公开(公告)号：EP0104580B1

公开(公告)日：1987-09-02

申请号：EP83109273.9

申请日：1983-09-19

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Zitzler, Rudolf, Dipl.-Ing. ,  Sonnenberg, Michael

IPC: H01C1/142 ,  H01G1/14 ,  H01C17/24 ,  H01G4/24

CPC classification number: H01G2/065 ,  H01C1/142 ,  H01C17/006 ,  H01C17/242 ,  H05K1/092 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403 ,  H05K3/4061 ,  H05K2201/09181

公开(公告)号：EP0149932B1

公开(公告)日：1987-08-19

申请号：EP84402372.1

申请日：1984-11-21

Applicant: INTERCONNEXIONS CERAMIQUES S.A.

Inventor： Dubuisson, Jacques ,  Le Gal, Pascal

IPC: H05K1/16 ,  H01L29/80

CPC classification number: H05K1/024 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/0187 ,  H05K2201/049 ,  H05K2201/09181 ,  Y10T29/435 ,  H01L2924/00

公开(公告)号：EP0098114A3

公开(公告)日：1985-07-31

申请号：EP83303642

申请日：1983-06-24

Applicant: FUJITSU LIMITED

Inventor： Tsujimura, Takehisa

IPC: H01L23/48 ,  H01L23/04

CPC classification number: H01L23/49805 ,  H01L23/057 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01079 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09709 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00014

Abstract: In a leadless chip carrier (LCC) type semiconductor device, a larger number of soldering pads (3, 8) for connection to an external circuit can be formed for a given package size by using different depths of adjacent grooves (611a, 611b, 621a, 621b) formed along the edge face (612, 622) of the package to receive metallization lines (613a, 613b, 623a, 623b). Adjacent soldering pads are therefore located at different depths from the periphery of the package, so that the risk of short circuits caused by solder bridges between adjacent soldering pads is not increased by the increased density.

公开(公告)号：EP0042417A1

公开(公告)日：1981-12-30

申请号：EP81900254.0

申请日：1980-12-22

Applicant: Western Electric Company, Incorporated

Inventor： HALL, Peter Michael ,  HOWLAND, Frank Leslie ,  MORABITO, Joseph Michael ,  RICKABAUGH, Lawrence James

IPC: H01L23 ,  H01L21 ,  H05K3

CPC classification number: H01L24/83 ,  H01L23/49816 ,  H01L24/26 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10727 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613 ,  H01L2924/00

Abstract: Un procede de fabrication d'ensembles de circuits utilise des macro-composants (10) montes sur des substrats de support (20). De maniere a garder un degagement suffisant entre le composant et le substrat et obtenir des liaisons de haute fiabilite, des spheres massives de soudure (16) sont appliquees sur des cales de contact (14) soit sur le composant soit sur le substrat. Apres avoir ammene en contact les cales de contact du porteur et du substrat avec les spheres, la liaison est formee en fondant la soudure tout en maintenant un degagement entre le composant et le substrat d'au moins 0,25mm grace a la tension en surface des spheres de soudure.

公开(公告)号：EP0019385A1

公开(公告)日：1980-11-26

申请号：EP80301389.5

申请日：1980-04-28

Applicant: THE MEAD CORPORATION

Inventor： Kenworthy, E.J. Doyle

IPC: B41J3/04

CPC classification number: B41J2/085 ,  H05K1/095 ,  H05K3/045 ,  H05K3/3442 ,  H05K3/403 ,  H05K3/4069 ,  H05K2201/09181 ,  H05K2201/10984 ,  Y10T29/49155

Abstract: A planar charge plate having individual charge electrodes (22) uniformly spaced along one face (14) thereof is provided by cutting grooves (16) into the edge of a blank nonconductive charge plate support structure (10). The surfaces of the structure, including grooves (16) and lands (18), are metallized and printed circuit leads (20) are formed leading from the grooves. The grooves arefilled with an electrically conductive material, such as solder, and thentheface (14) of the structure is lapped to remove excess solder and metal plating from the lands to form the completed planar-faced structure.

