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141.发明专利
公开(公告)号：JP2009295378A
公开(公告)日：2009-12-17
申请号：JP2008146780
申请日：2008-06-04
Inventor： SHIMIZU KEISUKE
CPC classification number: H05K1/02 , B82Y10/00 , H05K1/097 , H05K2201/0108 , H05K2201/026 , H05K2201/0323
Abstract: PROBLEM TO BE SOLVED: To provide a light transmissive conductor which is constituted of a conductive material composed of a carbon nano linear structural body such as carbon nano tube, and for manifestation without damaging its light transmissivity and electric conductivity, its manufacturing method easy to scale up, a static elimination sheet using it, and an electronic device. SOLUTION: By immersing a light transmissive support body 3 into a dispersion liquid of carbon nano tube (CNT), making CNT adsorbed on its surface, evaporating a solvent after washing, and fixing the adsorbed CNT, the directly bonded conductive material 2 to the light transmissive support body 3 is formed. Since the conductive body 2 is formed only by carbon nano tube 1 and the carbon nano tube 1 is two-dimensionally integrated while contacting together at its one part, it is high in light transmissivity. Moreover, mutually contacting carbon nano tubes 1 are high in conductivity since they are directly bonded. It is better to carry out a treatment of improving affinity against the CNT on a surface of the support body 3 in advance. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 解决的问题：为了提供由碳纳米管等碳纳米线性结构体构成的导电性材料构成的透光导体，并且为了表现而不损害其透光率和导电性，其制造方法 易于放大，使用它的静电消除片和电子装置。 解决方案：通过将透光性支撑体3浸渍在碳纳米管（CNT）的分散液中，使CNT吸附在其表面上，在洗涤后蒸发溶剂，并固定吸附的CNT，直接接合的导电材料2 形成有透光性的支承体3。 由于导电体2仅由碳纳米管1形成，并且碳纳米管1在其一部分接触的同时被二维集成，因此透光性高。 此外，相互接触的碳纳米管1由于直接粘合而导电性高。 预先进行在支撑体3的表面上提高对CNT的亲和性的处理是更好的。 版权所有（C）2010，JPO＆INPIT
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142.发明专利
公开(公告)号：JP2009532694A
公开(公告)日：2009-09-10
申请号：JP2009503730
申请日：2007-02-05
Applicant: スタンプテスト リミティッド
Inventor： ラアナン ノヴィック , ナタン ムスカル
CPC classification number: G09F3/0291 , G09F3/10 , H05K1/0269 , H05K2201/0108 , H05K2201/10151 , H05K2203/161
Abstract: 本発明は、外部表面と内部表面とを有する透明層と、透明層の内部表面に取り付けられており、有害物質の存在を可視的に検知するための指示薬／試薬を有するインジケーター層と、透明層の内部表面、及び／又は、インジケーター層に塗着された、ステッカーを部品に貼着するための接着剤と、から成る、部品に存在する有害物質を検知するためのステッカーに関する。
【選択図】図１-
公开(公告)号：JP4329817B2
公开(公告)日：2009-09-09
申请号：JP2006550697
申请日：2005-12-20
Applicant: 旭硝子株式会社
CPC classification number: H01J11/12 , H01J9/20 , H01J2211/442 , H05K3/0082 , H05K3/048 , H05K2201/0108 , H05K2203/0551
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公开(公告)号：JP2009182229A
公开(公告)日：2009-08-13
申请号：JP2008021274
申请日：2008-01-31
Applicant: Nitto Denko Corp , 日東電工株式会社
Inventor： ISHIMARU YASUTO , EBE HIROSHI
CPC classification number: H05K3/303 , H01L23/3735 , H01L2224/16225 , H05K1/0203 , H05K1/0269 , H05K1/189 , H05K2201/0108 , H05K2201/09318 , H05K2201/0969 , H05K2201/09781 , H05K2201/10674 , H05K2203/166 , Y02P70/613 , Y10T29/49162
