公开(公告)号：EP3364455A1

公开(公告)日：2018-08-22

申请号：EP17156474.3

申请日：2017-02-16

Applicant: Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO

Inventor： VAN HECK, Gerardus ,  BARINK, Marco ,  DE KOK, Margaretha Maria

IPC: H01L23/498 ,  H05K1/02

CPC classification number: H01L23/4985 ,  H01L23/49838 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/09272 ,  H05K2201/10106

Abstract: The present disclosure concerns a flexible electronic circuit (100) and method of manufacturing. A flexible substrate (30) with conductive tracks is provided with a rigid electronic component (10). The component (10) comprises electrical contacts (11,12) on either sides. The conductive tracks connect to the contacts via an arced section that originates from respective sides of the contacts but swirls partially around the component to approaches the component along a centerline (CL) separating the contacts (11,12).

公开(公告)号：EP3347633A1

公开(公告)日：2018-07-18

申请号：EP16759741.8

申请日：2016-08-30

Applicant: Valeo Systèmes De Contrôle Moteur

Inventor： DIXNEUF, Olivier

IPC: F16K31/04 ,  H02K11/02 ,  H05K1/16

CPC classification number: F16K31/042 ,  F16K1/221 ,  H02K11/02 ,  H05K1/0216 ,  H05K1/165 ,  H05K3/46 ,  H05K2201/086 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09672

Abstract: The invention relates to an actuator, in particular intended for being integrated in a valve (10) for a motor vehicle engine, including: an electric motor (18) suitable for moving an element, in particular a member (16) for fluid control of the valve; a filtering component arranged so as to reduce the parasitic electromagnetic emissions generated by the electric motor; and a printed circuit board (26) supporting the filtering component, the filtering component including an inductor suitable for reducing the parasitic electromagnetic emissions generated by the electric motor.

公开(公告)号：EP2775807A4

公开(公告)日：2015-08-05

申请号：EP12846388

申请日：2012-10-30

Applicant: FUJIFILM CORP

Inventor： TATSUTA TAKEICHI

IPC: H05K3/12 ,  H05K3/10

CPC classification number: H05K1/0296 ,  H05K1/0287 ,  H05K3/105 ,  H05K3/1208 ,  H05K3/1241 ,  H05K3/125 ,  H05K3/18 ,  H05K2201/09272 ,  H05K2203/1157

公开(公告)号：EP2775807A1

公开(公告)日：2014-09-10

申请号：EP12846388.2

申请日：2012-10-30

Applicant: Fujifilm Corporation

Inventor： TATSUTA Takeichi

IPC: H05K3/12 ,  H05K3/10

CPC classification number: H05K1/0296 ,  H05K1/0287 ,  H05K3/105 ,  H05K3/1208 ,  H05K3/1241 ,  H05K3/125 ,  H05K3/18 ,  H05K2201/09272 ,  H05K2203/1157

Abstract: The present invention pertains to: a base material (10) for forming an electroconductive pattern, adapted to form an electroconductive pattern and obtain a circuit board; the circuit board obtained therefrom; and a method for producing each. The base material (10) for forming an electroconductive pattern, adapted to obtain a circuit board, includes a supporter (12), and a holding region (14) for holding a fluid body (40) for obtaining an electroconductive pattern, the holding region being formed atop one end surface of the supporter (12) and exhibiting a proper wettability for the fluid body (40). The holding region (14) has at least a first linear group (18) comprising a plurality of first lines (16) extending in parallel with each other along a first direction, and a second linear group (22) comprising a plurality of second lines (20) extending in parallel with each other along a second direction, and a grid shape is formed by the first linear group (18) and second linear group (22) .

Abstract translation: 本发明涉及到：基材（10），用于在导电图案形成，angepasst以形成导电图案和获得的电路板; 电路板从那里获得; 和用于产生每个的方法。 基体材料（10），用于在导电图案形成，angepasst得到的电路板，包括用于保持流体体（40），用于获得导电图案的，保持区域中的支撑件（12），以及保持区域（14） FORMED是上盖的支撑（12）的一个端表面并显示出用于流体本体（40）的适当的润湿性。 所述保持区域（14）具有至少包括第一线彼此平行地沿第一方向延伸的多个（16）的第一线性组（18），和包括第二线的多个第二线性组（22） （20）在彼此平行地沿着第二方向延伸，和一个网格形状是由第一线性组（18）和第二线性组（22）形成。

公开(公告)号：EP1898478A1

公开(公告)日：2008-03-12

申请号：EP07115110.4

申请日：2007-08-28

Applicant: Ricoh Company, Ltd.

Inventor： Tomono, Hidenori ,  Kawashima, Ikue ,  Suzuki, Koei ,  Akiyama, Yoshikazu

IPC: H01L51/10

CPC classification number: H01L51/0022 ,  H01L51/0004 ,  H01L51/0018 ,  H01L51/0541 ,  H01L51/0545 ,  H05K3/1208 ,  H05K3/1241 ,  H05K2201/09272 ,  H05K2203/1173

Abstract: A wiring pattern is disclosed including: a variable wettability layer including a material whose critical surface tension changes in response to energy provided thereto, the wettability changing layer including a high surface energy part exhibiting a high critical surface tension and a low surface energy part exhibiting low critical surface tension; and a conductive pattern layer formed on the variable wettability layer at the high surface energy part. The conductive pattern layer has an elongated shape with a chamfered corner part in a plan view.

