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公开(公告)号：KR1020150081368A
公开(公告)日：2015-07-13
申请号：KR1020157016027
申请日：2014-02-28
申请人： 세키스이가가쿠 고교가부시키가이샤
CPC分类号： H01B1/22 , B22F1/025 , B23K35/0244 , B23K35/262 , C22C13/00 , C23C18/1635 , C23C18/1651 , C23C18/1653 , C25D5/12 , H01B1/02 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/27003 , H01L2224/271 , H01L2224/27312 , H01L2224/2732 , H01L2224/27334 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29411 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29481 , H01L2224/29487 , H01L2224/32227 , H01L2224/83191 , H01L2224/834 , H01L2224/83447 , H01L2224/83815 , H01L2224/83851 , H01L2924/3512 , H01L2924/3651 , H05K3/323 , H05K2201/0218 , H05K2201/0221 , H05K2203/0425 , H01L2924/00014 , H01L2924/04941 , H01L2924/05342 , H01L2924/01015 , H01L2924/01005 , H01L2924/014 , H01L2924/01047 , H01L2924/01051 , H01L2924/01083 , H01L2924/01049 , H01L2924/01032 , H01L2924/01013 , H01L2924/0103 , H01L2924/01028 , H01L2924/01027 , H01L2924/01029
摘要： 본발명은, 낙하등에의한충격이가해져도전극과그 도전성미립자의접속계면의파괴에의한단선이잘 발생하지않고, 가열과냉각을반복해서받아도잘 피로되지않는도전성미립자, 그도전성미립자를사용하여이루어지는이방성도전재료및 도전접속구조체를제공하는것을목적으로한다. 본발명은, 수지또는금속으로이루어지는코어입자의표면에적어도도전금속층, 배리어층, 구리층및 주석을함유하는땜납층이이 순서로적층된도전성미립자로서, 상기구리층과땜납층이직접접하고있고, 상기땜납층중에함유되는주석에대한상기땜납층에직접접하는구리층에있어서의구리의비율이 0.5 ∼ 5 중량% 인도전성미립자이다.
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公开(公告)号：KR1020140045328A
公开(公告)日：2014-04-16
申请号：KR1020137023157
申请日：2012-02-03
申请人： 데쿠세리아루즈 가부시키가이샤 , 소니 주식회사
CPC分类号： H01B1/02 , H01L24/29 , H01L2224/2939 , H01L2224/29411 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/32225 , H01L2924/15788 , H01L2924/00014 , H01L2924/00
摘要： 본 발명은 미세 회로에 있어서의 접속 신뢰성을 향상시키는 도전성 입자 및 이를 이용한 이방성 도전 재료를 제공한다. 수지 입자 (11)과, 수지 입자 표면을 피복하는 무전해 금속 도금층 (12)와, 최외층을 형성하는 Au를 제외한 금속 스퍼터층 (13)을 갖는 도전성 입자를 이용한다. 최외층에 딱딱한 금속 스퍼터층 (13)이 형성되어 있기 때문에, 배선에 도전성 입자를 침식시킬 수 있어, 높은 접속 신뢰성을 얻을 수 있다.