Abstract: PROBLEM TO BE SOLVED: To provide a wiring circuit board which improves heat dissipation and can easily recognize dislocation of an electronic component, and to provide a method of manufacturing the wiring circuit board. SOLUTION: A rectangular mounting region S is arranged in an almost center of one face of an insulating layer 1. A plurality of conductor patterns 2 are formed so that they extend from an inner side to an external side of the mounting region S. A cover insulating layer 4 is formed to cover a plurality of the conductor patterns 2 at a periphery of the mounting region S. The electronic component 5 is mounted on the insulating layer 1 so that it is overlapped with the mounting region S. A metal layer 3 is arranged on the other face of the insulating layer 1. Rectangular openings 3a to 3f are formed on the metal layer 3 so that they follow a pair of long sides and a pair of short sides of the mounting region S. The openings 3a to 3f face part of a terminal part 21 of each conductor pattern 2 across the insulating layer 1. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供一种改善散热并且容易识别电子部件的位错的布线电路板，并提供一种制造布线电路板的方法。 解决方案：矩形安装区域S布置在绝缘层1的一个面的几乎中心。多个导体图案2形成为从安装区域S的内侧延伸到外侧 覆盖绝缘层4形成为在安装区域S的周围覆盖多个导体图案2.电子部件5安装在绝缘层1上，使其与安装区域S重叠。金属 层3布置在绝缘层1的另一面上。矩形开口3a至3f形成在金属层3上，使得它们跟随安装区域S的一对长边和一对短边。开口3a 到3f面对绝缘层1上每个导体图案2的端子部分21的一部分。版权所有：（C）2009，JPO＆INPIT
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145.发明专利Template for forming solder bump, method of manufacturing the template, and method of inspecting solder bump by using the template 审中-公开形成焊膏的模板，制造模板的方法和使用模板检查焊接块的方法
公开(公告)号：JP2009164549A
公开(公告)日：2009-07-23
申请号：JP2008101261
申请日：2008-04-09
Applicant: Secron Co Ltd , セクロン カンパニー,リミテッド
Inventor： PARK PIL-GYU
CPC classification number: H05K3/3478 , H01L21/6835 , H01L2224/11003 , H01L2224/16 , H01L2924/01078 , H05K1/0269 , H05K2201/0108 , H05K2203/0113 , H05K2203/0338 , H05K2203/163
Abstract: PROBLEM TO BE SOLVED: To provide a template for forming solder bumps, a method of manufacturing the template, and to provide a method of inspecting the solder bumps by using the template.
SOLUTION: The template 20 for forming the solder bumps can include a transparent substrate 22 on which a plurality of cavities 22a are formed at an upper surface thereof, and a light-reflective film 24 and a protection film 26 formed on the lower surface of the transparent substrate 22. When a nozzle is brought into close contact with the template 20 to inject molten solder into the cavities 22a, damage to the template 20 may be prevented by the light-reflective film 24 and the protection film 26. Thereby, the lifetime of the template 20 may be sharply extended. An inspection step of solder bumps formed in the cavities 22a of the template 20 can be easily performed by analyzing light reflected by the light-reflective film 24.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供用于形成焊料凸块的模板，制造模板的方法，以及提供通过使用模板检查焊料凸块的方法。 解决方案：用于形成焊料凸块的模板20可以包括在其上表面上形成有多个空腔22a的透明基板22，以及形成在下侧的光反射膜24和保护膜26 透明基板22的表面。当喷嘴与模板20紧密接触以将熔融焊料注入到空腔22a中时，可以通过光反射膜24和保护膜26来防止模板20的损坏。由此， ，模板20的寿命可能会急剧延长。 通过分析由光反射膜24反射的光，可以容易地进行在模板20的空腔22a中形成的焊料凸点的检查步骤。（C）2009，JPO＆INPIT
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Patent Agency Ranking
公开(公告)号：JP2009154521A
公开(公告)日：2009-07-16
申请号：JP2008193580
申请日：2008-07-28
Applicant: Lg Electronics Inc , エルジー エレクトロニクス インコーポレイティド
Inventor： LEE SANG GON , KIM DAE SUNG , CHANG WOO HYUCK
