08J2361/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10T428/12569 ,  Y10T428/31594 ,  Y10T428/31725

公开(公告)号：EP1410906A1

公开(公告)日：2004-04-21

申请号：EP03022833.2

申请日：2003-10-08

申请人： Arlon

发明人： Guiles, Chester Light ,  Najjar, Ousama ,  Allen, Scott Timon ,  Bieschke, William J.

IPC分类号： B32B31/08 ,  B32B5/18 ,  B32B15/08 ,  H05K1/03 ,  H05K3/06 ,  H05K3/46 ,  H01Q21/06

CPC分类号： B32B17/10844 ,  B32B5/18 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B27/285 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/40 ,  B32B37/144 ,  B32B37/20 ,  B32B2250/40 ,  B32B2305/022 ,  B32B2307/202 ,  B32B2311/12 ,  H01Q1/38 ,  H01Q21/065 ,  H05K1/024 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0116 ,  H05K2201/0278 ,  H05K2201/0355 ,  Y10T428/24917 ,  Y10T428/31681

摘要： In accordance with the present invention, there are provided novel assemblies which are useful for a variety of applications. Invention assemblies have low dielectric constant, making them suitable for use in a variety of electronic applications. In addition, invention assemblies are resistant to attack by acidic aqueous media, basic aqueous media and/or organic media, making it possible to subject such assemblies to a variety of processing conditions, such as, for example, chemical etching to introduce circuitry thereto.

摘要翻译： 根据本发明，提供了可用于各种应用的新型组件。 本发明组件具有低介电常数，使其适用于各种电子应用。 此外，本发明组件耐受酸性水性介质，碱性水性介质和/或有机介质的侵蚀，使得可以使这种组件进行各种加工条件，例如化学蚀刻以将电路引入其中。

公开(公告)号：EP1392495A1

公开(公告)日：2004-03-03

申请号：EP02734652.7

申请日：2002-06-04

申请人： Polymer Group, Inc.

发明人： ZUCKER, Jerry ,  CARTER, Nick, Mark

IPC分类号： B29C70/36 ,  B32B3/24

CPC分类号： H05K1/0366 ,  B29C70/12 ,  B29C70/16 ,  B29C70/50 ,  B29L2031/3425 ,  D04H1/48 ,  D04H1/49 ,  D04H1/495 ,  D04H3/11 ,  D04H5/02 ,  D04H5/03 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/107 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/09045 ,  H05K2201/09127 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/065 ,  Y10T442/259 ,  Y10T442/689

摘要： The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (printed Circuit Board) and similar application. The nonwoven substrate is formed from a precursor web (P) which undergoes entangling treatment by entangling manifolds (16, 20, 24'). By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.

公开(公告)号：EP1345241A1

公开(公告)日：2003-09-17

申请号：EP01997819.6

申请日：2001-11-26

申请人： Daikin Industries, Ltd.

发明人： YAMAMOTO, Katsutoshi, c/o Yodogawa Works of DAIKIN ,  YAMAMOTO, Seigo, c/o Yodogawa Works of DAIKIN IND. ,  CHAEN, Shinichi, c/o Yodogawa Works of DAIKIN IND. ,  ASANO, Jun, c/o Yodogawa Works of DAIKIN IND. LTD. ,  KONISHI, Tomohisa, c/o Yodogawa Works of

IPC分类号： H01B17/60 ,  B32B5/28 ,  H01L23/14

CPC分类号： H05K1/0366 ,  B32B5/28 ,  B32B27/28 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2203/065 ,  H05K2203/1105

摘要： This electrical insulating board 1 comprises a cloth substrate 3 and web layers 5. The web layers 5 made of fluororesin fibers and are stacked on both sides of the cloth substrate 3 and bonded there by entangling. In addition, to at least one side surface of web layers 5, heat treatment at a temperature of melting point of fluororesin fiber or more is applied under pressure.

摘要翻译： 该电绝缘板1包括布基材3和纤维网层5.网状层5由氟树脂纤维制成，并且堆叠在布基材3的两侧，并通过缠结结合在那里。 此外，对于纤维网层5的至少一个侧表面，在压力下施加氟树脂纤维的熔点以上的温度下的热处理。

