公开(公告)号：EP1358489A1

公开(公告)日：2003-11-05

申请号：EP02729357.0

申请日：2002-01-08

Applicant: Silverbrook Research Pty. Limited

Inventor： SILVERBROOK, KIA,Silverbrook Research Pty Ltd

IPC: G01P15/08 ,  H01L21/822 ,  H01L23/04

CPC classification number: H01L23/315 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81B2201/0235 ,  B81B2207/056 ,  B81C1/00269 ,  B81C1/00333 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0127 ,  G01P1/023 ,  G01P15/0802 ,  H01L23/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An accelerometer chip (202) has a molded thermoplastic cap (210) applied on one surface to provide a cavity into which the cantilevered mass (204) of the accelerometer may move. An array of caps is applied to a wafer of accelerometer chips (202) before singulation of the wafer.

公开(公告)号：EP1354848A2

公开(公告)日：2003-10-22

申请号：EP03252238.5

申请日：2003-04-09

Applicant: Hewlett-Packard Company

Inventor： Ives, Thomas Wayne

IPC: B81B3/00

CPC classification number: B81B3/0072 ,  B81B3/0021 ,  B81B3/0062 ,  B81B2201/0235 ,  B81B2201/042 ,  B81B2201/07 ,  B81B2203/053 ,  B81B2203/058

Abstract: A micro-electro-mechanical device (110) comprises a moveable mass (112), a frame (114) for supporting the mass (112), and a flexure (10) extending between the mass (112) and the frame (114). The flexure (10) includes an integral actuator (18) for moving the mass (112) with respect to the frame (114).

Abstract translation: 微电子机械装置（110）包括可移动质量块（112），用于支撑质量块（112）的框架（114）和在质量块（112）和框架（114）之间延伸的挠曲件（10） 。 挠曲件（10）包括用于相对于框架（114）移动质量块（112）的整体致动器（18）。

公开(公告)号：EP1352252A2

公开(公告)日：2003-10-15

申请号：EP02705870.0

申请日：2002-01-17

Applicant: Honeywell International Inc.

Inventor： FOOTE, Steven

IPC: G01P15/10

CPC classification number: B81B3/0051 ,  B81B2201/0235 ,  B81B2203/056 ,  B81B2203/058 ,  G01P15/097 ,  G01P2015/0828

Abstract: An apparatus and method for suspending two or more force-versus-displacement sensors for measuring displacement of a pendular structure relative to a frame structure, wherein a suspension structure includes the frame and pendular structures, the pendular structure having a base structure suspended from the frame structure for rotation about a first axis, a beam structure spaced away from the first axis, and a flexure suspending the beam structure from the base structure for rotation about a second axis that is substantially perpendicular to the first axis. The flexure suspending the beam structure from the base structure is positioned substantially intermediate between suspension positions of the force-versus-displacement sensors, and constrains the beam structure to motion substantially within the plane of the pendular structure.

公开(公告)号：EP1334060A1

公开(公告)日：2003-08-13

申请号：EP01992685.6

申请日：2001-10-06

Applicant: Robert Bosch GmbH

Inventor： BENZEL, Hubert ,  WEBER, Heribert ,  ARTMANN, Hans ,  SCHAEFER, Frank

IPC: B81B3/00

CPC classification number: B81C1/00595 ,  B81B2201/0235 ,  B81B2201/036 ,  B81C2201/0114 ,  B81C2201/0115 ,  B81C2201/0136 ,  B81C2203/0136

Abstract: The invention relates to the production of a micromechanical component, comprising a substrate (10), made from a substrate material with a first doping type (p), a micromechanical functional structure arranged in the substrate (10) and a cover layer for the at least partial covering of the micromechanical functional structure. The micromechanical functional structure comprises regions (15; 15a; 15b; 15c; 730; 740; 830) made from the substrate material with a second doping type (n), at least partially surrounded by a cavity (50; 50a-f) and the cover layer comprises a porous layer (30) made from the substrate material.

Abstract translation: 本发明涉及微机械部件的制造，该微机械部件包括由具有第一掺杂类型（p）的衬底材料制成的衬底（10），布置在衬底（10）中的微机械功能结构和用于at 微机械功能结构的至少部分覆盖。 微机械功能结构包括至少部分地由空腔（50; 50a-f）围绕的具有第二掺杂类型（n）的由衬底材料制成的区域（15; 15a; 15b; 15c; 730; 740; 830）; 覆盖层包括由基底材料制成的多孔层（30）。

公开(公告)号：EP1271155A1

公开(公告)日：2003-01-02

申请号：EP02020310.5

申请日：1995-03-21

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Shiomi, Hiromu, Itami Works of Sumitomo Electric ,  Nishibayashi, Yoshiki c/o Itami Works of Sumitomo ,  Shikata, Shin-ichi c/o Itami Works of Sumitomo