IPC: B32B15/088 , B32B15/09 , H05K1/03 , H05K3/00
CPC classification number: H05K3/381 , H05K1/0269 , H05K1/0393 , H05K1/189 , H05K2201/0108 , H05K2201/10128 , Y10T428/24917 , Y10T428/2495 , Y10T428/31
Abstract: PROBLEM TO BE SOLVED: To provide a flexible film which has increased peel strength between a metal layer and an insulating film by modifying the surface of the insulating film to make its turbidity 2-25% and makes a circuit pattern formed on the flexible film be examined easily. SOLUTION: The flexible film includes the insulating film, a first metal layer formed on the insulating film, and a second metal layer formed on the first metal layer. The surface of the insulating film with the first metal layer formed is modified so as to make the turbidity of the insulating film 2-25%. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：为了提供一种柔性膜，其通过改变绝缘膜的表面而使金属层和绝缘膜之间的剥离强度增加，使其浊度为2-25％，并使电路图案形成在 柔性薄膜容易检查。 解决方案：柔性膜包括绝缘膜，形成在绝缘膜上的第一金属层和形成在第一金属层上的第二金属层。 形成有第一金属层的绝缘膜的表面被改性，使得绝缘膜的浊度为2-25％。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2009123408A
公开(公告)日：2009-06-04
申请号：JP2007293872
申请日：2007-11-13
Applicant: Seiren Co Ltd , セーレン株式会社
Inventor： HAYASHI HIROYUKI , GOTO MASATOSHI , OTSUKA RENTARO
CPC classification number: C23C18/31 , C23C18/1608 , C23C18/166 , C23C18/208 , C23C18/28 , H01J9/205 , H01J2211/446 , H01J2329/869 , H05K3/182 , H05K9/0094 , H05K9/0096 , H05K2201/0108 , H05K2203/0709 , H05K2203/1157
Abstract: PROBLEM TO BE SOLVED: To provide a method capable of inexpensively manufacturing a transparent conductive member superior in light transmissivity and electrical conductivity.
SOLUTION: By (a) carrying out a pattern printing with ink containing a reducing agent on a transparent base material, and forming a reducing agent containing pattern layer, next (b) coating a metal ion solution containing metal ions capable of forming an electroless plating catalyst by the reduction on the reducing agent containing layer and forming an electroless plating catalyst layer by reducing the metal ions by contact of the reducing agent and the metal ion, and afterwards (c) forming a conductive metal layer by plating processing on the electroless plating catalyst layer, the transparent and electrically conductive member is manufactured.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 解决的问题：提供一种能够廉价地制造透光性和导电性优异的透明导电性构件的方法。 （a）通过（a）在透明基材上进行含有还原剂的油墨的图案印刷，并形成含有图案层的还原剂，接下来（b）涂覆含有能够形成的金属离子的金属离子溶液 化学镀催化剂，通过还原剂还原层形成化学镀催化剂层，通过还原剂与金属离子的接触还原金属离子，然后（c）通过电镀处理形成导电金属层 制造无电镀催化剂层，透明导电构件。 版权所有（C）2009，JPO＆INPIT
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148.发明专利Anisotropic conductive connector positioning method, positioning method for anisotropic conductive connector and inspection circuit board, anisotropic conductive connector, and probe card 审中-公开各向异性导电连接器定位方法，用于各向异性导电连接器和检查电路板的定位方法，各向异性导电连接器和探针卡
公开(公告)号：JP2009019974A
公开(公告)日：2009-01-29
申请号：JP2007182357
申请日：2007-07-11
Applicant: Jsr Corp , Jsr株式会社 , Tokyo Electron Ltd , 東京エレクトロン株式会社
Inventor： YOSHIOKA MUTSUHIKO , MATSUURA AKIRA , NAOI MASAYA , AMAMIYA TAKASHI , TSUKADA SHUICHI , HOSHINO TOMOHISA
