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    Electronic component built-in substrate and method of manufacturing the same
    43.
    发明专利
    Electronic component built-in substrate and method of manufacturing the same 有权
    电子元件内置衬底及其制造方法

    公开(公告)号：JP2014082353A

    公开(公告)日：2014-05-08

    申请号：JP2012229704

    申请日：2012-10-17

    Applicant: Tdk Corp ,  Tdk株式会社

    Inventor： TSUYUTANI KAZUTOSHI

    IPC: H05K3/46

    CPC classification number: H05K1/185 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92244 ,  H01L2924/15313 ,  H05K1/115 ,  H05K3/30 ,  H05K3/42 ,  H05K2201/09727 ,  H05K2201/09854 ,  H05K2203/1469 ,  Y10T29/49146

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic component built-in substrate capable of achieving high performance.SOLUTION: An electronic component built-in substrate includes a resin substrate 110 having substrate wiring layers 121 to 123, and a semiconductor IC 200 embedded in the resin substrate 110. The resin substrate 110 has a plurality of via holes 143a exposing a plurality of external electrodes 230 provided on the semiconductor IC 200, and a plurality of via conductors 143 embedded in the plurality of via holes 143a and connecting the substrate wiring layer 123 and the external electrodes 230. At least some of the plurality of via holes 143a have different shapes or different sizes from each other. According to the present invention, for example, the predetermined via conductors 143 can be low resistance, thereby providing the electronic component built-in substrate having further high performance.

    Abstract translation: 要解决的问题：提供能够实现高性能的电子部件内置基板。解决方案：电子部件内置基板包括具有基板布线层121至123的树脂基板110和嵌入在该基板布线层中的半导体IC 200 树脂基板110具有暴露设置在半导体IC 200上的多个外部电极230的多个通孔143a和嵌入在多个通孔143a中的多个通孔导体143，并且将基板布线层 123和外部电极230.多个通孔143a中的至少一些具有彼此不同的形状或不同的尺寸。 根据本发明，例如，预定的通路导体143可以是低电阻，从而提供具有更高性能的电子部件内置基板。

    Wiring board
    44.
    发明专利
    Wiring board 有权
    接线板

    公开(公告)号：JP2014082276A

    公开(公告)日：2014-05-08

    申请号：JP2012228210

    申请日：2012-10-15

    Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    Inventor： MACHIDA TAKEMI ,  TAKIZAWA DAISUKE

    IPC: H05K3/46

    CPC classification number: H05K1/181 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/1531 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09854 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring board which can inhibit revolution of an electronic component arranged in a through hole.SOLUTION: A wiring board 20 comprises: a core substrate 21 including a through hole 22 formed to pierce the core substrate 21 in a thickness direction; a chip capacitor 50 arranged in the through hole 22; projections 23 respectively formed on inner surfaces of the through hole 22 so as to contact connection terminals 52, respectively, each of which covers a lateral face 51A of a capacitor body 51 of the chip capacitor 50; projections 24 respectively projecting from the inner surfaces of the through hole 22 toward lateral faces 51B of the capacitor body 51, respectively, each of which is exposed from the connection terminal 52; and an insulating material 25 filled between the inner surface of the through hole 22 and the chip capacitor 50. A distance in a short direction of the capacitor body 51 among distances between tips 24A of the pair of projections 24 respectively formed on two opposed inner surfaces of the through hole 22 is set longer than a width of the capacitor body 51 in the short direction and shorter than a diagonal line of the lateral face 51A.

    Abstract translation: 要解决的问题：提供一种可以抑制布置在通孔中的电子部件的旋转的布线板。解决方案：布线板20包括：芯基板21，其包括形成为将芯基板21刺穿在基板21中的通孔22 厚度方向; 布置在通孔22中的片状电容器50; 分别形成在通孔22的内表面上的突起23分别接触连接端子52，每个连接端子覆盖片式电容器50的电容器主体51的侧面51A; 突起24分别从通孔22的内表面朝向电容器主体51的侧面51B突出，每个突起24从连接端子52露出; 以及填充在通孔22的内表面和片状电容器50之间的绝缘材料25.在分别形成在两个相对的内表面上的一对突起24的尖端24A之间的距离内，电容器主体51的短边方向的距离 通孔22的长度比电容器主体51的短边方向的宽度长，并且比侧面51A的对角线短。

    Wiring board
    45.
    发明专利
    Wiring board 有权
    接线板

    公开(公告)号：JP2014072205A

    公开(公告)日：2014-04-21

    申请号：JP2012214437

    申请日：2012-09-27

    Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    Inventor： TAKIZAWA DAISUKE

