-
公开(公告)号：JP6104518B2
公开(公告)日：2017-03-29
申请号：JP2012102954
申请日：2012-04-27
申请人： 日産自動車株式会社 , 富士電機株式会社 , サンケン電気株式会社 , 株式会社コーム技研
CPC分类号： H01L24/83 , B23K37/0426 , H01L24/75 , H05K13/0465 , H05K3/34 , H01L2224/04026 , H01L2224/05082 , H01L2224/05155 , H01L2224/05166 , H01L2224/05639 , H01L2224/2732 , H01L2224/291 , H01L2224/29118 , H01L2224/29144 , H01L2224/75101 , H01L2224/75305 , H01L2224/7531 , H01L2224/75314 , H01L2224/75315 , H01L2224/75317 , H01L2224/7532 , H01L2224/75756 , H01L2224/7598 , H01L2224/75981 , H01L2224/83022 , H01L2224/83048 , H01L2224/83075 , H01L2224/83101 , H01L2224/832 , H01L2224/83211 , H01L2224/83444 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/97 , H01L24/05 , H01L24/29 , H01L24/97 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1037 , H01L2924/1067 , H01L2924/12032 , H01L2924/12036 , H01L2924/13062 , H01L2924/13091 , H01L2924/15724 , H01L2924/15747 , H01L2924/15787 , H01L2924/3656 , H05K2203/0195 , H05K2203/0278 , H05K3/3431
-
公开(公告)号：JP6132716B2
公开(公告)日：2017-05-24
申请号：JP2013187709
申请日：2013-09-10
申请人： 株式会社東芝
IPC分类号： H01B1/00 , H01B5/14 , B22F9/00 , C09D5/24 , C09D201/00 , C09D7/12 , H05K3/34 , H01L21/60 , H01L23/12 , H01B1/22
CPC分类号： B23K35/025 , B22F1/0003 , B22F1/0018 , B22F1/0074 , B23K35/24 , B23K35/262 , B23K35/264 , B23K35/282 , B23K35/286 , B23K35/30 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/3033 , B23K35/32 , B23K35/322 , B23K35/325 , B23K35/3601 , B23K35/362 , C22C1/0491 , C22C5/06 , H01L21/4867 , H01L23/3737 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , B22F2999/00 , H01L2224/0381 , H01L2224/04026 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/27003 , H01L2224/271 , H01L2224/2732 , H01L2224/2741 , H01L2224/2744 , H01L2224/29006 , H01L2224/29294 , H01L2224/29313 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29369 , H01L2224/29371 , H01L2224/29372 , H01L2224/29373 , H01L2224/29376 , H01L2224/29378 , H01L2224/2938 , H01L2224/2949 , H01L2224/32225 , H01L2224/32245 , H01L2224/325 , H01L2224/32503 , H01L2224/32507 , H01L2224/83075 , H01L2224/83192 , H01L2224/832 , H01L2224/83203 , H01L2224/83205 , H01L2224/8322 , H01L2224/83411 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/83464 , H01L2224/83469 , H01L2224/8384 , H01L24/05 , H01L2924/01102 , H01L2924/10253 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1067 , H01L2924/12044 , H01L2924/15787
-
3.发明专利
公开(公告)号：JP2013232472A
公开(公告)日：2013-11-14
申请号：JP2012102954
申请日：2012-04-27
申请人： Nissan Motor Co Ltd , 日産自動車株式会社 , Fuji Electric Co Ltd , 富士電機株式会社 , Sanken Electric Co Ltd , サンケン電気株式会社 , Comb Giken Co Ltd , 株式会社コーム技研
发明人： TANIMOTO SATOSHI , ZUSHI YUSUKE , MURAKAMI YOSHINORI , MATSUI KOHEI , SATO SHINJI , FUKUSHIMA YU
IPC分类号： H01L21/52
CPC分类号： H01L24/83 , B23K37/0426 , H01L24/05 , H01L24/29 , H01L24/75 , H01L24/97 , H01L2224/04026 , H01L2224/05082 , H01L2224/05155 , H01L2224/05166 , H01L2224/05639 , H01L2224/2732 , H01L2224/291 , H01L2224/29118 , H01L2224/29144 , H01L2224/75101 , H01L2224/75305 , H01L2224/7531 , H01L2224/75314 , H01L2224/75315 , H01L2224/75317 , H01L2224/7532 , H01L2224/75756 , H01L2224/7598 , H01L2224/75981 , H01L2224/83022 , H01L2224/83048 , H01L2224/83075 , H01L2224/83101 , H01L2224/832 , H01L2224/83211 , H01L2224/83444 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/97 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1037 , H01L2924/1067 , H01L2924/12032 , H01L2924/12036 , H01L2924/13062 , H01L2924/13091 , H01L2924/15724 , H01L2924/15747 , H01L2924/15787 , H01L2924/3656 , H05K3/34 , H05K3/3431 , H05K13/0465 , H05K2203/0195 , H05K2203/0278 , H01L2924/00 , H01L2924/0542 , H01L2924/0103 , H01L2924/00014 , H01L2924/01042 , H01L2924/01032 , H01L2924/01014 , H01L2924/01013 , H01L2224/05655 , H01L2224/83 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To reduce generation of voids, and to avoid generation of failures caused by thermal damage at a solder bonding step.SOLUTION: A thermal insulation load jig 11 comprises: a thermal insulator 17 installed on a semiconductor chip 13 that is in a state that a solder material 14 is sandwiched after the solder material 14 having a melting point or a solidus line temperature within a range from a heat-resistant temperature of the semiconductor chip 13 to 100°C or less is sandwiched between a circuit board 12 and the semiconductor chip 13; and a metal weight 16 arranged on the thermal insulator 17 and that applies a load to the semiconductor chip 13 while the solder material 14 is melted and solidified.