Abstract translation: 布线图案是圆盘游离缺失包括：可变润湿层包括临界表面张力响应于于此，所述润湿性变化层包括高表面能部分表现出高的临界表面张力和低表面能部分显示出低所提供的能量的变化的材料 临界表面张力; 和导电图案层形成在高表面能部分的润湿性变化层上。 导电图案层具有与在平面图中的倒角角部的细长形状。

公开(公告)号：EP1376747A2

公开(公告)日：2004-01-02

申请号：EP03101915.1

申请日：2003-06-26

Applicant: Texas Instruments Incorporated

Inventor： Howard, Gregory ,  Swanson, Leland S.

IPC: H01P3/08

CPC classification number: H01P3/081 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/0245 ,  H05K1/0253 ,  H05K2201/09272 ,  H01L2924/00

Abstract: In high-speed semiconductor packaging, differential pair transmission lines 605 are used to receive incoming signals carried using differential signaling. Common mode noise can decrease the frequency at which these signals are clocked. The use of slots 620 formed in the ground (or power plane) 609 of the substrate and lying perpendicularly (and equally spaced) underneath the differential pair 605 improves the common mode rejection of the differential pair 605 by increasing the common mode impedance without affecting the differential mode impedance. The use of slots 620 does not require modifications to the packaging, and only minor modifications to the substrate.

公开(公告)号：EP1026794B1

公开(公告)日：2003-12-03

申请号：EP00102581.6

申请日：2000-02-07

Applicant: Litton Systems, Inc.

Inventor： Witherspoon, Barry Kent ,  Vaught, Larry Dean

IPC: H01R43/10 ,  H01R39/10 ,  H05K3/40

CPC classification number: H05K3/4007 ,  H01R39/10 ,  H01R43/10 ,  H05K1/11 ,  H05K3/108 ,  H05K2201/09272 ,  H05K2201/09745 ,  H05K2203/0369 ,  Y10T29/49011 ,  Y10T29/49155 ,  Y10T29/49156

公开(公告)号：EP1083779A1

公开(公告)日：2001-03-14

申请号：EP99919584.5

申请日：1999-05-13

Applicant: IBIDEN CO., LTD.

Inventor： HIROSE, Naohiro, Ogaki-kita-kojou, Ibiden K. K. ,  KARIYA, Takashi, Ogaki-kita-kojou, Ibiden K. K. ,  MORI, Yoji, Ogaki-kita-kojou, Ibiden K. K.

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/18

CPC classification number: H01R9/09 ,  H01L23/12 ,  H01L23/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H05K1/0256 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K3/184 ,  H05K3/241 ,  H05K3/382 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09272 ,  H05K2201/09454 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09627 ,  H05K2201/09727 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2203/0594 ,  Y10T29/49155 ,  Y10T29/49194 ,  Y10T428/31504

Abstract: A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.

Abstract translation: 在布线图案58b，58c和58d的交叉部分X中，在构成拐角部分C等于或小于90度的部分上加入一个纸条F，并形成布线图案58。 由于添加了文件F，所以布线图案不会变薄，并且在交叉部分X中不会断开。另外，由于没有集中到交叉部分X的应力，布线图案中不会导致断开，也没有气泡 留在布线图案的交叉部分X和层间树脂绝缘层之间，从而提高了印刷线路板的可靠性。

公开(公告)号：EP0633715A2

公开(公告)日：1995-01-11

申请号：EP94202845.7

申请日：1990-02-15

Applicant: TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

Inventor： Nakatani, Fumio ,  Wakita, Shinichi ,  Murakami, Hisatoshi ,  Terada, Tsunehiko, Midorigaoka danchi 32-204, ,  Morimoto, Shohei, Hishiyashigashi-Ryo, Tatsuta El.

IPC: H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0216 ,  H05K1/0218 ,  H05K1/095 ,  H05K1/117 ,  H05K1/162 ,  H05K3/3447 ,  H05K3/4644 ,  H05K3/4664 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09272 ,  H05K2201/09672 ,  H05K2201/10689 ,  Y10S428/901

Abstract: The radiation noise suppression effect is enhanced by providing an insulation layer which is formed so that the circuit pattern is covered excepting at least a part of power source pattern or ground pattern on the substrate on which circuit pattern is formed, and a conductive layer which is formed so as to be connected to the uninsulated part of the power source pattern or the ground pattern on the insulation layer, by modifying pattern shape of the conductive layer and the insulation layer or by increasing or reducing the number of these layers.

公开(公告)号：EP0240580B2

公开(公告)日：1994-11-17

申请号：EP86104544.1

申请日：1986-04-03

Applicant: ANT Nachrichtentechnik GmbH

Inventor： Schomers, Josef, Dipl.-Ing.

IPC: H04Q3/68 ,  H05K7/14

CPC classification number: H04Q3/68 ,  H05K7/1459 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09272