    IPC: H05K3/46 ,  H01L23/12

    CPC classification number: H05K1/184 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/1531 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09854 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: PROBLEM TO BE SOLVED: To reduce failure of a wiring board.SOLUTION: A core substrate 21 has a through hole 22 for mounting a chip capacitor 50. The chip capacitor 50 has a capacitor body 51 formed into a rectangular parallelepiped shape, two connection terminals 52, 53 formed on both longitudinal ends of the capacitor body 51, and a coating resin 54 coating surfaces thereof. Plural protrusion parts 23a-24b are formed on an inner face of the through hole 22 opposed to an end face and a side face of the chip capacitor 50. The protrusion parts 23a-24b are formed to project toward the coating resin 54 of the chip capacitor 50. The size of the protrusion parts 24a, 24b (a distance between tips) is set shorter than the length of the chip capacitor 50. The size of the protrusion parts 24a, 24b (a distance between tips) is set shorter than the width of the chip capacitor 50. The chip capacitor 50 is supported by the protrusion parts 23a-24b formed on the inner face of the through hole 22.

    Abstract translation: 要解决的问题：减少布线板的故障。解决方案：芯基板21具有用于安装片状电容器50的通孔22.片式电容器50具有形成为长方体形状的电容器主体51，两个连接端子 形成在电容器主体51的两个纵向端部上的52,53和涂覆树脂54的涂覆表面。 多个突出部23a-24b形成在贯通孔22的与芯片电容器50的端面和侧面相对的内面上。突起部23a〜24b形成为向芯片的涂布树脂54突出 突出部分24a，24b的尺寸（尖端之间的距离）被设定为短于片状电容器50的长度。突出部分24a，24b的尺寸（尖端之间的距离）被设定为短于片状电容器50的长度。 片状电容器50的宽度。片状电容器50由形成在通孔22的内表面上的突出部23a-24b支撑。

    Wiring board
    46.
    发明专利
    Wiring board 审中-公开
    接线板

    公开(公告)号：JP2014067741A

    公开(公告)日：2014-04-17

    申请号：JP2012209735

    申请日：2012-09-24

    Applicant: Shinko Electric Ind Co Ltd ,  新光電気工業株式会社

    Inventor： TAKIZAWA DAISUKE

    IPC: H05K3/46 ,  H01L21/60 ,  H01L23/12

    CPC classification number: H05K1/0271 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H05K1/185 ,  H05K3/0026 ,  H05K3/005 ,  H05K3/303 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/09072 ,  H05K2201/09854 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: PROBLEM TO BE SOLVED: To reduce defects of a wiring board.SOLUTION: A core substrate 21 has a through hole 22 in which a chip capacitor 50 is mounted. The through hole 22 has protrusions 23 and 24 formed on inner surfaces thereof facing both end surfaces of the chip capacitor 50. The protrusions 23 and 24 are formed so as to protrude toward connection terminals 52 and 53 of the chip capacitor 50. The size (distance between tips) of the protrusions 23 and 24 is set shorter than the length of the chip capacitor 50. The chip capacitor 50 is supported by the protrusions 23 and 24 formed on the inner surfaces of the through hole 22.

    Abstract translation: 要解决的问题：减少布线板的缺陷。解决方案：芯基板21具有安装有片式电容器50的通孔22。 贯通孔22具有形成在与芯片电容器50的两端面对置的内表面上的突起23,24。突起23,24形成为向片状电容器50的连接端子52,53突出。 突起23和24的尖端之间的距离被设定为短于片状电容器50的长度。片状电容器50由形成在通孔22的内表面上的突起23和24支撑。

    Flexible printed wiring board and apparatus equipped with the same
    47.
    发明专利
    Flexible printed wiring board and apparatus equipped with the same 审中-公开
    柔性印刷线路板及其设备

    公开(公告)号：JP2014063975A

    公开(公告)日：2014-04-10

    申请号：JP2013055716

    申请日：2013-03-18

    Applicant: Nidec Copal Corp ,  日本電産コパル株式会社

    Inventor： NAGANO SHUNICHI ,  TAKAHASHI SHIGEMI

    IPC: H05K1/02 ,  H05K7/14

    CPC classification number: H05K1/028 ,  G03B2217/002 ,  H05K1/0259 ,  H05K1/09 ,  H05K1/118 ,  H05K2201/0326 ,  H05K2201/0355 ,  H05K2201/09854

    Abstract: PROBLEM TO BE SOLVED: To provide a flexible printed wiring board which is mounted on a columnar projection part erected on an apparatus by fitting a hole to the columnar projection part, and also to provide the apparatus equipped with the same.SOLUTION: A hole 26 formed in a flexible printed wiring board FPC is formed of five first edge parts which are formed in a convex shape toward the center of the hole in a curve, and five second edge parts which are formed therebetween in a recessed shape toward the center of the hole in the curve. On the other hand, a columnar projection part 5 erected on an apparatus has a columnar shape. Then, when the flexible printed wiring board FPC is mounted on the columnar projection part 5, the hole 26 is fitted to the columnar projection part 5 by making regions adjacent to the first edge parts leaned toward the tip side of the columnar projection part 5.