摘要翻译： 要解决的问题：减少空隙的产生，并避免产生由焊接接合步骤引起的热损伤引起的故障。解决方案：绝热负载夹具11包括：安装在半导体芯片13上的绝热体17，其位于 在熔融点或固相线温度在从半导体芯片13的耐热温度到100℃以下的范围内的焊料14之间夹持焊料14的状态夹在电路板12 和半导体芯片13; 以及布置在绝热体17上并在焊料14融化固化的同时对半导体芯片13施加载荷的金属重物16。
-
公开(公告)号：JP2015056238A
公开(公告)日：2015-03-23
申请号：JP2013187709
申请日：2013-09-10
申请人： 株式会社東芝 , Toshiba Corp
IPC分类号： H01B1/22 , B22F9/00 , C09D5/24 , C09D7/12 , C09D201/00 , H01B1/00 , H01B5/14 , H01L21/60 , H01L23/12 , H05K3/34
CPC分类号： B23K35/025 , B22F1/0003 , B22F1/0018 , B22F1/0074 , B22F2999/00 , B23K35/24 , B23K35/262 , B23K35/264 , B23K35/282 , B23K35/286 , B23K35/30 , B23K35/3006 , B23K35/3013 , B23K35/302 , B23K35/3033 , B23K35/32 , B23K35/322 , B23K35/325 , B23K35/3601 , B23K35/362 , C22C1/0491 , C22C5/06 , H01L21/4867 , H01L23/3737 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/0381 , H01L2224/04026 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/27003 , H01L2224/271 , H01L2224/2732 , H01L2224/2741 , H01L2224/2744 , H01L2224/29006 , H01L2224/29294 , H01L2224/29313 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/2936 , H01L2224/29364 , H01L2224/29369 , H01L2224/29371 , H01L2224/29372 , H01L2224/29373 , H01L2224/29376 , H01L2224/29378 , H01L2224/2938 , H01L2224/2949 , H01L2224/32225 , H01L2224/32245 , H01L2224/325 , H01L2224/32503 , H01L2224/32507 , H01L2224/83075 , H01L2224/83192 , H01L2224/832 , H01L2224/83203 , H01L2224/83205 , H01L2224/8322 , H01L2224/83411 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/83464 , H01L2224/83469 , H01L2224/8384 , H01L2924/01102 , H01L2924/10253 , H01L2924/10254 , H01L2924/10272 , H01L2924/1033 , H01L2924/1067 , H01L2924/12044 , H01L2924/15787 , H01L2924/0543 , H01L2924/01031 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , B22F1/0022
摘要： 【課題】高温環境下においても劣化が抑制された硬化物を得ることができる金属粒子ペースト提供することである。【解決手段】実施形態の金属粒子ペーストは、極性溶媒と、前記極性溶媒中に分散され、第一の金属を含む粒子とを含有する。前記極性溶媒には、前記第一の金属とは異なる第二の金属が溶解されていることを特徴とする。【選択図】なし
摘要翻译： 要解决的问题：提供一种能够获得即使在高温环境下也能够降低劣化的固化物质的金属颗粒糊。溶液：本实施方案的金属颗粒糊包含极性溶剂，分散在极性溶剂中的颗粒 并包括第一金属。 在极性溶剂中，与第一金属不同的第二金属溶解。
-
公开(公告)号：JP3842548B2
公开(公告)日：2006-11-08
申请号：JP2000377684
申请日：2000-12-12
申请人： 富士通株式会社
IPC分类号： H01L23/12 , H01L23/52 , H01L21/3205 , H01L21/60 , H01L23/31 , H01L23/48 , H01L23/485
CPC分类号： H01L24/13 , H01L21/565 , H01L23/3107 , H01L23/3114 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/94 , H01L2224/02166 , H01L2224/0231 , H01L2224/02313 , H01L2224/02319 , H01L2224/0233 , H01L2224/02333 , H01L2224/0236 , H01L2224/024 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/0558 , H01L2224/05644 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/13021 , H01L2224/131 , H01L2224/16 , H01L2224/274 , H01L2224/27436 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/1067 , H01L2924/12042 , H01L2924/3011 , H01L2224/13099 , H01L2224/05552 , H01L2924/00
-
-
-
-
搜索结果
5 条记录 (耗时 0.009 秒)
