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    LED MOUNTING SUBSTRATE AND LED
    51.
    发明公开
    LED MOUNTING SUBSTRATE AND LED 审中-公开

    公开(公告)号：EP3196949A4

    公开(公告)日：2018-01-24

    申请号：EP15826449

    申请日：2015-07-01

    Applicant: CCS INC

    Inventor： YAGI MOTONAO

    IPC: H01L33/48 ,  H01L33/62 ,  H05K1/11 ,  H05K3/34

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/64 ,  H05K1/111 ,  H05K3/3431 ,  H05K2201/09381 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/048

    Abstract: For the purpose of easily positioning a surface mount LED 1 at the time of soldering without impairing a heat dissipation function, an LED mounting board is adapted such that at least one pad 2 (hereinafter referred to as an "irregularly-shaped pad 2") other than a pad 3 having the highest heat dissipation function forms a shape different from the shape of a terminal 13 corresponding to the one pad, and the LED mounting board has an unpolymerized part where in a proper position where the LED 1 is to be mounted, the terminal 13 corresponding to the irregularly-shaped pad 2 and the irregularly-shaped pad 2 do not overlap, in which the unpolymerized part is provided such that only in the proper position where the LED is to be mounted, a resultant force of forces acting on the boundaries of parts where the pads 2, 3, and 4, and the terminals 13, 14, and 15 are respectively polymerized is balanced due to the surface tension of molten solder.

    LED MOUNTING SUBSTRATE AND LED
    52.
    发明公开
    LED MOUNTING SUBSTRATE AND LED 审中-公开
    LED安装基板和LED

    公开(公告)号：EP3196949A1

    公开(公告)日：2017-07-26

    申请号：EP15826449.9

    申请日：2015-07-01

    Applicant: CCS Inc.

    Inventor： YAGI, Motonao

    IPC: H01L33/00 ,  H01L33/62 ,  H01L33/64

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/64 ,  H05K1/111 ,  H05K3/3431 ,  H05K2201/09381 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613

    Abstract: For the purpose of easily positioning a surface mount LED 1 at the time of soldering without impairing a heat dissipation function, an LED mounting board is adapted such that at least one pad 2 (hereinafter referred to as an "irregularly-shaped pad 2") other than a pad 3 having the highest heat dissipation function forms a shape different from the shape of a terminal 13 corresponding to the one pad, and the LED mounting board has an unpolymerized part where in a proper position where the LED 1 is to be mounted, the terminal 13 corresponding to the irregularly-shaped pad 2 and the irregularly-shaped pad 2 do not overlap, in which the unpolymerized part is provided such that only in the proper position where the LED is to be mounted, a resultant force of forces acting on the boundaries of parts where the pads 2, 3, and 4, and the terminals 13, 14, and 15 are respectively polymerized is balanced due to the surface tension of molten solder.

    Abstract translation: 为了在焊接时容易地定位表面安装LED1而不损害散热功能，LED安装板适于使得至少一个焊盘2（在下文中称为“不规则形状的焊盘2”） 除了具有最高散热功能的焊盘3以外，形成与对应于一个焊盘的端子13的形状不同的形状，并且LED安装板具有未聚合部分，其中在将安装LED1的适当位置 与不规则形状的衬垫2相对应的端子13与不规则形状的衬垫2不重叠，其中未聚合部分被设置成使得仅在要安装LED的适当位置处，力的合力 由于熔融焊料的表面张力而作用在分别聚合焊盘2,3,4和端子13,14和15的部分的边界上。

    LIGHT SOURCE MODULE
    53.
    发明公开
    LIGHT SOURCE MODULE 审中-公开
    光源模块

    公开(公告)号：EP3182471A1

    公开(公告)日：2017-06-21

    申请号：EP16195947.3

    申请日：2016-10-27

    Applicant: LG Electronics Inc.

    Inventor： HONG, Jaepyo ,  KIM, Jaechan ,  KIM, Injoong

    IPC: H01L33/62 ,  H01L33/64 ,  F21V29/74

    CPC classification number: F21V29/713 ,  F21S2/005 ,  F21V3/0625 ,  F21V23/06 ,  F21V29/503 ,  F21V29/74 ,  F21V29/763 ,  F21V29/83 ,  F21V31/00 ,  F21Y2115/10 ,  H01L33/64 ,  H01L33/647 ,  H05K1/0209 ,  H05K1/053 ,  H05K3/107 ,  H05K2201/0338 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/1355

    Abstract: A light source module (100) includes: at least one light source emitting light; and a body supporting the light source, wherein the body includes: a heat sink supporting the light source on a top surface thereof, the heat sink absorbing heat from the light source and dissipating the heat to the outside; an insulating part provided on at least one surface of the heat sink, the insulating layer having electrical insulating properties; and a plating part (40) provided on the insulating part, wherein the plating part (40) includes: a contact heat dissipation part (203, 303) contacting a portion of a bottom surface of the light source to receive heat generated from the light source; and a diffusion heat dissipation part (350) connected to the contact heat dissipation part (203, 303), the diffusion heat dissipation part (350) receiving heat from the contact heat dissipation part to discharge the heat to the heat sink. Accordingly, quick heat dissipation is performed, so that it is possible to obtain effects such as improvement of the lifespan of products, enhancement of the stability of products, rapid fabrication processes, inexpensive fabrication cost, facilitation of mass production, improvement of product yield, protection of a conductive material, and improvement of the reliability of products. Furthermore, it is possible to obtain various effects that can be understood through configurations described in embodiments.

    Abstract translation: 一种光源模块（100）包括：至少一个发光的光源; 以及支撑所述光源的主体，其中，所述主体包括：散热器，所述散热器在所述光源的顶面上支撑所述光源，所述散热器从所述光源吸收热量并将所述热量散发到外部; 设置在所述散热器的至少一个表面上的绝缘部件，所述绝缘层具有电绝缘性能; 和设置在绝缘部分上的电镀部分（40），其中电镀部分（40）包括：接触散热部分（203,303），接触光源的底表面的一部分以接收从光产生的热量 资源; 以及连接到所述接触散热部件（203,303）的扩散散热部件（350），所述扩散散热部件（350）从所述接触散热部件接收热量以将所述热量排放到所述散热器。 因此，可以实现快速散热，从而可以获得诸如提高产品使用寿命，提高产品稳定性，快速制造工艺，便宜的制造成本，便于大量生产，提高产品成品率， 导电材料的保护以及产品可靠性的提高。 此外，可以通过实施例中描述的配置来获得可以理解的各种效果。

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