公开(公告)号：EP0908559B8

公开(公告)日：2009-12-09

申请号：EP98118922.8

申请日：1998-10-07

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Gaku, Morio c/o Mitsubishi Gas Chemical Co., Inc. ,  Nozaki, Mitsuru c/o Mitsubishi Gas Chem. Co., Inc. ,  Saimen, Kenji c/o Kuraray Co., Ltd. ,  Esaki, Tamemaru c/o Kuraray Co., Ltd.

IPC: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/00

CPC classification number: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24322 ,  Y10T442/2475

公开(公告)号：EP1962348A2

公开(公告)日：2008-08-27

申请号：EP08103194.0

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan ,  Dai, Haixia ,  Knapp, Michael R ,  Na, Shuo ,  Pakbaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A ,  Wolf, Jeffrey ,  Winoto, Adrian

IPC: H01L31/0224 ,  H01B1/22 ,  G02F1/1343 ,  G02B5/02 ,  H01L21/768

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地，导电层包括可以嵌入矩阵中的纳米线网络。 导电层是光学透明和柔性的。 它可以涂覆或层压在各种基材上，包括柔性和刚性基材。

公开(公告)号：EP1890324A3

公开(公告)日：2008-06-11

申请号：EP07114390.3

申请日：1998-03-31

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Watanabe, Itsuo ,  Fujinawa, Tohru ,  Arifuku, Motohiro ,  Sutou, Hoko ,  Kuwano, Atsushi

IPC: H01L21/60 ,  H01L23/29 ,  H05K3/32 ,  C09J201/00 ,  C09J9/02 ,  C09J161/00 ,  C09J163/00 ,  C08L61/00 ,  C08L63/00 ,  C08K5/14

CPC classification number: H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C08L21/00 ,  C09D5/24 ,  C09D175/16 ,  C09J201/06 ,  H01B1/20 ,  H01B1/22 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0145 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract translation: 一种电路连接材料，该电路连接材料介于彼此面对的电路电极之间，并且通过将相对的电极彼此按压而在按压方向上电连接电极; （1）加热时能够产生自由基的固化剂，（2）分子量为10,000或更高的含羟基的树脂和（3）可自由基聚合的物质 。 还提供了利用这种材料的电路端子连接结构和电路端子连接方法。

公开(公告)号：EP1890324A2

公开(公告)日：2008-02-20

申请号：EP07114390.3

申请日：1998-03-31

Applicant: Hitachi Chemical Company, Ltd.

Inventor： Watanabe, Itsuo ,  Fujinawa, Tohru ,  Arifuku, Motohiro ,  Kanazawa, Hoko Reserch & Development Center, ,  Kuwano, Atsushi

IPC: H01L21/60 ,  H01L23/29 ,  H05K3/32 ,  C09J201/00 ,  C09J9/02 ,  C09J161/00 ,  C09J163/00 ,  C08L61/00 ,  C08L63/00 ,  C08K5/14

CPC classification number: H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C08L21/00 ,  C09D5/24 ,  C09D175/16 ,  C09J201/06 ,  H01B1/20 ,  H01B1/22 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0145 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00

Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.

Abstract translation: 一种电路连接材料的所有其电路电极之间插入海誓山盟面对并电在通过彼此压靠的相对的电极挤压方向连接的电极; 所述电路连接材料包括作为主要组分（1）通过加热产生游离自由基的固化剂，（2），其具有10000或更多，（3）自由基聚合性物质的分子量的含羟基基团的树脂 ， 这样提供了一个电路端子连接结构和连接方法的电路端子，这使得使用寻求的材料制成。

公开(公告)号：EP1253217A4

公开(公告)日：2006-11-29

申请号：EP00942476

申请日：2000-07-06

Applicant: NAT INST OF ADVANCED IND SCIEN ,  OMRON TATEISI ELECTRONICS CO

Inventor： TANAKA H ,  HIRONO S ,  NIINO HIROYUKI ,  YABE AKIRA

IPC: H05K3/18 ,  C23C18/20 ,  C23C18/42

CPC classification number: C23C18/20 ,  C23C18/204 ,  C23C18/206 ,  C23C18/30 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2203/107

Abstract: A method for the preliminary treatment of a material to be subjected to electroless plating, characterized in that a polymer material is mixed with an inorganic filler, a formed product obtained from the resultant mixture is immersed in an anionic aqueous solution containing a noble metal. A formed product having been immersed as mentioned above is then subjected to electroless plating.

