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    Board connector
    7.
    发明专利
    Board connector 有权
    板连接器

    公开(公告)号：JP2012221836A

    公开(公告)日：2012-11-12

    申请号：JP2011088273

    申请日：2011-04-12

    Applicant: Sumitomo Wiring Syst Ltd ,  住友電装株式会社

    Inventor： AIHARA TETSUYA

    IPC: H01R12/71

    CPC classification number: H01R23/7063 ,  H01R12/707 ,  H05K3/3405

    Abstract: PROBLEM TO BE SOLVED: To provide a board connector, including a stationary member having good space efficiency, with high holding reliability.SOLUTION: A board connector 10 includes: a resin connector housing 20 having a mounted terminal fixture 80 electrically connectable to a conductive portion of a board 90; and a metal stationary member 60 for fixing the connector housing 20 to the board 90. The stationary member 60 includes a housing attachment 61 for attaching the stationary member 60 to a wall surface of the connector housing 20. Both end portions in forward and backward directions of the housing attachment 61 are held by the insertion thereof to a pair of attachment grooves 26 formed on the wall surface of the connector housing 20. On the housing attachment 61, a first rib 71 extending to the forward and backward directions is formed in a protruded manner, and also, a second rib 72, which extends to the forward and backward directions with a disposition to be held within a height range of the first rib 71 in a height direction orthogonal to the forward and backward directions, is formed in a protruded manner.

    Abstract translation: 要解决的问题：提供一种具有高空间效率的固定构件，具有高的保持可靠性的板连接器。 板连接器10包括：树脂连接器壳体20，其具有可连接到板90的导电部分的安装的端子固定件80; 以及用于将连接器壳体20固定到板90的金属固定构件60.固定构件60包括用于将固定构件60附接到连接器壳体20的壁表面的壳体附件61.两个端部沿前后方向 壳体附件61通过插入到形成在连接器壳体20的壁表面上的一对连接槽26而被保持。在壳体附件61上，沿着前后方向延伸的第一肋71形成为 在第一肋71的高度方向与前后方向正交的状态下，以向前后方向延伸的第二肋72形成在第一肋71的高度方向上。 突出的方式 版权所有（C）2013，JPO＆INPIT

    Module connection structure
    9.
    发明专利
    Module connection structure 有权
    模块连接结构

    公开(公告)号：JP2011082962A

    公开(公告)日：2011-04-21

    申请号：JP2010185568

    申请日：2010-08-20

    Applicant: Toshiba Corp ,  株式会社東芝

    Inventor： MOCHIZUKI AKIRA

    IPC: H01P1/04 ,  H01P3/08 ,  H01P5/02 ,  H01P5/08 ,  H01R13/658 ,  H03F3/60

    CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/3405 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10446

    Abstract: PROBLEM TO BE SOLVED: To provide a connection structure of a module for reducing impedance mismatching of a connection part of a micro-strip line in connecting a module to other modules, and for improving the transmission loss and reflection loss of a circuit, and for adjusting a module single body. SOLUTION: In a power amplification module 12, protrusions 111 and 112 protruding from a dielectric 120 and a micro-strip line 130 to a distribution module 11 and a synthetic module 16 side are formed at the connection side of the distribution module 11 and a synthetic module 16 of a base board 110, and a plurality of lands 151 to 15n for gain adjustment capable of adjusting the gains of the input/output of the modules are formed in the periphery of the micro-strip line 130. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：为了提供用于在将模块连接到其他模块时减少微带线的连接部分的阻抗失配的模块的连接结构，并且用于改善电路的传输损耗和反射损耗 ，并用于调整模块单体。 解决方案：在功率放大模块12中，在分配模块11的连接侧形成从电介质120和微带线130突出到分配模块11和合成模块16侧的突起111和112 并且在微带线130的周围形成有用于增益调整的基板110的合成模块16和用于调节模块的输入/输出的增益的多个焊盘151至15n。

    版权所有（C）2011，JPO＆INPIT

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