公开(公告)号：EP3229566A1

公开(公告)日：2017-10-11

申请号：EP17165000.5

申请日：2017-04-05

Applicant: BIOTRONIK SE & Co. KG

Inventor： Henschel, Martin

IPC: H05K3/34 ,  H05K3/40 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32

CPC classification number: H01R12/592 ,  H01R4/029 ,  H01R43/0221 ,  H01R43/0256 ,  H01R43/16 ,  H01R2201/12 ,  H05K1/028 ,  H05K1/117 ,  H05K1/118 ,  H05K3/328 ,  H05K3/3405 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/053 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09172 ,  H05K2201/0949 ,  H05K2201/1028 ,  H05K2201/1034 ,  H05K2201/10757 ,  H05K2201/10962 ,  H05K2203/107

Abstract: Die Erfindung betrifft ein Verbindungselement (1) für eine elektronische Bauelementanordnung, aufweisend einen Träger (2), ein erstes Kontaktpad (3) und ein zweites Kontaktpad (4), eine das erste Kontaktpad (3) und das zweite Kontaktpad (4) elektrisch leitend miteinander verbindende elektrisch leitfähige Struktur (5) und einen ersten Kontaktleiter (6), der mittels einer Lotschicht (11) mit dem ersten Kontaktpad (3) elektrisch leitend verbunden ist und der in einem zweiten Abschnitt der ersten Oberfläche (61) und/oder auf der zweiten Oberfläche (62) zum Ausbilden einer Schweißverbindung ausgestaltet ist. Die Erfindung betrifft ferner eine elektronische Bauelementanordnung mit einem solchen Verbindungselement und mit zumindest einem an den Kontaktleiter geschweißten Bauelement und die Verfahren zum Herstellen des Verbindungselements und der Bauelementanordnung.

Abstract translation: 本发明涉及一种用于电子元件组件，其包括支撑件（2），第一接触垫（3）和第二接触焊盘（4），第一接触垫的连接元件（1）（3）和所述第二接触焊盘（4）导电性 互连导电结构（5）和第一接触导体（6），通过钎焊层的装置（11）导电地连接至所述第一接触垫（3）和在所述第一面的第二部分（61）和/或 第二表面（62）构造成形成焊接接头。 本发明还涉及具有这种连接元件并具有焊接到接触导体的至少一个部件的电子部件装置以及用于制造连接元件和部件装置的方法。

公开(公告)号：EP3195707A1

公开(公告)日：2017-07-26

申请号：EP14758210.0

申请日：2014-08-12

Applicant: Advanced Bionics AG

Inventor： LI, Lin ,  XIE, Jian ,  WALTER, Jeryle

IPC: H05K3/32 ,  H01R4/02

CPC classification number: H05K3/328 ,  A61N1/36036 ,  A61N1/3754 ,  H05K1/09 ,  H05K1/115 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10795 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2203/0169 ,  H05K2203/0195 ,  Y10T29/49183

Abstract: Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

Abstract translation: 将导线（126）连接到馈通引脚（104）和包括连接到馈通引脚的导线的装置的方法。

公开(公告)号：EP2568784B1

公开(公告)日：2017-02-15

申请号：EP11194944.2

申请日：2011-12-21

Applicant: Primax Electronics Ltd

Inventor： Su, Chun-nan ,  Peng, Chun-Ching

IPC: H01R24/42

CPC classification number: H05K5/0278 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H05K3/4015 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/1056 ,  Y10T29/49139

公开(公告)号：EP2891390A4

公开(公告)日：2016-05-25

申请号：EP13832479

申请日：2013-08-10

Applicant: INCO INNOVATION

Inventor： BERGLUND JAN

IPC: H05K1/02 ,  H01B5/02 ,  H02G5/00

CPC classification number: H05K1/181 ,  H05K1/0263 ,  H05K2201/0379 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/1028

Abstract: A power chain consisting of a chain comprising links that are electrically conductive elements mounted on a circuit board in at least two layers and in such a way that the elements included in the power chain are assembled shifted and overlapping and in electrical contact with each other.

公开(公告)号：EP2991461A1

公开(公告)日：2016-03-02

申请号：EP15177921.2

申请日：2015-07-22

Applicant: FUJITSU LIMITED

Inventor： TAGUCHI, Jun

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0203 ,  H05K1/0206 ,  H05K1/144 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10598

Abstract: A circuit board includes a plate member capable of holding a printed circuit board, the printed circuit board including an electronic component, and a cooling member provided on the electronic component, the printed circuit board and the electronic component being positioned between the plate member and the cooling member; and a circuit provided to the plate member and allowed to be electrically connected with the printed circuit board.