公开(公告)号：EP1316420A1

公开(公告)日：2003-06-04

申请号：EP02258062.5

申请日：2002-11-22

申请人： Saint-Gobain Technical Fabrics

发明人： Porter, John Frederick

IPC分类号： B32B27/12

CPC分类号： B32B27/12 ,  B29C65/02 ,  B29C66/71 ,  B29C66/721 ,  B29C66/7212 ,  B29C66/72141 ,  B29C66/72143 ,  B29C66/723 ,  B29C66/72321 ,  B29C66/72327 ,  B29C66/72328 ,  B29C66/7392 ,  B29C66/7394 ,  B29C70/083 ,  B32B5/28 ,  B32B27/04 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0278 ,  Y10S428/911 ,  Y10T428/249923 ,  Y10T442/2361 ,  Y10T442/2615 ,  Y10T442/2623 ,  Y10T442/2738 ,  Y10T442/2754 ,  Y10T442/2861 ,  Y10T442/2893 ,  Y10T442/2902 ,  Y10T442/291 ,  Y10T442/2926 ,  Y10T442/2992 ,  Y10T442/604 ,  Y10T442/607 ,  Y10T442/659 ,  Y10T442/69 ,  Y10T442/697 ,  B29K2307/04 ,  B29K2077/00 ,  B29K2309/08 ,  B29K2277/10 ,  B29K2023/04 ,  B29K2027/06 ,  B29K2071/00 ,  B29K2079/085 ,  B29K2081/06 ,  B29K2067/00 ,  B29K2081/04 ,  B29K2063/00 ,  B29K2055/02 ,  B29K2301/00 ,  B29K2077/10 ,  B29K2071/12 ,  B29K2067/06 ,  B29K2025/08 ,  B29K2025/06 ,  B29K2023/12 ,  B29K2023/06

摘要： This invention provides multi-layered composites, laminates (100) and composite joints (200) in which at least one resin-impregnated, fiber-containing layer (10,30) is joined or laminated to a core layer (20) having a lower flexural modulus or higher elongation at break, higher toughness, or a combination of all or some of these properties. The multi-layer composite produced by laminating or joining these materials together has improved shearout, impact and cutting resistance, since stresses caused by outside forces can be more widely distributed throughout the composite.

摘要翻译： 本发明提供了多层复合材料，层压材料（100）和复合接头（200），其中至少一种浸渍树脂的含纤维层（10,30）被连接或层压到具有较低层的芯层（20） 弯曲模量或更高的断裂伸长率，更高的韧性或这些性能的全部或一些的组合。 通过将这些材料层压或接合在一起形成的多层复合材料具有改善的剪切力，冲击和切割阻力，因为由外力引起的应力可以更广泛地分布在整个复合材料中。

公开(公告)号：EP1310593A1

公开(公告)日：2003-05-14

申请号：EP00950005.9

申请日：2000-08-04

申请人： TEIJIN LIMITED

发明人： MURAYAMA, Sadamitsu, Teijin Ltd, Osaka Res. Ctr. ,  MATSUI, Michikage, Teijin Ltd, Osaka Research Ctr. ,  WADA, Masanori, Teijin Ltd, Osaka Research Center ,  ISHIHARA, Shigeru, Teijin Ltd, Matsuyama Factory

IPC分类号： D21H13/26 ,  D04H1/42 ,  H05K1/03

CPC分类号： D04H1/4334 ,  D04H1/4342 ,  D04H1/549 ,  D04H1/64 ,  D21H13/24 ,  D21H13/26 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249921 ,  Y10T428/249924 ,  Y10T428/2904 ,  Y10T428/2969 ,  Y10T442/609 ,  Y10T442/61 ,  Y10T442/611 ,  Y10T442/69

摘要： A heat-resistant fiber paper sheet which is formed from staple fibers made from a heat-resistant organic polymer, undrawn or low ratio drawn para-aromatic polyamide staple fibers, and an organic resin binder and/or fibrids comprising a heat-resistant organic polymer as main components, wherein the amount of said staple fibers is 45 to 97 percent by weight based on the total amount of said heat-resistant fiber paper sheet; the total amount of said organic resin binder and/or said fibrids is 3 to 55 percent by weight based on the total amount of said heat-resistant fiber paper sheet; and said organic resin binder is cured, and/or said undrawn or low ratio drawn para-aromatic polyamide staple fibers and said fibrids are partially sòftened, deformed and/or melted to exhibit the actions of binders. The obtained heat-resistant fiber paper sheet has excellent heat resistance, excellent heat dimensional stability, excellent plybond strength, an excellent electric insulating property in a high humidity, and the like, has good resin impregnability in spite of having a high bulk density, and is especially suitable for use as a substrate for electric insulating materials or as a substrate for laminates used for electric circuits.