公开(公告)号：EP3207773A1

公开(公告)日：2017-08-23

申请号：EP15795255.7

申请日：2015-10-14

Applicant: Continental Automotive Systems, Inc.

Inventor： MATOY, Jennifer L.

IPC: H05K3/18 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K5/0069 ,  H01R12/55 ,  H01R12/58 ,  H05K3/325 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/1034 ,  H05K2201/10446 ,  H05K2201/1059

Abstract: A printed circuit board assembly includes a printed circuit board (PCB) having an end. The end includes surfaces defining a plurality of electrically conductive notches therein. A plurality of electrically conductive pins is provided with each pin being received in an associated notch in a press-fitted manner so as to make electrical connection with the PCB.

Abstract translation: 印刷电路板组件包括具有端部的印刷电路板（PCB）。 该端部包括在其中限定多个导电凹槽的表面。 提供多个导电引脚，每个引脚以压配合方式容纳在相关联的凹口中，以便与PCB电连接。

公开(公告)号：EP3131371A3

公开(公告)日：2017-04-19

申请号：EP16180076.8

申请日：2016-07-19

Applicant: InnoSenT GmbH

Inventor： Bäuerlein, Stefan ,  Lenhard, Thilo

IPC: H05K1/02 ,  H05K3/00 ,  G01S7/02

CPC classification number: H05K1/0216 ,  G01S2007/028 ,  H05K1/0218 ,  H05K1/0298 ,  H05K3/0044 ,  H05K2201/048 ,  H05K2201/0707 ,  H05K2201/09036 ,  H05K2201/09181 ,  H05K2203/0228

Abstract: Die Erfindung betrifft einen Radarsensor (1) mit einer Leiterplatte mit einer elektronischen Schaltung und mit einer Bestückung elektronischer Komponenten und mit einem die Leiterplatte und die darauf angeordnete Bestückung abdeckenden Abschirmdeckel (10, 50), wobei der Abschirmdeckel aus einem Leiterplattenmaterial (11, 51) ausgebildet ist und eine Einbuchtung (12, 52) aufweist, welche Raum für die Aufnahme der Bestückung schafft.

公开(公告)号：EP2919326A1

公开(公告)日：2015-09-16

申请号：EP14158703.0

申请日：2014-03-11

Applicant: Telebox Industries Corp.

Inventor： Wu, Fu-Wen ,  Huang, Su-Hui ,  Hsu, Ching-Yi

IPC: H01R12/52 ,  H01R13/6467 ,  H01R24/64 ,  H05K3/36 ,  H05K3/40 ,  H01R13/6466 ,  H01R13/6469

CPC classification number: H01R24/64 ,  H01R12/52 ,  H01R13/6466 ,  H01R13/6467 ,  H01R13/6469 ,  H05K1/141 ,  H05K1/144 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/041 ,  H05K2201/09181 ,  H05K2201/10189

Abstract: A connector includes an insulated housing having a slot and a transmission assembly located inside the insulated housing. The transmission assembly includes a main circuit board, an expanded circuit board, a plurality of first terminals and at least one second terminal. The expanded circuit board is stacked on the main circuit board and a first lateral side and a second lateral side of the expanded circuit board which are opposite to each other has a plurality of first electrical contacts and at least one second electrical contact, respectively. The first terminals and the at least one second terminal are plugged in the main circuit board. One ends of the first terminals are in electrical contact with the first electrical contacts respectively. The other ends of the first terminals bend and extend towards the second lateral side of the expanded circuit board.

公开(公告)号：EP2899802A1

公开(公告)日：2015-07-29

申请号：EP15150480.0

申请日：2015-01-08

Applicant: Honeywell International Inc.

