公开(公告)号：EP3096592A1

公开(公告)日：2016-11-23

申请号：EP15737145.1

申请日：2015-01-14

Applicant: Taiyo Ink Mfg. Co., Ltd.

Inventor： SHIMAMIYA, Ayumu ,  YONEDA, Naoki ,  USHIKI, Shigeru

IPC: H05K3/34 ,  H05K1/02 ,  H05K3/00 ,  H05K3/18 ,  H05K3/28

CPC classification number: H05K3/341 ,  H05K1/0284 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/064 ,  H05K3/105 ,  H05K3/18 ,  H05K3/182 ,  H05K3/3452 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/2072 ,  H05K2203/0568 ,  H05K2203/107 ,  Y02P70/613

Abstract: Provided is a highly reliable three-dimensional circuit board which can prevent solder flow during component mounting or a short in a circuit, and a solder resist composition used for the same. Provided is a three-dimensional circuit board (10) comprising a circuit (2) formed on a three-dimensional board (1) and a component mount unit (3). A solder resist (4) is formed such that a component mount unit (3) is open, and an electronic component is mounted on a component mount unit (3) with solder. Preferably, a solder resist (4) is a photoresist, and preferably, a three-dimensional board 1 is a resin molding and a circuit (2) is formed on a resin molding.

Abstract translation: 提供了一种高度可靠的三维电路板，其可以防止组件安装期间的焊料流动或电路中的短路，以及用于其的阻焊组合物。 提供一种三维电路板（10），其包括形成在三维板（1）和部件安装单元（3）上的电路（2）。 形成阻焊剂（4），使得部件安装单元（3）打开，电子部件用焊料安装在部件安装单元（3）上。 优选地，阻焊剂（4）是光致抗蚀剂，优选地，三维基板1是树脂成型体，并且在树脂成型体上形成电路（2）。

公开(公告)号：EP3036473A1

公开(公告)日：2016-06-29

申请号：EP14837781.5

申请日：2014-08-22

Applicant: Molex, LLC ,  Mcgowan, Daniel B. ,  Picini, Michael C.

Inventor： MCGOWAN, Daniel B. ,  PICINI, Michael C.

IPC: F21S2/00

CPC classification number: F21K9/20 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/05 ,  H05K1/117 ,  H05K1/183 ,  H05K3/0026 ,  H05K3/12 ,  H05K2201/09018 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

Abstract: A light emitting diode (LED) module includes a base that is conductive and is selectively covered with an insulative layer. The base can include a connecting flange and a light emitting region. Traces are provided on the insulative coating and can be used to connect LEDs positioned on the light emitting region to pads on the connecting flange. The connecting flange can be offset in angle and/or position from the base and can be configured to provide a contact shape suitable to mate with a connector in a polarized manner. The base can be shaped so as to provide the desired functionality.

Abstract translation: 发光二极管（LED）模块包括导电的基座并且选择性地覆盖有绝缘层。 基座可以包括连接凸缘和发光区域。 在绝缘涂层上提供迹线，并且可以用来将位于发光区域上的LED连接到连接法兰上的焊盘。 连接凸缘可以从基座偏移角度和/或位置，并且可以构造成提供适合以极化方式与连接器配合的接触形状。 底座可以成形以提供所需的功能。

公开(公告)号：EP3010316A1

公开(公告)日：2016-04-20

申请号：EP15153847.7

申请日：2015-02-04

Applicant: Nokia Technologies OY

Inventor： Robinson, Adam ,  Cotton, Darryl Paul James ,  Andrew, Piers ,  Ryhanen, Tapani

IPC: H05K1/02

CPC classification number: B81B7/0054 ,  B81B2201/0278 ,  B81B2201/0292 ,  H05K1/0283 ,  H05K1/167 ,  H05K2201/09018 ,  H05K2201/09109 ,  H05K2201/09263 ,  H05K2201/10151

Abstract: An apparatus and method wherein the method comprises: a deformable substrate; a curved support structure configured to support at least a portion of a resistive sensor wherein the resistive sensor comprises a first electrode, a second electrode and a resistive sensor material provided between the electrodes; at least one support configured to space the curved support structure from the deformable substrate so that when the deformable substrate is deformed the curved support structure is not deformed in the same way; wherein the resistive sensor is positioned on the curved support structure so as to limit deformation of the resistive sensor when the deformable substrate is deformed.