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公开(公告)号：KR101561418B1
公开(公告)日：2015-10-16
申请号：KR1020157016027
申请日：2014-02-28
申请人： 세키스이가가쿠 고교가부시키가이샤
CPC分类号： H01B1/22 , B22F1/025 , B23K35/0244 , B23K35/262 , C22C13/00 , C23C18/1635 , C23C18/1651 , C23C18/1653 , C25D5/12 , H01B1/02 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/27003 , H01L2224/271 , H01L2224/27312 , H01L2224/2732 , H01L2224/27334 , H01L2224/2929 , H01L2224/29339 , H01L2224/29347 , H01L2224/29355 , H01L2224/2939 , H01L2224/294 , H01L2224/29411 , H01L2224/29439 , H01L2224/29444 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29481 , H01L2224/29487 , H01L2224/32227 , H01L2224/83191 , H01L2224/834 , H01L2224/83447 , H01L2224/83815 , H01L2224/83851 , H01L2924/3512 , H01L2924/3651 , H05K3/323 , H05K2201/0218 , H05K2201/0221 , H05K2203/0425 , H01L2924/00014 , H01L2924/04941 , H01L2924/05342 , H01L2924/01015 , H01L2924/01005 , H01L2924/014 , H01L2924/01047 , H01L2924/01051 , H01L2924/01083 , H01L2924/01049 , H01L2924/01032 , H01L2924/01013 , H01L2924/0103 , H01L2924/01028 , H01L2924/01027 , H01L2924/01029
摘要： 본발명은, 낙하등에의한충격이가해져도전극과그 도전성미립자의접속계면의파괴에의한단선이잘 발생하지않고, 가열과냉각을반복해서받아도잘 피로되지않는도전성미립자, 그도전성미립자를사용하여이루어지는이방성도전재료및 도전접속구조체를제공하는것을목적으로한다. 본발명은, 수지또는금속으로이루어지는코어입자의표면에적어도도전금속층, 배리어층, 구리층및 주석을함유하는땜납층이이 순서로적층된도전성미립자로서, 상기구리층과땜납층이직접접하고있고, 상기땜납층중에함유되는주석에대한상기땜납층에직접접하는구리층에있어서의구리의비율이 0.5 ∼ 5 중량% 인도전성미립자이다.
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公开(公告)号：KR1020110052880A
公开(公告)日：2011-05-19
申请号：KR1020090109587
申请日：2009-11-13
申请人： 삼성전자주식회사
IPC分类号： H01L21/60
CPC分类号： H05K3/323 , H01L24/13 , H01L24/81 , H01L24/83 , H01L24/91 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/1318 , H01L2224/16225 , H01L2224/2929 , H01L2224/2939 , H01L2224/29444 , H01L2224/29455 , H01L2224/29457 , H01L2224/2946 , H01L2224/2948 , H01L2224/2949 , H01L2224/2989 , H01L2224/32225 , H01L2224/73204 , H01L2224/81903 , H01L2224/83851 , H01L2224/9211 , H01L2924/01006 , H01L2924/01027 , H01L2924/01033 , H01L2924/01042 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/07811 , H01L2924/15311 , H05K2201/083 , H05K2201/10674 , H05K2203/104 , H01L2924/00 , H01L2924/00014
摘要： PURPOSE: A flip chip package and a manufacturing method thereof are provided to improve electrical connection reliability between pads by arranging conductive magnetic particles between a conductive magnetic bump and a pad. CONSTITUTION: A semiconductor chip(110) includes a plurality of first pads(112). A package substrate(120) is arranged on the lower side of the semiconductor chip. A conductive magnetic bump is arranged between the first pad and the second pad. An anisotropic conductive member(140) is filled between the semiconductor chip and the package substrate. An external connection terminal(150) is mounted on the lower side of the package substrate.
摘要翻译： 目的：提供一种倒装芯片封装及其制造方法，以通过在导电磁性凸块和焊盘之间布置导电磁性颗粒来改善焊盘之间的电连接可靠性。 构成：半导体芯片（110）包括多个第一焊盘（112）。 封装基板（120）布置在半导体芯片的下侧。 在第一焊盘和第二焊盘之间布置导电磁性凸块。 各向异性导电构件（140）填充在半导体芯片和封装衬底之间。 外部连接端子（150）安装在封装基板的下侧。
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公开(公告)号：KR101614675B1
公开(公告)日：2016-04-21
申请号：KR1020157021917
申请日：2014-09-12
申请人： 세키스이가가쿠 고교가부시키가이샤
CPC分类号： H01R13/03 , H01B1/22 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0568 , H01L2224/05684 , H01L2224/2732 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29338 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29366 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29401 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29416 , H01L2224/29417 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29471 , H01L2224/29486 , H01L2224/29487 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32227 , H01L2224/83101 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8348 , H01L2224/83484 , H01L2224/83851 , H01L2224/83855 , H01L2224/83862 , H01L2224/83877 , H01L2924/15788 , H01R4/04 , H05K3/323 , H05K3/361 , H05K2201/0218 , H05K2201/0221 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05342 , H01L2924/0549 , H01L2924/0532 , H01L2924/01056 , H01L2924/0534 , H01L2924/01022 , H01L2924/01006 , H01L2924/01014 , H01L2924/01032 , H01L2924/01048 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2924/01015 , H01L2924/01005 , H01L2924/0781 , H01L2924/04563 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012
摘要： 본발명은전극간을전기적으로접속한경우에, 접속저항을낮게할 수있는도전성입자를제공한다. 본발명에따른도전성입자(1)는기재입자(2)와, 기재입자(2)의표면상에배치된도전부(3)를구비하고, 도전부(3)가외표면에복수의돌기(3a)를갖고, 도전부(3)가결정구조를갖고, 도전부(3)에있어서의돌기(3a)가있는부분과돌기(3a)가없는부분에서결정구조가연속하고있다.