公开(公告)号：EP1025989B1

公开(公告)日：2006-02-08

申请号：EP98950488.1

申请日：1998-11-02

Applicant: NIPPON ZEON CO., LTD.

Inventor： WAKIZAKA, Yasuhiro, Nippon Zeon Co., Ltd ,  SAKAMOTO, Kei, Nippon Zeon Co., Ltd

IPC: B32B27/00 ,  B32B15/08 ,  B32B27/08

CPC classification number: B32B27/08 ,  B32B15/08 ,  B32B27/281 ,  B32B27/285 ,  B32B27/34 ,  B32B27/36 ,  B32B2367/00 ,  B32B2371/00 ,  B32B2377/00 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/024 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  Y10T428/24917 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31522 ,  Y10T428/31529

Abstract: A composite film which comprises a film (A) formed of a ring-structure polymer having repeating units formed by the ring-opening type or addition type polymerization of a ring-structure monomer and a film (B) formed of a polycondensation type polymer and wherein at least two layers are adjacent to each other directly or via an adhesive layer.

公开(公告)号：EP1097959B1

公开(公告)日：2004-10-06

申请号：EP00309748.2

申请日：2000-11-03

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Ikeguchi, Nobuyuki ,  Shimoda, Masahiro

IPC: C08J5/24 ,  C09D163/00

CPC classification number: C08J5/24 ,  C08G59/4014 ,  C08G73/0655 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/162 ,  H05K3/0038 ,  H05K2201/0112 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0278 ,  H05K2203/0315

公开(公告)号：EP1329142A2

公开(公告)日：2003-07-23

申请号：EP01965909.3

申请日：2001-08-13

Applicant: Oak-Mitsui, Inc.

Inventor： ANDRESAKIS, John, A ,  PATUREL, Dave

IPC: H05K1/03 ,  B32B27/08

CPC classification number: B32B15/08 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0355 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/252

Abstract: This invention relates to printed circuit boards having improved fire resistance and improved environmental stability. The invention provides halogen-free fire retardant printed circuit boards incorporating potentially flammable polymers. Flame resistant thermoplastic layers prevent combustion of thermosetting polymers, as well as adding strength to the laminate, resulting in a less brittle thin core than the prior art. The flame resistant circuit board is cost efficient, environmentally safe and has excellent properties, including a decreased probability of shorting, good dielectric breakdown voltage, a smooth surface and good electrical/thermal performance.

公开(公告)号：EP1025989A4

公开(公告)日：2003-06-04

申请号：EP98950488

申请日：1998-11-02

Applicant: NIPPON ZEON CO

Inventor： WAKIZAKA YASUHIRO ,  SAKAMOTO KEI

IPC: B32B27/00 ,  B32B27/08 ,  C08L65/00 ,  C08L87/00 ,  H01B3/30 ,  H05K1/02 ,  H05K1/03 ,  B32B15/08

CPC classification number: B32B27/08 ,  B32B15/08 ,  B32B27/281 ,  B32B27/285 ,  B32B27/34 ,  B32B27/36 ,  B32B2367/00 ,  B32B2371/00 ,  B32B2377/00 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/024 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  Y10T428/24917 ,  Y10T428/31504 ,  Y10T428/31511 ,  Y10T428/31522 ,  Y10T428/31529

Abstract: A composite film having a layer structure of at least two layers, wherein a film (A) formed from a ring structure-containing polymer comprising a repeating unit derived from ring-opening or addition polymerization of a monomer having a ring structure, and a film (B) formed from a polycondensation polymer adjoin each other directly or through an adhesive layer.

公开(公告)号：EP1253217A1

公开(公告)日：2002-10-30

申请号：EP00942476.3

申请日：2000-07-06

Applicant: National Institute of Advanced Industrial Science and Technology ,  Omron Corporation

Inventor： TANAKA, H., Omron Corp., 801, Minamifudodo-cho ,  HIRONO, S., Omron Corp., 801, Minamifudodo-cho ,  NIINO, Hiroyuki, Tsukuba Center, National Inst. ,  YABE, Akira, Tsukuba Center, National Inst.

IPC: C23C18/20

CPC classification number: C23C18/20 ,  C23C18/204 ,  C23C18/206 ,  C23C18/30 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2203/107

Abstract: An inorganic filler is added to a polymeric material. An obtained polymeric mold is irradiated with a laser and immersed in an anionic noble metal aqueous solution and thereafter electroless plating is performed.

Abstract translation: 将无机填料加入到聚合材料中。 将获得的聚合物模具用激光照射并浸渍在阴离子贵金属水溶液中，然后进行化学镀。