Abstract translation: 一种设备和方法，其中该方法包括：可变形基板; 弯曲支撑结构，其被配置为支撑电阻传感器的至少一部分，其中所述电阻传感器包括第一电极，第二电极和设置在所述电极之间的电阻传感器材料; 至少一个支撑件，所述至少一个支撑件被构造成将所述弯曲支撑结构与所述可变形基板隔开，使得当所述可变形基板变形时，所述弯曲支撑结构不以相同方式变形; 其中所述电阻传感器定位在所述弯曲支撑结构上，以便当所述可变形衬底变形时限制所述电阻传感器的变形。

公开(公告)号：EP2273181A3

公开(公告)日：2011-05-11

申请号：EP10168269.8

申请日：2010-07-02

Applicant: Siteco Beleuchtungstechnik GmbH

Inventor： Metzeroth, Stefan ,  Meyer, Clemens ,  Härtl, Michael

IPC: F21K99/00 ,  H05K1/05

CPC classification number: H05K1/053 ,  F21V3/00 ,  F21V29/70 ,  F21W2131/10 ,  F21W2131/103 ,  F21W2131/107 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/0284 ,  H05K3/14 ,  H05K3/246 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09018 ,  H05K2201/10106

Abstract: Die Erfindung betrifft ein LED-Trägerelement (1), das Folgendes umfasst: einen metallischen Kern, der auf zumindest einem Teilbereich seiner Oberfläche (21) eine Oxidkeramikschicht (22) aufweist, wobei die Oxidkeramikschicht (22) eine Porosität aufweist, welche von der Grenzfläche zum metallischen Kern (2) zur Oberfläche (21) des Trägerelements hin zunimmt, wenigstens eine Leiterbahn (3), die auf einem Teilbereich auf der von dem metallischen Kern (2) abgewandten Seite der Oxidkeramikschicht (22) angeordnet ist, und wenigstens eine LED (5), die in elektrischem Kontakt mit der Leiterbahn (3) steht.

Abstract translation: 元件（1）在上表面（21）的子区域上具有包含氧化物陶瓷层（22）的金属芯（2）。 氧化物陶瓷层是多孔的，并且导体路径在氧化物陶瓷层的一侧对准并且远离金属芯。 LED保持与导体路径接触，并且氧化物陶瓷层具有约5至400微米的厚度，其中元件在子区域中形成外表面。 氧化物陶瓷层在朝向金属芯的一侧限定非层上表面拓扑。 还包括用于制造LED用载体元件的方法的独立权利要求。

公开(公告)号：EP2191536A1

公开(公告)日：2010-06-02

申请号：EP08803782.5

申请日：2008-09-05

Applicant: Valeo Securité Habitacle

Inventor： DE POMMERY, Alain ,  ETTER, Stephane ,  AUBRY, Anthony

IPC: H01Q1/32 ,  H01Q1/40 ,  E05B49/00

CPC classification number: H01Q1/3241 ,  E05B77/34 ,  E05B81/77 ,  E05B81/78 ,  H01Q1/405 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/09018 ,  H05K2201/10151

Abstract: The invention relates to a method of manufacturing a sealed approach sensor (1), intended to be mounted in the handle of a motor vehicle opening leaf, characterized in that it comprises the following steps: the electrical components of the sensor are placed on a flexible printed circuit (3); said printed circuit (3) is placed on edge on a first longitudinal edge in a curved mould; and a resin is cast under gravity onto the second longitudinal edge so as to encapsulate said sensor in order to seal it.

公开(公告)号：EP2008021B1

公开(公告)日：2009-12-30

申请号：EP07719540.2

申请日：2007-04-16

Applicant: Intier Automotive Inc.

Inventor： DIXON, Mark E.

IPC: F21V99/00 ,  B60Q3/00 ,  F21V23/00 ,  F21V29/00 ,  F21V7/10 ,  H01R12/02 ,  H05K1/02 ,  H05K3/00

CPC classification number: H01R33/08 ,  F21K9/00 ,  F21V23/005 ,  F21V23/06 ,  F21Y2115/10 ,  H01R33/0827 ,  H01R33/0845 ,  H01R33/0863 ,  H01R33/945 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/056 ,  H05K1/118 ,  H05K3/326 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/302

Abstract: An illuminator (10) includes a circuit board (12) having a planar board portion (44) and a board portion non-planar to said planar board portion (44). The board portion non-planar to said planar board portion (44) defines one of a board interface (14) and a reflector (50). A method for manufacturing an illuminator (10) is also disclosed.