IPC: G01P15/08 ,  G01L9/00 ,  C30B29/04 ,  G01H11/00

CPC classification number: G01P15/0802 ,  B81B3/007 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/034 ,  B81B2201/035 ,  B81B2201/054 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00682 ,  B81C2201/0109 ,  G01H3/08 ,  G01H11/00 ,  G01H11/06 ,  G01P15/125 ,  G01P2015/0828

Abstract: A micro mechanical component, in particular an accelerometer, of the present invention comprises a diamond base, and a diamond cantilever supported on the base and relatively driving to the base. A process for producing a micromechanical component involves forming of a dummy layer promoting the growth of diamond, depositing a diamond layer by vapor phase synthesis (CVD), and removing said dummy layer.

Abstract translation: 本发明的微机械部件，特别是加速度计包括金刚石基座和支撑在基座上并相对地驱动到基座的金刚石悬臂。 制造微机械部件的方法包括形成促进金刚石生长的虚拟层，通过气相合成（CVD）沉积金刚石层，以及去除所述虚设层。

公开(公告)号：EP1208385A4

公开(公告)日：2002-11-27

申请号：EP00926518

申请日：2000-03-16

Applicant: INPUT OUTPUT INC

Inventor： SELVAKUMAR ARJUN ,  GOLDBERG HOWARD D ,  YU DULI ,  IP MATTHEW ,  SCHMIDT MARTIN A ,  MARSH JAMES L ,  FUNG BING-FAI ,  SIMON PHILIP

IPC: G01P21/00 ,  G01D11/24 ,  G01D18/00 ,  G01H1/00 ,  G01L27/00 ,  G01N1/02 ,  G01P1/02 ,  G01P15/08 ,  G01P15/125 ,  G01P15/13 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/18 ,  G01V1/40 ,  H01L21/60 ,  H01L29/84 ,  H05K5/00 ,  B81B3/00 ,  B81B7/00 ,  G01P1/00

CPC classification number: G01P1/023 ,  B81B3/001 ,  B81B3/0072 ,  B81B7/0016 ,  B81B2201/0235 ,  G01D11/245 ,  G01D18/008 ,  G01N2001/021 ,  G01P15/0802 ,  G01P15/13 ,  G01P21/00 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/181 ,  G01V1/186 ,  H01L2224/48472 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system for acquiring environnemental information measurements. The 5 system (100) utilizes a sensor, (205) a front-end circuit, (310) a loop filter (315), a switch controller (206), and a recuced-oder loop control circuit to provide reliable data measurements while providing robust system behavior. The system further includes a sensor simulator (330) for simulating the operation of the sensor (205) and testing the operation of the front-end circuit (310) nd the loop filter (315).

公开(公告)号：EP1228998A2

公开(公告)日：2002-08-07

申请号：EP01125720.1

申请日：2001-10-27

Applicant: ROBERT BOSCH GMBH

Inventor： Fischer, Frank ,  Hein, Peter, Dr. ,  Graf, Eckhard

IPC: B81B3/00

CPC classification number: B81C1/00333 ,  B81B7/0006 ,  B81B7/007 ,  B81B2201/0235 ,  B81C2203/0118 ,  B81C2203/019

Abstract: Die Erfindung geht aus von einem mikromechanischen Bauelement mit einem Substrat, mindestens einer strukturierten Schicht (5), wobei in der strukturierten Schicht (5) mindestens eine Funktionsstruktur (7) gebildet ist, und einer Kappe (1), die die Funktionsstruktur (7) überdeckt, wobei zwischen der Kappe (1) und der Funktionsstruktur (7) mindestens ein Hohlraum (7a) gebildet ist, und eine Verbindungsschicht (2) die Kappe (1) mit der strukturierten Schicht (5) verbindet, sowie von einem Verfahren zur Herstellung eines mikromechanischen Bauelements nach der Gattung des betreffenden unabhängigen Patentanspruchs.
Um ein kompaktes und solides Bauelement zu erhalten, ist erfindungsgemäß vorgesehen, daß die Verbindungsschicht (2) durch ein anodisch bondbares Glas, d.h. ein Bondglas, gebildet ist, das insbesondere eine Dicke im Bereich von 300 nm bis 100 µm, vorzugsweise im Bereich von 300 nm bis 50 µm, aufweist.