Abstract translation: 电路板包括能够保持印刷电路板的板构件，所述印刷电路板包括电子部件以及设置在所述电子部件上的冷却构件，所述印刷电路板和所述电子部件位于所述板构件和所述板构件之间 冷却构件; 以及提供给板构件并允许与印刷电路板电连接的电路。

公开(公告)号：EP2740139A1

公开(公告)日：2014-06-11

申请号：EP12753413.9

申请日：2012-08-03

Applicant: Phoenix Contact GmbH & Co. KG

Inventor： DURTH, Rainer ,  MEYER, Thomas

IPC: H01H37/76 ,  H01T1/14 ,  H05K1/02

CPC classification number: H01H37/764 ,  H01H37/761 ,  H01T1/14 ,  H05K1/0201 ,  H05K2201/0311 ,  H05K2201/10181 ,  H05K2201/1028 ,  H05K2203/047 ,  H05K2203/176

Abstract: The subject matter of the invention is a thermal overload protection apparatus (20) for protecting an electrical component (12), in particular an electronic component, which thermal overload protection apparatus has a switching element (22) for short-circuiting connections (14, 16) of the component (12) and for interrupting an electrically conductive connection (24) between at least one of the connections (14) and a power supply element (26) of the overload protection apparatus (20), an actuator apparatus (28) for moving the switching element (22) into a corresponding short-circuiting position or isolating position and a tripping element, which thermosensitively trips the actuator apparatus (28) and is in the form of a separating element (30). The invention provides that the overload protection apparatus (20) has a base element (36), to which the separating element (30) is connected, wherein the base element (36) can be soldered by means of a standard soldered joint (38) on a side remote from the separating element (30). The invention also relates to a corresponding arrangement with a conductor track carrier (10), at least one component (12) arranged thereon and at least one associated overload protection apparatus (20) and to a method for producing a composite comprising a switching element (22), a base element (36) and a separating element (30).

公开(公告)号：EP2491582B1

公开(公告)日：2013-12-11

申请号：EP10770711.9

申请日：2010-10-11

Applicant: Mühlbauer AG

Inventor： ZOLLNER, Franz

IPC: H01L21/48 ,  H01L23/498 ,  H05K3/40

CPC classification number: H01L21/486 ,  H01L23/49827 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K1/184 ,  H05K3/103 ,  H05K3/281 ,  H05K3/403 ,  H05K3/4046 ,  H05K3/4084 ,  H05K2201/09645 ,  H05K2201/1028 ,  H05K2201/10674 ,  H05K2201/10727 ,  H05K2203/063 ,  H01L2924/00

公开(公告)号：EP2620043A4

公开(公告)日：2013-10-30

申请号：EP12785334

申请日：2012-05-21

Applicant: TECNOMAR OY

Inventor： MARTTILA TOM

IPC: H05K3/46 ,  G06K19/077 ,  H01L21/677 ,  H01L23/538

CPC classification number: H05K3/46 ,  G06K19/07749 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K3/4685 ,  H05K2201/0397 ,  H05K2201/1028 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  H01L2924/00

公开(公告)号：EP2571339A3

公开(公告)日：2013-10-30

申请号：EP12183055.8

申请日：2012-09-05

Applicant: FUJITSU LIMITED

Inventor： SAKURAI, Tomonori ,  KOBAYASHI, Chikara ,  MATSUDA, Hiroaki ,  YADA, Haruyoshi ,  HARADA, Kurumi ,  ARAKI, Tatsuhito

IPC: H05K3/40 ,  H01R12/57 ,  H04M1/02 ,  H01R12/71 ,  H01R12/73 ,  H05K1/18 ,  H05K3/32

CPC classification number: H04M1/0277 ,  H01R12/714 ,  H01R12/732 ,  H04M1/0214 ,  H05K1/18 ,  H05K3/325 ,  H05K3/4015 ,  H05K2201/1028

Abstract: An electronic device (100) includes a printed circuit board (250) that a substrate contact part (250a) acting as a point of contact with another component (262) is formed on a board surface thereof, a conductive member (264) that has a first contact portion (264a) in contact with the substrate contact part, a plate-like extending portion (264b) extending from the first contact portion to the outside of the printed circuit board, and a second contact portion (264e) formed on a plate surface of the extending portion on the outside of the printed circuit board, and an electrical component that includes a component contact part (2624) in contact with the second contact portion and a body part (2622) on which the component contact part is formed, and is placed so that the component contact part or at least a part of the body part is opposed to an end face (250b) of the printed circuit board.

公开(公告)号：EP2620043A1

公开(公告)日：2013-07-31

申请号：EP12785334.9

申请日：2012-05-21

Applicant: Tecnomar Oy

Inventor： MARTTILA, Tom

IPC: H05K3/46 ,  H01L23/538 ,  H01L21/677 ,  G06K19/077

CPC classification number: H05K3/46 ,  G06K19/07749 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K3/4685 ,  H05K2201/0397 ,  H05K2201/1028 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A reel to reel manufacturing method of electrical bridges, wherein over a substrate (1) made of electrically insulating material is patterned a conductive pattern (2) from electroconductive material, such as metal foil, and from the said electroconductive material is made at least one strip tongue (3) unattached to the substrate, one side of which is attached to the conductive pattern (2), and the said strip tongue (3) is folded over an area insulated electrically from the conductive pattern (2), and the strip tongue (3) is connected electroconductively to a predetermined other part (5) of the conductive pattern (2).

Abstract translation: 一种电桥的卷轴到卷轴的制造方法，其中在由电绝缘材料制成的基板（1）上由导电材料（例如金属箔）图案化导电图案（2），并且将所述导电材料制成至少一个 （3），其一侧连接到所述导电图案（2），并且所述条舌（3）折叠在与所述导电图案（2）电绝缘的区域上，并且所述条状物 舌片3与导电图案2的预定的另一部分5导电连接。