摘要:
PROBLEM TO BE SOLVED: To provide a paste transfer unit which allows for automatic and accurate measurement of the film thickness of paste in a transfer area, without requiring a complicated measurement work, and to provide an electronic component mounting device and a film thickness measurement method.SOLUTION: In the film thickness measurement of a coating film 25a of flux 25, i.e., a bonding paste deposited on a transfer stage 24 of a paste transfer unit 7, thickness of the coating film 25a in a transfer area 26 is measured through a translucent member 51 by light interference method, by means of an optical film thickness measurement sensor 53 disposed below the transfer stage 24. Consequently, the film thickness of the flux 25 in the transfer area 26 can be measured automatically and accurately without requiring a complicated measurement work.
摘要:
PROBLEM TO BE SOLVED: To provide a method for manufacturing tight pitch, flip chip integrated circuit packages.SOLUTION: A flip chip packaging method for attaching a die to a package substrate includes dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. The die has conductive bumps, and said step of dipping the die into the solder paste comprises dipping the conductive bumps into the solder paste. The package substrate has pads, and said step of reflowing the solder paste to attach the die to the package substrate comprises soldering the conductive bumps to the pads. Other embodiments are described and claimed.
摘要:
PROBLEM TO BE SOLVED: To provide a semiconductor device having columnar electrodes which exhibits a superior durability to a thermal stress. SOLUTION: The semiconductor device is provided with a semiconductor element 14 having a plurality of electrode pads 12, a plurality of columnar electrodes 16 connected with the plurality of the pads 12, a resin layer 18 covering the element 14 and the electrodes 16, external terminals 20 arranged on the surface of the layer 18, in such a way that the terminals 20 are electrically connected with the columnar electrodes 16, and re-wiring conductor portions 50 provided between the electrode pads 12 of the semiconductor element and the columnar electrodes 16, the resin layer 18 being made of relatively soft spin-coated resin. COPYRIGHT: (C)2010,JPO&INPIT
摘要:
After preliminary supply of an equal amount of solder to all of stud-bumps of a semiconductor part, establishing solder connection between the stud-bumps and connecting pads of a circuit substrate. A method for mounting a semiconductor part on a circuit substrate is provided, which includes the steps of preparing the semiconductor part (10) having a surface thereof provided with a plurality of stud-bumps (12), preparing a solder substrate (13) having a surface thereof on which solid-solders (14) corresponding to respective of the plurality of stud-bumps (12) are arranged, preparing the circuit substrate (20) having a surface thereof provided with connecting pads (21) corresponding to respective of the plurality of stud-bumps, attaching, to respective tip ends of the plurality of stud bumps, the corresponding solid-solders on the solder substrate, separating the solid-solders attached to the tip ends of the stud-bumps from the solder substrate, contacting the solid-solder attached to respective of the tip ends of the stud-bumps with the corresponding connecting pads, and melting the solid-solders contacted with the corresponding connecting pads thereby establishing solder connection between respective of the stud-bumps and the corresponding connecting pads.
摘要:
PROBLEM TO BE SOLVED: To provide a semiconductor package having a bump ball which suppresses formation of a reaction intermediate product of double layers causing stress concentration upon bump formation and mutual connection of such packages. SOLUTION: The semiconductor package includes a bump ball 30 as an external connection terminal. The bump ball 30 includes: a core layer 31 containing copper, copper alloy, aluminum, aluminum alloy, or a combination thereof; and a shell layer 32 surrounding the core layer 31 and containing tin, tin alloy, or a combination thereof. COPYRIGHT: (C)2010,JPO&INPIT
摘要:
PROBLEM TO BE SOLVED: To provide a conductive bump and its manufacturing method capable of connecting at a narrow pitch with small pressing force, and to provide an electronic component mounting structure using the same, and its manufacturing method. SOLUTION: The conductive bump 1 formed on a surface 12a of an electrode terminal 12 of an electronic component 10 is provided with at least an elastic bump core 14 and a conductive paste 16 held around the bump core 14. The bump core 14 is provided with a conductive paste capturing part 18. COPYRIGHT: (C)2009,JPO&INPIT