Abstract translation: 本发明涉及微型机械装置具有一个基板，至少一个结构化的层（5），其中在所述结构化层（5）形成的至少一个功能结构（7）和盖（1），所述功能结构（7） 覆盖，其中，所述盖（1）和所述功能结构（7）之间形成至少一个空腔（7A），和一个粘结层（2），所述盖（1）与结构化层连接（5），以及一种用于制备 根据有关独立权利要求的前序部分的微机械部件。 为了获得一个紧凑的和固体组分，本发明提供了，通过一个阳极粘接玻璃连接层（2），即 粘接玻璃形成，特别是其具有的厚度在300纳米至100微米的范围内，优选在300纳米至50微米的范围内。

公开(公告)号：EP1192419A1

公开(公告)日：2002-04-03

申请号：EP00915012.9

申请日：2000-03-17

Applicant: Input/Output, Inc.

Inventor： RUSHEFSKY, Larry ,  SIGMAR, Axel ,  GOLDBERG, Howard, D. ,  STALNAKER, W., Marc ,  RINNE, Ray ,  BALDERES, Demetrios ,  LEMKE, Al ,  IP, Matthew ,  BEHN, Lawrence, P. ,  DOMAGALSKI, Klaus ,  YU, Lianzhong ,  SELVAKUMAR, Arjun ,  YU, Duli ,  MARSH, James, L. ,  MAXWELL, Peter ,  MORGAN, David ,  BUIE, Thomas ,  FABER, Kees ,  ALTMAN, Sjoerd ,  LAROO, Richard

IPC: G01D11/24 ,  G01D21/00 ,  B65D85/38

CPC classification number: G01P1/023 ,  B81B3/001 ,  B81B3/0072 ,  B81B7/0016 ,  B81B2201/0235 ,  G01D11/245 ,  G01D18/008 ,  G01N2001/021 ,  G01P15/0802 ,  G01P15/13 ,  G01P21/00 ,  G01V1/047 ,  G01V1/053 ,  G01V1/104 ,  G01V1/181 ,  G01V1/186 ,  H01L2224/48472 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system for acquiring environnemental information measurements. The 5 system (100) utilizes a sensor, (205) a front-end circuit, (310) a loop filter (315), a switch controller (206), and a recuced-oder loop control circuit to provide reliable data measurements while providing robust system behavior. The system further includes a sensor simulator (330) for simulating the operation of the sensor (205) and testing the operation of the front-end circuit (310) nd the loop filter (315).

公开(公告)号：EP1167979A2

公开(公告)日：2002-01-02

申请号：EP01114998.6

申请日：2001-06-20

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tamura, Masaya, (A170) Intellect. Prop. Department

IPC: G01P15/08 ,  G01P1/02 ,  G01C19/56

CPC classification number: G01P15/125 ,  B81B7/0041 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/025 ,  B81C2203/0145 ,  G01C19/5719 ,  G01P1/02 ,  G01P15/0802 ,  G01P2015/0814

Abstract: A plane vibrator (5) of an angular velocity sensor (2) and a movable member (20) of an acceleration sensor (3) are provided in a spaced floating state on the same substrate (4). A lid (30) is formed so as to cover and be spaced from the upper side of the plane vibrator (5) and the movable member (20). A space defined by the substrate (4) and the lid (30) is sectioned into a angular velocity sensor space (33) and an acceleration sensor space (34) by use of a sectioning wall (36). The angular velocity sensor space (33) is hermetically sealed to be in the vacuum state. The acceleration sensor space (34) is hermetically sealed to be under atmospheric pressure. The plane vibrator (5) is vibrated at a high frequency and a large amplitude so that the angular velocity detection sensitivity is enhanced. The movable member (20), even if vibration of the plane vibrator (5) is transmitted thereto, is prevented from vibrating at a high frequency and a large amplitude, due to the damping effect of air. Thus, the acceleration detection sensitivity is enhanced.

公开(公告)号：EP1108203A2

公开(公告)日：2001-06-20

申请号：EP99953629.5

申请日：1999-08-27

Applicant: Infineon Technologies AG

Inventor： AIGNER, Robert ,  HIEROLD, Christofer ,  KAPELS, Hergen ,  KOLB, Stefan ,  MAIER-SCHNEIDER, Dieter ,  OPPERMANN, Klaus-Günter ,  TIMME, Hans-Jörg ,  SCHEITER, Thomas ,  WERNER, Wolfgang

IPC: G01L9/00 ,  G01L9/12 ,  G01P15/08 ,  H04R7/10

CPC classification number: G01L9/0042 ,  B81B2201/0235 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C1/00896 ,  B81C2201/053 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed is a method for the production of a micromechanical component, comprising the production of a micromechanical component with sensor holes, wherein at least one component protective layer and/or spacer coating is applied on the component before separating the wafer into chips, wherein the component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer. The invention also relates to a micromechanical component produced according to the method disclosed in the invention and to the use of said components in microphones, pressure sensors or acceleration sensors.