Inventor： Wang, Nan ,  Wang, Chao ,  Nyhus, Orville

IPC: H01P3/08 ,  H01P5/02 ,  H01P11/00 ,  H01Q1/50 ,  H01Q21/00 ,  H05K1/14 ,  H05K3/36 ,  H01Q21/08

CPC classification number: H01P5/028 ,  H01P1/047 ,  H01P1/30 ,  H01P3/085 ,  H01Q1/50 ,  H01Q21/0075 ,  H01Q21/08 ,  H02H1/04 ,  H05K1/142 ,  H05K3/36 ,  H05K2201/09181 ,  H05K2201/09845 ,  Y10T29/49126

Abstract: An anti-lightning-combined-stripline-circuit system is provided. The anti-lightning-combined-stripline-circuit system includes a stripline board including circuitry, and a metal ground bar attached to the stripline board. The metal ground bar has a geometry configured to function as a ground for the circuitry and simultaneously function as a lightning ground for a linear array of elements driven by the circuitry.

Abstract translation: 提供防雷击组合线路电路系统。 防雷击组合线路电路系统包括带状线板，其包括电路，以及连接到带状线板的金属接地棒。 金属接地棒具有配置为用作电路的接地的几何形状，并且同时用作由电路驱动的元件的线性阵列的雷电接地。

公开(公告)号：EP2712281A1

公开(公告)日：2014-03-26

申请号：EP12785591.4

申请日：2012-02-01

Applicant: NGK Spark Plug Co., Ltd.

Inventor： HASEGAWA, Masami ,  HIRAYAMA, Satoshi ,  KITO, Naoki

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0306 ,  H05K1/113 ,  H05K3/0044 ,  H05K3/0052 ,  H05K3/381 ,  H05K3/403 ,  H05K2201/0909 ,  H05K2201/09181 ,  H05K2201/09845 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T428/24479 ,  Y10T428/24612

Abstract: Provided are a wiring substrate having few burrs in the vicinity of a notch located on a side surface of a substrate main body, in which breakage of a conductor layer provided on the inner wall of the notch is suppressed; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array.
The wiring substrate 1a includes a substrate main body kp which is formed of a plurality of stacked ceramic layers S, which has a rectangular shape in plan view, which has a pair of opposite first and second main surfaces 3 and 2, and which has side surfaces 4 each being located between the paired main surfaces 3 and 2, and having a groove surface 6 located on a side toward the first main surface (back surface) 3 and a fracture surface 5 located between the groove surface 6 and the second main surface 2; and a notch 11 which has a concave shape in plan view, and which is provided on a side surface 4 only on a side toward the first main surface 3 so as to extend in a thickness direction of the side surface 4, wherein, in the side surface 4 having the notch 11, the boundary 7 between the groove surface 6 and the fracture surface 5 has first curved portions R1 on opposite sides of the notch 11, the first curved portions R1 being convex toward the first main surface 3 of the substrate main body kp in side view; and also has a second curved portion R2 on a second-main-surface side of the notch 11, the second curved portion R2 being convex toward the second main surface (front surface) 2 of the substrate main body kp in side view.

Abstract translation: 提供一种布线基板，其在位于基板主体的侧面的凹口附近具有较少的毛刺，其中抑制了设置在凹口内壁上的导体层的断裂; 用于提供多个所述布线基板的多片式布线基板阵列; 以及可靠地制造多片式布线基板阵列的方法。 布线基板1a包括由平面图形成为矩形形状的多个层叠陶瓷层S形成的基板主体kp，该堆叠陶瓷层S具有一对相对的第一主面3和第二主面2，并且具有侧面 表面4位于成对的主表面3和2之间，并且具有位于朝向第一主表面（背面）3的一侧的槽表面6和位于槽表面6和第二主表面之间的断裂表面5 2; 以及在俯视图中具有凹形形状的凹口11，并且仅在侧面4上设置在侧面4的侧面上，以沿着侧面4的厚度方向延伸，其中，在 具有凹口11的侧面4，槽表面6与断裂面5之间的边界7在凹口11的相对侧上具有第一弯曲部分R1，第一弯曲部分R1朝向基底的第一主表面3凸出 主体kp在侧视图; 并且在凹口11的第二主表面侧上还具有第二弯曲部分R2，第二弯曲部分R2在侧视图中朝向基板主体kp的第二主表面（前表面）2凸出。