摘要翻译： 由耐热有机聚合物，未拉伸或低比例拉伸的对位芳族聚酰胺短纤维制成的短纤维形成的耐热纤维纸片和包含耐热有机聚合物的有机树脂粘合剂和/或纤条体 作为主要成分，其中所述短纤维的量相对于所述耐热性纤维纸的总量为45〜97重量％ 所述有机树脂粘合剂和/或所述纤条体的总量相对于所述耐热纤维纸的总量为3〜55重量％ 并且所述有机树脂粘合剂固化，和/或所述未拉伸或低比例拉伸的对位芳族聚酰胺短纤维和所述纤条体部分地发生变形和/或熔融以显示粘合剂的作用。 得到的耐热纤维纸片具有优异的耐热性，优异的热尺寸稳定性，优异的聚苯乙烯强度，高湿度下的优异的电绝缘性等，尽管具有高的堆积密度，但具有良好的树脂浸渍性，以及 特别适合用作电绝缘材料的基材或用作电路用层压体的基材。

公开(公告)号：EP1208267A1

公开(公告)日：2002-05-29

申请号：EP00944985.1

申请日：2000-06-29

申请人： E. I. du Pont de Nemours and Company

发明人： SUZUKI, Hiroyuki ,  HESSLER, Lee, James ,  WHITFIELD, Christopher, Roger

IPC分类号： D21H13/26

CPC分类号： H05K1/0366 ,  D21H13/26 ,  H05K2201/0278 ,  H05K2201/0293

摘要： A type of fiber paper is provided that is made of completely aromatic polyamide fiber formed by means of liquid crystal spinning. The fiber paper can be used as the base material of a substrate for electric circuit, and it can display high reliability in electric insulation under a high humidity, excellent post-heating dimensional stability, and high heat resistance.

公开(公告)号：EP0763562B1

公开(公告)日：2000-11-22

申请号：EP96306669.1

申请日：1996-09-13

申请人： Hitachi Chemical Co., Ltd.

发明人： Okano, Norio ,  Kobayashi, Kazuhito ,  Nakaso, Akishi

IPC分类号： C08K7/02 ,  C08J5/04 ,  C08J5/24 ,  H05K1/03

CPC分类号： C08K7/02 ,  C08J5/24 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/0278 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/249995 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/269 ,  Y10T428/2949 ,  Y10T428/31529

公开(公告)号：EP1023820A1

公开(公告)日：2000-08-02

申请号：EP99941133.3

申请日：1999-08-12

申请人： WORLD PROPERTIES, INC.

发明人： LANDI, Vincent, R.

IPC分类号： H05K1/03 ,  C08L9/00

CPC分类号： C08L9/00 ,  C08K3/34 ,  C08K3/40 ,  C08K7/28 ,  C08L9/06 ,  C08L23/16 ,  C08L53/00 ,  H05K1/0203 ,  H05K1/032 ,  H05K1/0373 ,  H05K1/162 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0278 ,  Y10T442/2934 ,  Y10T442/2992 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3455 ,  C08L2666/04 ,  C08L2666/06 ,  C08L2666/08 ,  C08L2666/24

摘要： An electrical substrate material is presented comprising a thermosetting matrix which includes a polybutadiene or polyisoprene resin, an unsaturated butadiene- or isoprene-containing polymer and an ethylene propylene rubber; a particulate filler and, a fabric. Preferred ethylene propylene rubbers are ethylene propylene copolymers and ethylene propylene diene terpolymers rubbers wherein the diene is dicyclopentadiene. The ethylene propylene rubber is present in an amount of up to about 20 wt.% with respect to the resin, preferably in an amount of about 1 to about 7 wt.%, more preferably about 5 wt.%. The presence of the ethylene propylene rubber enhances the dielectric strength of the resulting electrical substrate material, while other electrical, chemical, and mechanical properties of the material are not adversely effected.

公开(公告)号：EP0908559A3

公开(公告)日：2000-03-29

申请号：EP98118922.8

申请日：1998-10-07

申请人： MITSUBISHI GAS CHEMICAL COMPANY, INC. ,  Kuraray Co., Ltd.

发明人： Gaku, Morio c/o Mitsubishi Gas Chemical Co., Inc. ,  Nozaki, Mitsuru c/o Mitsubishi Gas Chem. Co., Inc. ,  Saimen, Kenji c/o Kuraray Co., Ltd. ,  Esaki, Tamemaru c/o Kuraray Co., Ltd.

IPC分类号： D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/00

CPC分类号： D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24322 ,  Y10T442/2475

摘要： There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement comprises a wet-system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290°C or higher( component A ) and a thermotropic cystalline polyester binder which has a melting point of 290°C or higher and is in the form of a film having holes including at least 5 holes /mm 2 each with an area of opening of 400 to 10000 µm 2 ( component B ), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring ( base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.