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    Method for manufacturing device mounting structure
    35.
    发明专利
    Method for manufacturing device mounting structure 有权
    制造装置安装结构的方法

    公开(公告)号：JP2012178611A

    公开(公告)日：2012-09-13

    申请号：JP2012129375

    申请日：2012-06-06

    Applicant: Fujikura Ltd ,  株式会社フジクラ

    Inventor： YAMAMOTO SATOSHI ,  HIRANO HIROYUKI ,  SUZUKI TAKANAO

    IPC: H05K3/42 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/40

    CPC classification number: H01L21/486 ,  H01L23/3107 ,  H01L23/49827 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/09701 ,  H01L2924/1461 ,  H05K1/113 ,  H05K3/101 ,  H05K2201/09263 ,  H05K2201/09836 ,  H05K2201/10545 ,  Y10T29/49165 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a device mounting structure that can manufacture a structure for mounting two devices having different electrode arrangements with their electrodes electrically connected to each other with high location accuracy.SOLUTION: A method comprises: a process A1 for forming a plurality of reformed portions on a substrate, each of which has one end that individually exposes with high accuracy at each of a plurality of locations opposed to a plurality of electrodes constituting a first device at one main surface side of the substrate, and the other end that individually exposes with high accuracy at each of a plurality of locations opposed to a plurality of electrodes constituting a second device at the other main surface side of the substrate, a process A2 for forming a through hole in a region where the reformed portion is formed; a process A3 for charging or depositing a conductor in the through hole to form feedthrough wiring; and a process A4 for aligning and bonding the electrode of the first device from the one main surface side of the substrate to the one end of the feedthrough wiring, and aligning and bonding the electrode of the second device from the other main surface side of the substrate to the other end of the feedthrough wiring.

    Abstract translation: 要解决的问题：提供一种可以制造用于安装具有不同电极布置的两个装置的结构的装置安装结构的方法，其电极以高定位精度彼此电连接。 解决方案：一种方法包括：用于在基板上形成多个重整部分的工艺A1，其中每一个具有在与构成多个电极的多个电极相对的多个位置的每个位置处以高精度独立暴露的一端 第一器件在衬底的一个主表面侧，另一端在衬底的另一个主表面侧的与组成第二器件的多个电极相对的多个位置的每个位置处以高精度单独暴露， A2，用于在形成重整部分的区域中形成通孔; 用于在通孔中充电或沉积导体以形成馈通布线的工艺A3; 以及将第一器件的电极从衬底的一个主表面侧与馈通布线的一端对准和接合的工序A4，将第二器件的电极与第二器件的另一个主面侧对准 基板到馈通布线的另一端。 版权所有（C）2012，JPO＆INPIT

    Through wiring board and method of manufacturing the same
    37.
    发明专利
    Through wiring board and method of manufacturing the same 有权
    通过接线板及其制造方法

    公开(公告)号：JP2011134982A

    公开(公告)日：2011-07-07

    申请号：JP2009294989

    申请日：2009-12-25

    Applicant: Fujikura Ltd ,  株式会社フジクラ

    Inventor： YAMAMOTO SATOSHI ,  SUZUKI TAKANAO ,  MATSUYAMA MASAMI

    IPC: H05K1/11 ,  H01L23/12 ,  H05K3/40

    CPC classification number: H05K3/0029 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a through wiring board where through wiring which does not have a void causing a defect in a conductor filling a through hole is arranged, and a method of manufacturing the through wiring board that suppresses formation of the void when the through hole or a non-through hole is filled with the conductor. SOLUTION: The through wiring board 10 includes the through wiring 6 formed by arranging the through hole 4 connecting one principal surface 2 and the other principal surface 3 constituting a flat plate type substrate 1 and filling the through hole 4 with the conductor 5, and is characterized in that the through hole 4 is in a trapezoidal shape including inner side faces of the through hole 4 as lateral sides 4p and 4q when viewed in a longitudinal plane of the substrate 1, and the two lateral sides 4p and 4q of the trapezoid are not parallel with each other, and inclined to the same size to two perpendiculars T 1 and T 2 drawn from two vertexes forming the upper side or the lower side of the trapezoid to a straight line containing opposite sides. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种通过布线基板，其中布置有不导致填充通孔的导体缺陷的空隙的布线，以及制造通孔布线板的方法， 当通孔或非通孔填充导体时，空隙。 解决方案：贯通布线板10包括通过布置连接一个主表面2的通孔4和构成平板型基板1的另一个主表面3并且将通孔4与导体5填充而形成的贯通布线6 其特征在于，当从基板1的纵向平面观察时，通孔4为包括作为侧面4p和4q的通孔4的内侧面的梯形形状，并且两个侧面4p和4q 梯形不彼此平行，并且从形成上侧或下侧的两个顶点绘制的两个垂直线T 1 和T 2 倾斜到相同的尺寸 梯形到包含相对侧的直线。 版权所有（C）2011，JPO＆INPIT

    Printed wiring board and its manufacturing method
    40.
    发明专利
    Printed wiring board and its manufacturing method 有权
    印刷线路板及其制造方法

    公开(公告)号：JP2007227512A

    公开(公告)日：2007-09-06

    申请号：JP2006044968

    申请日：2006-02-22

    Applicant: Ibiden Co Ltd ,  イビデン株式会社

    Inventor： IKEDA DAISUKE

    IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46

    CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

    Abstract: PROBLEM TO BE SOLVED: To provide a printed wiring board having a through-hole structure where a defect of a void and occurrence of crack are reduced, a connection failure of a substrate is reduced, and mechanical strength of the substrate is improved. SOLUTION: The printed wiring board has a through-hole obtained by filling an open hole arranged in an insulating resin substrate with plating. Positions of centroid shafts are shifted and arranged in the respective through-holes exposed from a surface and a rear face of the insulating resin substrate. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供一种具有通孔结构的印刷电路板，其中空隙的缺陷和裂纹的发生减少，基板的连接故障降低，并且提高了基板的机械强度 。 解决方案：印刷电路板具有通过电镀填充设置在绝缘树脂基板中的开孔而获得的通孔。 重心轴的位置移位并布置在从绝缘树脂基板的表面和后表面露出的相应的通孔中。 版权所有（C）2007，JPO＆INPIT

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