Abstract translation: 照明器（10）包括具有平面板部分（44）和与所述平面板部分（44）非平面的板部分的电路板（12）。 与所述平面板部分（44）不平面的板部分限定板接口（14）和反射器（50）中的一个。 还公开了一种制造照明器（10）的方法。

公开(公告)号：EP1852002A1

公开(公告)日：2007-11-07

申请号：EP06709341.9

申请日：2006-02-20

Applicant: ASTRIUM SAS

Inventor： DESAGULIER, Christian ,  LACOMBE, Alain ,  ESMILLER, Bruno

IPC: H05K3/06 ,  H01Q15/16

CPC classification number: H05K3/061 ,  H01Q15/141 ,  H05K1/0284 ,  H05K3/0032 ,  H05K3/0082 ,  H05K2201/09018 ,  H05K2203/107 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: The invention concerns a method for producing electrically conductive patterns on a non-developable surface of an insulating substrate, and the resulting device. The invention is characterized in that it consists in: coating the non-developable surface (6) uniformly with a layer of electrically conductive material (9), which is in turn coated with a layer of protective material (10), and then, using a mobile laser head, eliminating by laser ablation the portions of said protective substance layer (10) which do not cover said electrically conductive patterns, then eliminating the portions of said electrically conductive material (9) exposed by the elimination of said portions of said protective material layer (10)

公开(公告)号：EP0875928B1

公开(公告)日：2006-05-31

申请号：EP98104745.9

申请日：1998-03-17

Applicant: Infineon Technologies AG

Inventor： Tobben, Dirk ,  Spuler, Bruno ,  Gutsche, Martin ,  Weigand, Peter

IPC: H01L21/768 ,  H01L21/3213

CPC classification number: H05K3/061 ,  H01L21/32139 ,  H01L21/76838 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/0585

公开(公告)号：EP1075782B1

公开(公告)日：2005-03-30

申请号：EP99947066.9

申请日：1999-04-27

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： HOLMBERG, Per ,  ERIKSSON, Lars

IPC: H05K9/00 ,  G12B17/02

CPC classification number: H05K9/0092 ,  H05K1/0284 ,  H05K1/095 ,  H05K3/12 ,  H05K3/1275 ,  H05K2201/09018 ,  H05K2201/09045 ,  H05K2201/0999 ,  H05K2203/0534

Abstract: The invention relates to an electrically conductive unit (1) extending by means of electrically conductive paths (10, 29), which are directly or indirectly applied onto a case (2), for creating a screening against electromagnetic radiation and/or for the draining of electrical currents.

Abstract translation: 本发明涉及一种通过直接或间接施加到壳体（2）上的导电路径（10,29）延伸的导电单元（1），用于产生屏蔽电磁辐射和/或排水 的电流。

公开(公告)号：EP1345480A2

公开(公告)日：2003-09-17

申请号：EP03005365.6

申请日：2003-03-12

Applicant: Dowa Mining Co., Ltd.

Inventor： Kitamura, Yukihiro ,  Takahashi, Takayuki ,  Ohta, Mitsuru ,  Ogawa, Yuji

IPC: H05K1/02 ,  H01L23/15

CPC classification number: H05K1/0271 ,  C04B37/021 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/64 ,  C04B2237/704 ,  C04B2237/706 ,  H01L23/15 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2201/09018 ,  H01L2924/00

Abstract: In a ceramic circuit board having a ceramic substrate and a metal circuit plate bonded to one surface of the ceramic substrate, assuming that the warpage of the ceramic circuit board is a difference in height between the center and edge of the metal circuit plate and is positive (+) when the circuit board warps so as to be concave on the side of the metal circuit plate, the warpage of the ceramic circuit board is in the range of from -0.1 mm to +0.3 mm when the ceramic circuit board is heated to 350 °C, and in the range of from +0.05 mm to +0.6 mm when the temperature of the ceramic circuit board is returned to a room temperature after the ceramic circuit board is heated to 350 °C. The initial warpage of the ceramic circuit board is in the range of from +0.05 mm to +0.6 mm.

Abstract translation: 在具有陶瓷基板（12）的陶瓷电路基板（10）和与陶瓷基板（12）的一个面接合的金属电路板（14）的情况下，假定陶瓷电路基板（10）的翘曲差 在金属电路板（14）的中心和边缘之间的高度为正（+），并且当电路板翘曲以在金属电路板（14）侧凹陷时，陶瓷电路板的翘曲 当陶瓷电路板（10）被加热至350℃时，在陶瓷电路板（10）的范围为-0.0mm至+0.6mm的范围内，当陶瓷电路板（10）的温度为+ 0.05mm至+ 在将陶瓷电路板（10）加热至350℃之后，电路板（10）返回到室温。陶瓷电路板（10）的初始翘曲范围为+ 0.05mm至+0.6mm 。