CPC classification number: G01R31/2891 , G01R1/07342 , G01R31/2808 , H05K1/0269 , H05K3/303 , H05K2201/0108 , H05K2201/09918 , H05K2201/10378 , H05K2203/166 , Y02P70/613
Abstract: PROBLEM TO BE SOLVED: To provide a positioning method which can perform positioning of components of a three-layered rectangular-frame-shaped anisotropic conductive connector surely and easily. SOLUTION: The three-layered anisotropic conductive sheet for inspecting the electric characteristics of an object under inspection is composed of a first anisotropic conductive sheet 18, a central substrate 16, and a second anisotropic conductive sheet 20. The central substrate 16 is provided with markings 76, 77 and through holes 74, 75. The first anisotropic conductive sheet and the second anisotropic conductive sheet are provided with semitransparent protrusions 71, 72, 49, 78 and through holes 70, 80, respectively. The markings are identified by detecting means 81, 83 provided on the first anisotropic conductive sheet side and detecting means provided on the second anisotropic conductive sheet side through the semitransparent protrusions to position the semitransparent protrusions 71, 49 with respect to the markings 76, 77, thereby performing positioning of the first anisotropic conductive sheet, the central substrate, and the second anisotropic conductive sheet. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供一种可以确实且容易地进行三层矩形框状的各向异性导电连接器的部件的定位的定位方法。 解决方案：用于检查被检查物体的电特性的三层各向异性导电片由第一各向异性导电片18，中心基板16和第二各向异性导电片20构成。中心基板16为 设置有标记76,77和通孔74,75.第一各向异性导电片和第二各向异性导电片分别设置有半透明突起71,72,49,78和通孔70,80。 通过设置在第一各向异性导电片侧的检测装置81,83和通过半透明突起设置在第二各向异性导电片侧的检测装置来标识标记，以相对于标记76,77定位半透明突起71,49， 从而进行第一各向异性导电片，中央基板和第二各向异性导电片的定位。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2008546165A
公开(公告)日：2008-12-18
申请号：JP2008515964
申请日：2006-06-09
Applicant: シーマ ナノ テック イスラエル リミティド
Inventor： ガーバー，アーカディー , ラ ベガ，フェルナンド デ , ブロッド，ジョン , ロットマン，クラウディオ
CPC classification number: C25D5/022 , B22F2998/00 , B22F2998/10 , C08K3/08 , C09D5/24 , C09D7/61 , C09D7/67 , C09D11/52 , C23C24/106 , C23C28/023 , C25D3/12 , C25D3/38 , C25D5/00 , C25D7/00 , H01B1/22 , H05K1/097 , H05K3/246 , H05K2201/0108 , H05K2203/1581 , B22F1/0018 , B22F1/0059 , B22F3/22
Abstract: Transparent conductive coated devices (films, three dimensional objects and others) produced through coating with a nano metal containing emulsion which forms a conductive pattern with enhanced electrical, optical and other properties.
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公开(公告)号：JPWO2006112286A1
公开(公告)日：2008-12-11
申请号：JP2007521190
申请日：2006-04-10
Applicant: 三菱瓦斯化学株式会社
CPC classification number: B29C55/04 , B29C41/28 , B29C55/005 , B29K2079/08 , C08G73/10 , C08G73/1028 , C08J5/18 , C08J2379/08 , H05K1/0346 , H05K3/0011 , H05K2201/0108 , H05K2201/0154 , H05K2203/0271
Abstract: 本発明は、下記式(1)で表される繰り返し単位を有するポリイミドからなるポリイミドフィルムの製造方法であって、有機溶媒の含有量が0.5重量%以上30重量%未満である未延伸ポリイミドフィルムを、温度150℃〜380℃で1.2〜4.0倍に延伸する、無色透明で、耐熱性に優れ、寸法変化の小さいポリイミドフィルムの製造方法である。【化1】(式中、Rはシクロヘキサンから誘導される4価の基であり、Φは合計の炭素数が2〜39の2価の脂肪族、脂環族、芳香族またはこれらの組み合わせからなる基であって、結合基として−O−、−SO2−、−CO−、−CH2−、−C(CH3)2−、−OSi(CH3)2−、−C2H4O−および−S−からなる群から選ばれる1種以上を有していてもよい。)
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