公开(公告)号：EP1285462B1

公开(公告)日：2015-07-01

申请号：EP01943054.5

申请日：2001-05-10

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BRUNNER, Herbert ,  HÖFER, Thomas ,  JÄGER, Harald

IPC: H01L23/057 ,  H01L23/13 ,  H01L23/498 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/181 ,  H05K1/0271 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

公开(公告)号：EP1296453B1

公开(公告)日：2008-11-12

申请号：EP02021467.2

申请日：2002-09-25

Applicant: TDK Corporation

Inventor： Nakano, Masahiro, c/oTDK Corporation

IPC: H03H9/05

CPC classification number: H03H9/059 ,  H01L2224/16225 ,  H01L2924/15311 ,  H03H9/1071 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  Y02P70/613

公开(公告)号：EP1734801A1

公开(公告)日：2006-12-20

申请号：EP05793130.5

申请日：2005-10-12

Applicant: Matsushita Electric Industries Co., Ltd.

Inventor： WADA, Yoshiyuki, Matsushita Electic Ind. Co. ,  SAKAI, Tadahiko, Matsushita Electic Ind. Co.

IPC: H05K3/34 ,  H05K1/18 ,  H01L23/12 ,  B23K35/363

CPC classification number: H05K3/3484 ,  B23K35/362 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613

Abstract: A method of packaging an electronic component, which is capable of enhancing electrical and mechanical bonding reliability of the electronic component. Terminal (4) is provided on the side face of electronic component (1). Electrode (6) is formed on one or the other major surface of substrate (5) and terminal (4) provided in electronic component (1) is located on electrode (6). Solder paste produced by mixing solder particles with thermosetting flux is applied to electrode (6), terminal (4) of electronic component (1) is mounted on and brought into contact with the applied solder paste, and electronic component (1) is mounted on substrate (5) with clearance (S) provided between a part of electronic component (1) and opposing substrate (5). Solder bonding structure (8) for coupling terminal (4) and electrode (6) is formed by reflow. Solder bonding structure (8) includes solder bonding portion (8a), resin reinforcing portion (8b) and resin adhering portion (8c). Resin reinforcing portion (8b) reinforces solder bonding portion (8a), and resin adhering portion (8c) fixes electronic component (1) to substrate (5) when the resin entering clearance (S) between electronic component (1) and substrate (5) is solidified.

Abstract translation: 一种电子部件的包装方法，其能够提高电子部件的电气和机械结合的可靠性。 端子（4）设置在电子部件（1）的侧面。 电极（6）形成在基板（5）的一个或另一个主表面上，并且设置在电子部件（1）中的端子（4）位于电极（6）上。 将焊料颗粒与热固性焊剂混合制成的焊膏施加到电极（6）上，将电子部件（1）的端子（4）安装在焊膏上并与焊膏接触，将电子部件（1）安装在 具有设置在电子部件（1）的一部分和相对基板（5）之间的间隙（S）的基板（5）。 通过回流形成用于耦合端子（4）和电极（6）的焊接结构（8）。 焊接接合结构（8）包括焊料接合部（8a），树脂增强部（8b）和树脂附着部（8c）。 当电子部件（1）和基板（5）之间的树脂进入间隙（S）时，树脂增强部分（8b）加强焊接接合部分（8a），树脂粘合部分（8c）将电子部件（1）固定到基板（5） ）固化。

公开(公告)号：EP1484950B1

公开(公告)日：2006-10-11

申请号：EP04008025.1

申请日：2004-04-01

Applicant: Novar GmbH

Inventor： Gernhardt, Angelika ,  Goulet, Thomas ,  Menzel, Carsten ,  Ollik, Waldemar

IPC: H05K3/40 ,  H05K3/34

CPC classification number: H05K3/403 ,  H05K1/0284 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/42 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09481 ,  H05K2201/10666 ,  H05K2203/0455 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T29/49789

