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    Flat wiring material and method of manufacturing the same
    35.
    发明专利
    Flat wiring material and method of manufacturing the same 审中-公开
    平面接线材料及其制造方法

    公开(公告)号：JP2014143079A

    公开(公告)日：2014-08-07

    申请号：JP2013010852

    申请日：2013-01-24

    Applicant: Hitachi Metals Ltd ,  日立金属株式会社

    Inventor： TANAKA KOTARO ,  HORIKOSHI TOSHIYUKI ,  SATO TAKUMI ,  MURAKAMI KENICHI

    IPC: H01B7/08 ,  H01B7/00 ,  H01B13/00 ,  H01R4/02

    CPC classification number: H05K1/187 ,  H05K1/118 ,  H05K3/328 ,  H05K3/34 ,  H05K2201/052 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/10651 ,  H05K2203/175 ,  Y10T29/49117

    Abstract: PROBLEM TO BE SOLVED: To provide a flat wiring material which is capable of suppressing an increase in thickness even when a circuit element is connected thereto and whose manufacturing process can be simplified, and to provide a method of manufacturing the same.SOLUTION: A flat wiring material 1 includes: a plurality of conductors 2 arranged at intervals on a plane; and one or more circuit elements 4 connected to one or more conductors 2 among the plurality of conductors 2. Each of the conductors 2 to which the circuit elements 4 are connected has electrically separated branch parts 22a and 22b. A body part 41 of each of the circuit elements 4 is arranged on the plane so as not to overlap with the conductors 2. A pair of terminals 42 led out from the body part 41 are electrically connected to the branch parts 22a and 22b.

    Abstract translation: 要解决的问题：提供即使当电路元件连接到其上也能够抑制厚度增加并且其制造工艺可以简化的扁平布线材料，并且提供其制造方法。解决方案：平面 布线材料1包括：在平面上间隔布置的多个导体2; 以及连接到多个导体2中的一个或多个导体2的一个或多个电路元件4.电路元件4连接到的每个导体2具有电分离的分支部分22a和22b。 每个电路元件4的主体部分41布置在平面上以不与导体2重叠。从主体部分41引出的一对端子42电连接到分支部分22a和22b。

    Dc-dc converter device
    37.
    发明专利
    Dc-dc converter device 有权
    直流 - 直流转换器

    公开(公告)号：JP2014039384A

    公开(公告)日：2014-02-27

    申请号：JP2012179892

    申请日：2012-08-14

    Applicant: Hitachi Automotive Systems Ltd ,  日立オートモティブシステムズ株式会社

    Inventor： SHINOHARA HIDENORI ,  GOTO AKIHIRO ,  SENDA TADAHIKO

    IPC: H02M3/28

    CPC classification number: H05K7/1432 ,  H01L23/4093 ,  H01L2924/0002 ,  H02M3/337 ,  H02M7/003 ,  H05K1/18 ,  H05K7/20927 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10651 ,  Y02B70/1433 ,  H01L2924/00

    Abstract: PROBLEM TO BE SOLVED: To provide a DC-DC converter device that allows achieving high output and downsizing even if a high-capacity capacitor element is mounted, and is excellent in vibration resistance and shock resistance.SOLUTION: A main transformer 104, a low-voltage circuit board 107, and a capacitor module 10 are housed in a case member 101. In a capacitor case 11, a smoothing capacitor element 12, a capacitor element 13 for a noise filter, and a resonant capacitor element 14 are housed. On an outer peripheral side wall of the capacitor case 11, a high-voltage circuit board 40 is attached with a state that is substantially vertically raised with respect to the bottom of the capacitor case 11, and the high-voltage circuit board 40 is provided over power semiconductor modules 35 and 36 and the capacitor case 11.

    Abstract translation: 要解决的问题：提供即使安装大容量电容器元件也能实现高输出和小型化的DC-DC转换器装置，并且具有优异的抗振动性和抗冲击性。解决方案：主变压器104，低 电压电路板107和电容器模块10容纳在壳体部件101中。在电容器壳体11中容纳有平滑电容器元件12，用于噪声滤波器的电容器元件13和谐振电容器元件14。 在电容器壳体11的外周侧壁上，高电压电路基板40以相对于电容器壳体11的底部大致上升的状态安装，高压电路基板40被设置 功率半导体模块35和36以及电容器壳体11。

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