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公开(公告)号：KR1020150099873A
公开(公告)日：2015-09-01
申请号：KR1020157021917
申请日：2014-09-12
申请人： 세키스이가가쿠 고교가부시키가이샤
CPC分类号： H01R13/03 , H01B1/22 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05611 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0568 , H01L2224/05684 , H01L2224/2732 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/29338 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29366 , H01L2224/29386 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29401 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29416 , H01L2224/29417 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29471 , H01L2224/29486 , H01L2224/29487 , H01L2224/2949 , H01L2224/29493 , H01L2224/29499 , H01L2224/32227 , H01L2224/83101 , H01L2224/83203 , H01L2224/83411 , H01L2224/83424 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8348 , H01L2224/83484 , H01L2224/83851 , H01L2224/83855 , H01L2224/83862 , H01L2224/83877 , H01L2924/15788 , H01R4/04 , H05K3/323 , H05K3/361 , H05K2201/0218 , H05K2201/0221 , H01L2924/00 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/05342 , H01L2924/0549 , H01L2924/0532 , H01L2924/01056 , H01L2924/0534 , H01L2924/01022 , H01L2924/01006 , H01L2924/01014 , H01L2924/01032 , H01L2924/01048 , H01L2924/0543 , H01L2924/01049 , H01L2924/0544 , H01L2924/0105 , H01L2924/01015 , H01L2924/01005 , H01L2924/0781 , H01L2924/04563 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012
摘要： 본 발명은 전극 간을 전기적으로 접속한 경우에, 접속 저항을 낮게 할 수 있는 도전성 입자를 제공한다. 본 발명에 따른 도전성 입자(1)는 기재 입자(2)와, 기재 입자(2)의 표면 상에 배치된 도전부(3)를 구비하고, 도전부(3)가 외표면에 복수의 돌기(3a)를 갖고, 도전부(3)가 결정 구조를 갖고, 도전부(3)에 있어서의 돌기(3a)가 있는 부분과 돌기(3a)가 없는 부분에서 결정 구조가 연속하고 있다.
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公开(公告)号：KR1020150109322A
公开(公告)日：2015-10-01
申请号：KR1020157002632
申请日：2014-01-16
申请人： 세키스이가가쿠 고교가부시키가이샤
CPC分类号： H01L24/29 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/04026 , H01L2224/05647 , H01L2224/16225 , H01L2224/16227 , H01L2224/2732 , H01L2224/27436 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/2939 , H01L2224/29401 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29416 , H01L2224/29417 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29471 , H01L2224/29487 , H01L2224/32227 , H01L2224/73204 , H01L2224/81193 , H01L2224/81447 , H01L2224/81903 , H01L2224/83203 , H01L2224/83447 , H01L2224/83851 , H01L2224/83862 , H01L2924/00011 , H01L2924/01322 , H01L2924/15788 , H05K3/323 , H05K2201/0218 , H01L2924/00014 , H01L2924/0665 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/01049 , H01L2924/0105 , H01L2924/01032 , H01L2924/01048 , H01L2924/0543 , H01L2924/00 , H01L2224/81805
摘要： 본발명은빠르게경화시킬수 있으며, 구리전극을접속한경우에도도통성을높일수 있는전자부품용경화성조성물을제공한다. 본발명에관한전자부품용경화성조성물은, 구리전극의접속에사용된다. 본발명에관한전자부품용경화성조성물은, 열경화성화합물과, 잠재성경화제와, 방향족골격을갖는이미다졸화합물을포함한다.
