-
1.发明授权
公开(公告)号：EP0809862B1
公开(公告)日：1999-11-24
申请号：EP96901290.5
申请日：1996-01-17
发明人： BHATT, Ashwinkumar, Chinuprasad , DESAI, Subahu, Dhirubhai , DUFFY, Thomas, Patrick , KNIGHT, Jeffrey, Alan
IPC分类号： H01L23/498
CPC分类号： H05K1/021 , H01L23/145 , H01L23/3677 , H01L23/49822 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H05K1/182 , H05K3/0061 , H05K2201/09127 , H05K2201/09981 , H05K2203/049 , Y10T29/4913 , Y10T29/49155 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A chip carrier (10) for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer (110), having plated photo-vias (120), to electrically interconnect two (or more) layers (80, 130) of fan-out circuitry. This chip carrier further employs a single-tiered cavity (140) to contain a chip (150), rather than a multi-tiered cavity,as is conventional. Moreover, this chip carrier includes thermal via holes (170) and/or a metallic layer (230), directly beneath the chip (150), to enhance heat dissipation.
摘要翻译： 公开了一种用于引线键合型芯片的芯片载体。 这种芯片载体采用有机电介质材料，而不是常规的陶瓷材料。 该芯片载体还采用至少一个具有电镀光通孔的有机光可成像介质层，以电连接两个（或多个）扇出电路层。 该芯片载体还采用单层空腔来容纳芯片而不是多层空腔，如常规的那样。 此外，该芯片载体包括直接在芯片下方的热通孔和/或金属层，以增强散热。
-
公开(公告)号：EP2596526A2
公开(公告)日：2013-05-29
申请号：EP11810162.5
申请日：2011-07-12
IPC分类号： H01L21/768 , H01L21/3205 , H01L21/28 , H01L23/48
CPC分类号： H01L21/76898 , H01L21/568 , H01L21/6835 , H01L23/3171 , H01L23/481 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/93 , H01L24/94 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2224/03002 , H01L2224/0401 , H01L2224/0557 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/06181 , H01L2224/11002 , H01L2224/11334 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/81801 , H01L2224/93 , H01L2224/94 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/10253 , H01L2924/12044 , H01L2924/15788 , H01L2924/014 , H01L2224/81 , H01L2224/03 , H01L2224/11 , H01L2924/00 , H01L2224/05552
摘要： A through-substrate via (TSV) structure that is immune to metal contamination due to a backside planarization process is provided. After forming a through-substrate via (TSV) trench, a diffusion barrier liner is conformally deposited on the sidewalls of the TSV trench. A dielectric liner is formed by depositing a dielectric material on vertical portions of the diffusion barrier liner. A metallic conductive via structure is formed by subsequently filling the TSV trench. Horizontal portions of the diffusion barrier liner are removed. The diffusion barrier liner protects the semiconductor material of the substrate during the backside planarization by blocking residual metallic material originating from the metallic conductive via structure from entering into the semiconductor material of the substrate, thereby protecting the semiconductor devices within the substrate from metallic contamination.
-
公开(公告)号：EP0809862A2
公开(公告)日：1997-12-03
申请号：EP96901290.0
申请日：1996-01-17
发明人： BHATT, Ashwinkumar, Chinuprasad , DESAI, Subahu, Dhirubhai , DUFFY, Thomas, Patrick , KNIGHT, Jeffrey, Alan
CPC分类号： H05K1/021 , H01L23/145 , H01L23/3677 , H01L23/49822 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H05K1/182 , H05K3/0061 , H05K2201/09127 , H05K2201/09981 , H05K2203/049 , Y10T29/4913 , Y10T29/49155 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： A chip carrier (10) for wire bond-type chips is disclosed. This chip carrier employs organic dielectric materials, rather than ceramic materials, as is conventional. This chip carrier also employs at least one organic, photoimageable dielectric layer (110), having plated photo-vias (120), to electrically interconnect two (or more) layers (80, 130) of fan-out circuitry. This chip carrier further employs a single-tiered cavity (140) to contain a chip (150), rather than a multi-tiered cavity,as is conventional. Moreover, this chip carrier includes thermal via holes (170) and/or a metallic layer (230), directly beneath the chip (150), to enhance heat dissipation.
-
公开(公告)号：EP3984051B1
公开(公告)日：2024-10-23
申请号：EP20731823.9
申请日：2020-06-04
-
公开(公告)号：EP4441601A1
公开(公告)日：2024-10-09
申请号：EP22813607.3
申请日：2022-11-09
CPC分类号： G06F2221/214320130101 , G06F21/71 , G06F21/53 , G06F21/52 , G06F9/5027 , G06F9/4881 , G06F21/74
-
公开(公告)号：EP4352791B1
公开(公告)日：2024-10-09
申请号：EP22734879.4
申请日：2022-06-07
IPC分类号： H10B63/00 , H01L29/812
CPC分类号： H01L29/8122 , H01L29/8126 , H01L29/66848 , H10B63/34 , H10B63/10
-
公开(公告)号：EP4437584A1
公开(公告)日：2024-10-02
申请号：EP22809832.3
申请日：2022-10-28
IPC分类号： H01L21/74 , H01L23/528 , H01L21/768 , H01L21/8238 , H01L27/092 , H01L29/66
CPC分类号： H01L23/5286 , H01L21/743 , H01L21/76895 , H01L21/823814 , H01L21/823821 , H01L21/823871 , H01L27/0924 , H01L29/66545 , H01L21/76897 , H01L21/76831 , H01L23/535
-
公开(公告)号：EP4437535A1
公开(公告)日：2024-10-02
申请号：EP22817987.5
申请日：2022-11-15
CPC分类号： G10L25/66 , G06N3/09 , G06N3/0455 , G06N3/084 , G06N3/094 , G06N3/096 , G06N3/0464
-
公开(公告)号：EP4437527A1
公开(公告)日：2024-10-02
申请号：EP22822099.2
申请日：2022-11-25
CPC分类号： G08G1/0175 , G08G1/04 , G08G1/054 , G08G1/0116 , H04L9/3247 , H04L9/50 , H04L9/3297 , G06V20/625 , G06V20/54 , G06V30/10
-
公开(公告)号：EP4434080A2
公开(公告)日：2024-09-25
申请号：EP22817263.1
申请日：2022-11-14
发明人： FAROOQ, Mukta , KELLY, James
IPC分类号： H01L21/60 , H01L25/065 , H01L25/18 , H01L23/498 , H01L23/48 , H01L23/00 , H01L25/00
CPC分类号： H01L2224/3222520130101 , H01L2224/8300520130101 , H01L24/96 , H01L2924/1816220130101 , H01L2924/181620130101 , H01L2224/1210520130101 , H01L2224/7320120130101 , H01L2224/921220130101 , H01L2224/1622720130101 , H01L25/0655 , H01L25/0652 , H01L25/50 , H01L2225/0651720130101 , H01L2225/0657220130101 , H01L2225/0658620130101 , H01L25/18 , H01L23/49827 , H01L2224/9520130101 , H01L2224/0410520130101 , H01L24/73 , H01L2924/1531120130101 , H01L2924/1519220130101 , H01L2224/2413720130101 , H01L24/92 , H01L2924/1515320130101 , H01L2224/7326720130101 , H01L2224/9224420130101 , H01L2224/920220130101 , H01L24/82 , H01L2224/7321720130101 , H01L2224/8389620130101 , H01L2224/9214420130101 , H01L24/24 , H01L23/481 , H01L2224/21420130101
-
-
-
-
-
-
-
-
-
搜索结果
33599 条记录 (耗时 0.034 秒)