公开(公告)号：EP1416778A3

公开(公告)日：2006-10-11

申请号：EP03256881.8

申请日：2003-10-30

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Yatsu, Hiroyuki

IPC: H05K1/14 ,  H05K3/34

CPC classification number: H05K1/184 ,  H05K1/141 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/10477 ,  H05K2201/10727 ,  Y02P70/613

Abstract: An electronic unit includes a module (1) in which a semiconductor device (3) is attached on the bottom of a circuit board (2) and which has lands (4) provided on the bottom of the circuit board, and a printed circuit board (5) on which the module is mounted, the printed circuit board having a hole (5a) in a position facing the semiconductor device and having electrical conductors (6) to which the lands are soldered. The module is mounted on the printed circuit board by soldering the lands to the electrical conductors while the semiconductor device is disposed in the hole. Accordingly, the electronic unit is smaller in height than conventional electronic units. Such a structure allows the module to be surface-mounted on the printed circuit board with solder paste, and thus high productivity of the electronic unit can be achieved.

公开(公告)号：EP0888038B1

公开(公告)日：2006-05-31

申请号：EP98111618.9

申请日：1998-06-24

Applicant: TDK Corporation

Inventor： Gotoh, Masashi ,  Kanazawa, Jitsuo ,  Yamamoto, Syuichiro ,  Honda, Kenji

IPC: H05K3/40

CPC classification number: H05K3/403 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/42 ,  H05K2201/09181 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/49792

公开(公告)号：EP1604553A1

公开(公告)日：2005-12-14

申请号：EP04711540.7

申请日：2004-02-17

Applicant: O'Brien, Brenton

Inventor： O'Brien, Brenton

IPC: H05K1/11

CPC classification number: H05K3/368 ,  H01R12/523 ,  H01R12/7082 ,  H01R12/721 ,  H05K1/142 ,  H05K3/325 ,  H05K2201/09181 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: A printed circuit board joining assembly adapted to join two printed circuit boards (1) together with an edge to edge alignment, said joining assembly having a clamping means (11, 13) holding at least one electrical conductor (3) so as to electrically connect an electrical conductor of a first of the boards with an electrical conductor of a second of the boards. A plurality of printed circuit boards with different functions may be joined in such a manner as to provide a complex electrical or electronic function.

公开(公告)号：EP0811993B1

公开(公告)日：2003-09-17

申请号：EP97202527.4

申请日：1993-07-08

Applicant: Tyco Electronics Corporation

Inventor： Graves, Gregory A. ,  Zhang, Michael ,  Chandler, Daniel ,  Chang, Chi-Ming ,  Fang, Shou-Mean

IPC: H01C1/14 ,  H05K1/18

CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613

公开(公告)号：EP1293009A1

公开(公告)日：2003-03-19

申请号：EP01946211.8

申请日：2001-06-08

Applicant: Synergy Microwave Corproation

Inventor： SRIDHARAN, Madadevan ,  MUNIKOTI, Vasanth

IPC: H01P3/08

CPC classification number: H01P3/085 ,  H01P3/081 ,  H01P11/003 ,  H05K1/0237 ,  H05K3/403 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/0379 ,  H05K2201/0715 ,  H05K2201/09181 ,  H05K2201/09318 ,  H05K2201/096 ,  H05K2201/09718

Abstract: A multi-layer circuit board including top (40), middle (24), and bottom (18) dielectric layers, a conductive pattern (44) disposed on the top surface (42) and a ground layer (46) disposed on the bottom surface of the top dielectric layer (40), a conductive pattern (28) disposed on the bottom surface (22) of the middle dielectric layer (24), and a ground layer (30) disposed on the bottom surface (16) of the bottom dielectric layer (18).

公开(公告)号：EP0996317B1

公开(公告)日：2002-12-11

申请号：EP99308017.5

申请日：1999-10-12

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Harada, Hiroshi ,  Terashima, Kiminori

IPC: H05K1/11

CPC classification number: H05K3/3452 ,  H05K1/111 ,  H05K1/141 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/099 ,  Y02P70/611 ,  Y02P70/613