    Abstract translation: 要解决的问题：提供一种柔性印刷线路板，其通过在柱状突出部上安装孔而安装在竖立在设备上的柱状突起部分上，并且还提供配备有它的装置。解决方案：孔26 形成在柔性印刷布线板FPC中的五个第一边缘部分形成为沿着弯曲的孔的中心形成为凸形的五个第一边缘部分和形成在其间的凹陷形状的五个第二边缘部分 曲线中的孔。 另一方面，竖立在装置上的柱状突起部5具有柱状。 然后，当柔性印刷线路板FPC安装在柱状突起部5上时，通过使靠近与柱状突起部5的前端侧倾斜的第一边缘部相邻的区域将孔26嵌合在柱状突起部5上。

    Wiring board and method of manufacturing the same
    49.
    发明专利
    Wiring board and method of manufacturing the same 审中-公开
    接线板及其制造方法

    公开(公告)号：JP2013191658A

    公开(公告)日：2013-09-26

    申请号：JP2012055509

    申请日：2012-03-13

    Applicant: Micronics Japan Co Ltd ,  株式会社日本マイクロニクス

    Inventor： HASEGAWA KEN

    IPC: H05K3/46 ,  H01L21/66

    CPC classification number: H05K3/0073 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4679 ,  H05K2201/0154 ,  H05K2201/09854

    Abstract: PROBLEM TO BE SOLVED: To provide a wiring board which is hard to cause disconnection without increasing such a large electric resistance as in the prior art in a wiring path connected to a conductive part even if arrangement of an etching mask for selectively removing a seed layer covering the conductive part exposed on an insulation film is displaced from a predetermined point, and also to provide a method of manufacturing the wiring board.SOLUTION: As an exposure mask for forming an etching mask for selectively removing a seed layer covering a conductive part exposed on an insulation film, the exposure mask which is provided with a contour having two sides along two straight lines approaching to each other as an opening area of the exposure mask extends from a center part of the opening area in the extending direction of the wiring path is used.

    Abstract translation: 要解决的问题：即使布置用于选择性地去除种子层的蚀刻掩模，提供一种在与导电部分连接的布线路径中不增加如现有技术中那样大的电阻而难以断开的布线板 覆盖在绝缘膜上露出的导电部件从预定点位移，并且还提供制造布线板的方法。解决方案：作为用于形成用于选择性地去除覆盖导电部件的种子层的蚀刻掩模的曝光掩模 在绝缘膜上，设置有具有沿着作为曝光掩模的开口区域彼此接近的两条直线的具有两侧的轮廓的曝光掩模从布线路径的延伸方向上的开口区域的中心部分延伸 用来。

    配線板及びその製造方法
    50.
    发明专利
    配線板及びその製造方法 有权

    公开(公告)号：JPWO2011122246A1

    公开(公告)日：2013-07-08

    申请号：JP2012508173

    申请日：2011-03-04

    Applicant: イビデン株式会社

    Inventor： 英之 脇田 ,  英之 脇田 ,  章秀 川口 ,  章秀 川口

    IPC: H05K3/46 ,  H05K1/11 ,  H05K3/40

    CPC classification number: H05K3/4644 ,  H05K1/185 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09854

    Abstract: 配線板では、コア絶縁層(10a)の少なくとも一側に、導体層(11b、31)と層間絶縁層(30a)とが交互に積層されている。コア絶縁層(10a)及び層間絶縁層(30a)は、それぞれ孔(12a、32a)にめっきが充填されてなる接続導体(12、32)を有する。コア絶縁層の接続導体(12)及び層間絶縁層の接続導体(32)は、積重される。コア絶縁層上及び層間絶縁層上には、それぞれ金属箔(13a、33a)と、金属箔上に形成されためっき(13b、33b)と、から構成される接続導体のランド(13、33)が形成される。コア絶縁層上のランドを構成する金属箔(13a)は、少なくともコア絶縁層上の層間絶縁層上のランドを構成する金属箔(33a)よりも厚い。

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