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公开(公告)号：KR1020150063962A
公开(公告)日：2015-06-10
申请号：KR1020147033188
申请日：2013-09-30
申请人： 세키스이가가쿠 고교가부시키가이샤
发明人： 니시오까,게이조
CPC分类号： H01B1/02 , B22F1/025 , H01B1/04 , H01B1/22 , H01B1/24 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05187 , H01L2224/05611 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0568 , H01L2224/05684 , H01L2224/271 , H01L2224/2731 , H01L2224/2732 , H01L2224/27334 , H01L2224/2929 , H01L2224/29338 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29366 , H01L2224/29387 , H01L2224/2939 , H01L2224/29393 , H01L2224/29399 , H01L2224/294 , H01L2224/29401 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29414 , H01L2224/29416 , H01L2224/29417 , H01L2224/29418 , H01L2224/2942 , H01L2224/29424 , H01L2224/29438 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/2946 , H01L2224/29464 , H01L2224/29466 , H01L2224/29469 , H01L2224/29471 , H01L2224/2948 , H01L2224/29484 , H01L2224/29487 , H01L2224/2949 , H01L2224/29499 , H01L2224/32227 , H01L2224/8301 , H01L2224/83022 , H01L2224/83192 , H01L2224/83203 , H01L2224/83851 , H01L2924/15788 , H01L2924/30101 , H01L2924/365 , H01R11/01 , H01R13/03 , H05K3/323 , H05K3/361 , H05K2201/0221 , H01L2924/00012 , H01L2924/05442 , H01L2924/01006 , H01L2924/00014 , H01L2924/01014 , H01L2924/01032 , H01L2924/01048 , H01L2924/0543 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/01015 , H01L2924/01005 , H01L2924/04563 , H01L2924/04541 , H01L2924/0455 , H01L2924/01073 , H01L2924/01013 , H01L2924/01031 , H01L2924/00
摘要： 본발명은전극간을접속한경우에, 접속저항을낮게할 수있는도전성입자, 및상기도전성입자를사용한도전재료를제공한다. 본발명에따른도전성입자(1)는, 기재입자(2)와, 기재입자(2)의표면상의일부의영역에배치된도전재(4)를구비하고, 도전재(4)의재질이니켈보다도모스경도가높은재질이다.
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9.发明公开
公开(公告)号：KR1020140100488A
公开(公告)日：2014-08-14
申请号：KR1020147014904
申请日：2012-10-31
申请人： 데쿠세리아루즈 가부시키가이샤
发明人： 사이또,다까유끼
IPC分类号： H01L21/60 , H01L21/603 , H01L23/12 , H01L23/48
CPC分类号： H01L24/742 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/97 , H01L25/50 , H01L2224/16145 , H01L2224/16225 , H01L2224/16238 , H01L2224/27003 , H01L2224/27334 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29357 , H01L2224/2936 , H01L2224/29371 , H01L2224/29386 , H01L2224/29388 , H01L2224/2939 , H01L2224/29411 , H01L2224/29416 , H01L2224/29424 , H01L2224/29439 , H01L2224/29444 , H01L2224/29447 , H01L2224/29455 , H01L2224/29457 , H01L2224/2946 , H01L2224/29471 , H01L2224/29486 , H01L2224/2949 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75252 , H01L2224/75301 , H01L2224/75315 , H01L2224/7598 , H01L2224/81 , H01L2224/81193 , H01L2224/81203 , H01L2224/81903 , H01L2224/83101 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/83851 , H01L2224/83862 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2225/06565 , H01L2924/01029 , H01L2924/07802 , H01L2924/07811 , H01L2924/3512 , H01L2924/00014 , H01L2924/00012 , H01L2924/0665 , H01L2924/053 , H01L2924/00 , H01L2224/83 , H01L2924/069 , H01L2924/0635
摘要： 전자 부품의 깨짐을 방지한다. 열경화성의 접착제층(6)과 적층된 전자 부품(2), (12)이 적재되는 적재부(5)와, 전자 부품(2), (12)을 가열 가압하는 가열 가압 헤드(7)와, 전자 부품(2), (12)과 가열 가압 헤드(7)의 가압면(7a) 사이에 배치되고, 전자 부품(2), (12)의 상면을 가압하는 제1 탄성체(8)와, 전자 부품(2), (12)의 주위에 배치됨과 함께, 제1 탄성체를 지지하는 지지 부재(9)를 갖는다.
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