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    Improved multi-layer printed circuit boards, and methods of manufacturing such boards
    62.
    发明公开
    Improved multi-layer printed circuit boards, and methods of manufacturing such boards 失效
    多层印刷电路板及其制造方法这样的板。

    公开(公告)号：EP0275686A1

    公开(公告)日：1988-07-27

    申请号：EP87311237.9

    申请日：1987-12-21

    Applicant: Prestwick Circuits Limited

    Inventor： Laing, Jed

    IPC: H05K3/46

    CPC classification number: H05K3/4655 ,  H05K3/0041 ,  H05K3/427 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/09509 ,  H05K2203/0554 ,  H05K2203/0759

    Abstract: A layer of copper foil (14, 16) is etched to a required conductor pattern, coated with a thin layer of uncured fibre-free epoxy polymer, (26, 28) and then another layer of copper foil (22, 24) is placed on top. The sandwich is bonded by heat and pressure which cures the layer of polymer (26, 28). The top foil (22, 24) is etched to form another required conductor pattern which is both electrically insulated from and mechanically adhered to the underlying conductor layer (14, 16) by the layer (26, 28) of cured polymer. These steps are repeated as often as is necessary to build up the required number of layers. Interconnections between different layers are either formed by drilling and plating through holes (30), or by a etching hole in a conductor (222) and then plasma etching through the exposed polymer (226) to the underlying conductor (214) with subsequent metal plating (235) to join the conductors in the different layers. The outermost conductive layer can be formed as physically isolated pads or islands of metal. Connections to and from these pads are through conductors buried in the underlying layer of the polymer.

    Abstract translation: 铜箔（14，16）的层被蚀刻到所需的导体图案，涂覆有未固化的无纤维环氧聚合物的薄层，（26，28）和铜箔然后另一个层（22，24）被放置 在上面。 夹心通过热和压力，其固化的聚合物的层（26，28）接合。 顶部箔（22，24）被蚀刻以形成所需的另一个导体图案的所有这既是电绝缘和机械性地附着于由固化的聚合物的层（26，28）的下面的导体层（14，16）。 重复这些步骤，每逢有必要建立所需数量的层。 不同层之间的互连或者通过钻孔形成贯通孔中的导体（222），然后等离子体通过暴露的聚合物（226）到下层导体（214）与后续的金属电镀蚀刻电镀（30），或通过蚀刻孔 （235）加入所述导体在不同的层。 最外层的导电可以形成为物理上隔离垫或金属的岛状物。 连接，并从合成焊盘是通过掩埋聚合物的底层中的导体。

    COPPER-RESIN COMPOSITE BODY AND METHOD FOR PRODUCING SAME
    68.
    发明公开
    COPPER-RESIN COMPOSITE BODY AND METHOD FOR PRODUCING SAME 审中-公开
    德国维多利亚州ZER HERSTELLUNG DAVON KUPFER-HARZ-VERBUNDKÖRPER

    公开(公告)号：EP3062315A1

    公开(公告)日：2016-08-31

    申请号：EP14856461.0

    申请日：2014-10-15

    Applicant: Furukawa Electric Co. Ltd.

    Inventor： KIM, Yong Hoon

    IPC: H01B7/02 ,  B32B5/18 ,  B32B9/00 ,  B32B15/08 ,  C23C8/12 ,  C23C26/00 ,  C23C28/00 ,  H01B13/00

    CPC classification number: B32B15/08 ,  B32B1/08 ,  B32B27/281 ,  B32B27/36 ,  B32B27/38 ,  B32B27/40 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2264/102 ,  B32B2307/206 ,  B32B2457/00 ,  H05K3/385 ,  H05K2201/0358 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/0392 ,  H05K2203/107

    Abstract: The present invention relates to a copper-resin composite body and provides the copper-resin composite body which is excellent in adhesive property between copper and resin and is applicable to a continuous production process such as a wire production process. The present invention uses the copper-resin composite body including a metal (3 )made of copper or a copper alloy and resin (7) adhering to the metal (3) via a nanoporous layer (5) formed on a surface of the metal (3). It is preferable that the nanoporous layer (5) contains copper-oxide particles of 5 nm to 500 nm in average particle diameter. Further, a process for producing the copper-resin composite body includes a process for forming a copper-oxide nanoporous layer on the surface of the metal made of copper or the copper alloy by irradiating the surface of the metal with laser and a process for forming resin on the copper-oxide nanoporous layer.

    Abstract translation: 铜树脂复合体技术领域本发明涉及一种铜树脂复合体，其特征在于，提供铜和树脂之间的粘合性优异的铜树脂复合体，适用于线材生产过程等连续生产工序。 本发明使用包括由铜或铜合金制成的金属（3）和通过形成在金属表面上的纳米多孔层（5）粘附到金属（3）上的树脂（7）的铜树脂复合体， 3）。 纳米多孔层（5）优选含有平均粒径为5nm〜500nm的氧化铜粒子。 此外，铜树脂复合体的制造方法包括通过用激光照射金属的表面，在铜或铜合金的金属的表面上形成氧化铜纳米孔层的工序和成形工序 树脂在氧化铜纳米多孔层上。

    COPPER FOIL COMPOSITE, MOLDED BODY, AND METHOD FOR PRODUCING SAME
    70.
    发明公开
    COPPER FOIL COMPOSITE, MOLDED BODY, AND METHOD FOR PRODUCING SAME 有权
    铜箔复合材料，成型体及其制造方法

    公开(公告)号：EP2792483A1

    公开(公告)日：2014-10-22

    申请号：EP12865468.8

    申请日：2012-01-13

    Applicant: JX Nippon Mining & Metals Corporation

    Inventor： TANAKA Koichiro ,  KAMMURI Kazuki

    IPC: B32B15/08 ,  H05K1/02

    CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

    Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f 3 x t 3 )/(f 2 x t 2 ) => 1 wherein t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1 1 /(F x T) wherein f 1 (N/mm) is 180° peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 µg/dm 2 .is formed on a surface of the copper foil on which the resin layer is not laminated.

    Abstract translation: （f3×t3）/（f2×t2）=> 1其中，t2（mm）是所述铜箔的厚度，f2（MPa）是包括铜箔和层压在其上的树脂层的铜箔复合物，满足等式1： ）为拉伸应变4％时铜箔的应力，t3（mm）为树脂层的厚度，f3（MPa）为拉伸应变4％时树脂层的应力，式2： 1 <= 33f1 /（F×T）其中，f1（N / mm）为铜箔与树脂层之间的180°剥离强度，F（MPa）为拉伸应变30％下的铜箔复合体的强度， T（mm）是铜箔复合体的厚度，其中在未层压树脂层的铜箔的表面上形成5至100μg/ dm 2的涂布量的Cr氧化物层。

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