公开(公告)号：JP4846572B2

公开(公告)日：2011-12-28

申请号：JP2006514021

申请日：2005-05-26

Applicant: Jsr株式会社 ,  イビデン株式会社

Inventor： 俊樹 古谷 ,  伸一郎 岩永 ,  宏文 後藤 ,  隆 苅谷

IPC: H05K3/46 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K1/02 ,  H05K3/28 ,  H05K3/40

CPC classification number: H01L23/49822 ,  H01L23/49811 ,  H01L23/49816 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/115 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/068 ,  H05K2201/10674

Abstract: A multilayer printed wiring board is equipped with a core board 20, a build-up layer 30 formed on the core board 20 so as to have a conductor pattern 32 on the upper surface thereof, a low-elasticity layer 40 formed on the build-up layer 30, lands 52 that are provided on the upper surface of the low-elasticity layer 40 and connected to an IC chip 70 via solder bumps 66, and conductor posts 50 that penetrate through the low-elasticity layer 40 and electrically connect the lands 52 to the conductor pattern 32. The low-elasticity layer 40 is formed of resin composition containing epoxy resin, phenol resin, cross-linked rubber particles and a hardening catalyst.

公开(公告)号：JP4640051B2

公开(公告)日：2011-03-02

申请号：JP2005253765

申请日：2005-09-01

Applicant: Jsr株式会社

Inventor： 隆 千葉 ,  宏文 後藤 ,  裕一 橋口 ,  明夫 齋藤

IPC: G03F7/038 ,  G03F7/004 ,  G03F7/075 ,  H01L21/027

公开(公告)号：JP4640037B2

公开(公告)日：2011-03-02

申请号：JP2005240038

申请日：2005-08-22

Applicant: Jsr株式会社

Inventor： 淳史 伊藤 ,  伸一郎 岩永 ,  宏文 後藤 ,  健一 横山 ,  克巳 猪俣

IPC: G03F7/023 ,  G03F7/004

公开(公告)号：JP4265048B2

公开(公告)日：2009-05-20

申请号：JP28590499

申请日：1999-10-06

Applicant: Jsr株式会社

Inventor： 信幸 伊藤 ,  宏文 後藤

IPC: C09D5/44 ,  C09D201/00 ,  C09D7/12 ,  C25D3/00 ,  C25D15/02 ,  H01L23/498 ,  H01Q1/38 ,  H05K1/16

CPC classification number: H01L23/49894 ,  H01L2924/0002 ,  H01Q1/38 ,  H05K1/162 ,  H05K2201/0209 ,  H05K2203/135 ,  Y10T428/31721 ,  Y10T428/31765 ,  H01L2924/00

公开(公告)号：JP5531617B2

公开(公告)日：2014-06-25

申请号：JP2009547956

申请日：2008-11-12

Applicant: Jsr株式会社

Inventor： 淳史 伊藤 ,  隆一 奥田 ,  宏文 後藤

IPC: H01L21/60 ,  G03F7/004 ,  G03F7/038

CPC classification number: G03F7/038 ,  C08L61/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/1319 ,  H01L2224/1413 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/15788 ,  H01L2924/00

公开(公告)号：JP5471183B2

公开(公告)日：2014-04-16

申请号：JP2009201325

申请日：2009-09-01

Applicant: Jsr株式会社

Inventor： 隆 宮松 ,  宏文 後藤

IPC: C09J129/14 ,  C08F8/44 ,  C08F216/06 ,  C08F216/38 ,  C08F218/04 ,  C08F218/14 ,  C09J129/04 ,  C09J131/02 ,  C09J131/06

公开(公告)号：JP5444813B2

公开(公告)日：2014-03-19

申请号：JP2009104715

申请日：2009-04-23

Applicant: Jsr株式会社

Inventor： 文恵 近藤 ,  将寛 金子 ,  淳史 伊藤 ,  宏文 後藤

IPC: G03F7/038 ,  G03F7/004

公开(公告)号：JP5434232B2

公开(公告)日：2014-03-05

申请号：JP2009106049

申请日：2009-04-24

Applicant: Jsr株式会社

Inventor： 耕二 西川 ,  宏文 後藤 ,  秀俊 宮本

IPC: G01N33/545 ,  C08K5/36 ,  C08L33/24 ,  C08L101/02 ,  C12M1/00 ,  C12N15/09 ,  G01N33/53 ,  G01N37/00

Abstract: PROBLEM TO BE SOLVED: To provide a resin composition for manufacturing a biochip, forming a resin composition layer excellent in the diffusion controllability of an acid produced by exposure, and also to provide a method for manufacturing the biochip using the same. SOLUTION: The resin composition for manufacturing the biochip consists of: (A) a polymer having a nitrogen-containing group; (B) a compound being a component having action producing the acid by exposure and represented by [4-(2-tert-butoxy-2-oxoethoxy)naphthalene-1-yl]-dimethylsulfonium-perfluoromethane or [4-(2-tert-butoxy-2-oxoethoxy)anthracene-1-yl]-dimethylsulfonium-perfluoromethane; and (C) a solvent. COPYRIGHT: (C)2011,JPO&INPIT

公开(公告)号：JP5402805B2

公开(公告)日：2014-01-29

申请号：JP2010092628

申请日：2010-04-13

Applicant: Jsr株式会社

Inventor： 和雄 河口 ,  秀俊 宮本 ,  宏文 後藤

IPC: C23C18/08 ,  C23C18/14 ,  H01B1/20 ,  H01B13/00 ,  H05K3/10 ,  H05K3/26

公开(公告)号：JP5369420B2

公开(公告)日：2013-12-18

申请号：JP2007275306

申请日：2007-10-23

Applicant: Jsr株式会社

Inventor： 奈美 鬼丸 ,  淳史 伊藤 ,  宏文 後藤

IPC: C08L61/06 ,  C08K5/5415 ,  C08L25/04 ,  C09D5/25 ,  C09D7/12 ,  C09D125/04 ,  C09D161/06 ,  H01L21/312

Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for forming an electrical insulating film that can give a cured film excellent in resolution, electrical insulation, cohesiveness, adhesion, etc. SOLUTION: The photosensitive resin composition for forming an insulating film comprises (A) a resin containing a structural unit having a phenolic hydroxyl group, (B) at least one kind of the compounds selected from the compounds represented by formula (b1) and (b2), (C) a photosensitive acid generator, and (D) a solvent, wherein, (b1) is (R) n Si(OR 1 ) 4-n and (b2) is (R 2 )[R 3 Si(OR 1 ) 3 ] m , and R represents a hydrogen atom or a hydrocarbon group that may have a substituent group such as an epoxy and oxetanyl, R 1 represents a 1-5C alkyl group, n is an integer of 0-2, R 2 represents a m-valent group selected from an alicyclic hydrocarbon group, an aromatic hydrocarbon group, and a heterocyclic group, R 3 represents a methylene group or a 2-5C alkylene group, and m is an integer of 1-10. COPYRIGHT: (C)2009,JPO&INPIT